公开(公告)号：US06885561B1

公开(公告)日：2005-04-26

申请号：US10020380

申请日：2001-10-30

申请人： Hassan Hashemi ,  Shiaw Chang ,  Roger Forse ,  Evan McCarthy ,  Trang Trinh ,  Thuy Tran

发明人： Hassan Hashemi ,  Shiaw Chang ,  Roger Forse ,  Evan McCarthy ,  Trang Trinh ,  Thuy Tran

IPC分类号： H01L23/12 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L25/04 ,  H01L25/16 ,  H01L25/18 ,  H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2223/6688 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

摘要翻译： 用于基带，RF或IF应用的多芯片模块（MCM）包括多个具有多个不同功能的有源电路芯片。 有源电路芯片安装在基板上，该基板被配置为在单个MCM封装中提供集成子系统。 MCM包括许多功能，使其能够满足电气性能，大批量制造和低成本要求。 MCM可以采用分离接地平面来实现电子屏蔽和隔离，配置为散热片和接地连接的通孔，以及特别配置的管芯连接焊盘和暴露的接地导体焊盘。

公开(公告)号：US06377464B1

公开(公告)日：2002-04-23

申请号：US09239617

申请日：1999-01-29

申请人： Hassan Hashemi ,  Shiaw Chang ,  Roger Forse ,  Evan McCarthy ,  Trang Trinh ,  Thuy Tran

发明人： Hassan Hashemi ,  Shiaw Chang ,  Roger Forse ,  Evan McCarthy ,  Trang Trinh ,  Thuy Tran

IPC分类号： H05K702

CPC分类号： H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2223/6688 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

摘要翻译： 用于基带，RF或IF应用的多芯片模块（MCM）包括多个具有多个不同功能的有源电路芯片。 有源电路芯片安装在基板上，该基板被配置为在单个MCM封装中提供集成子系统。 MCM包括许多功能，使其能够满足电气性能，大批量制造和低成本要求。 MCM可以采用分离接地平面来实现电子屏蔽和隔离，配置为散热片和接地连接的通孔，以及特别配置的管芯连接焊盘和暴露的接地导体焊盘。