公开(公告)号：US20120187553A1

公开(公告)日：2012-07-26

申请号：US13394993

申请日：2010-09-08

申请人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L23/16 ,  H01L23/3114 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

摘要翻译： 根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以图案化并去除支撑基底来形成间隔物的步骤; 以及将透明基板粘合到设置有去除的支撑基底的间隔件的区域，使得在该区域内包含透明基板的步骤。 这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

公开(公告)号：US20120032284A1

公开(公告)日：2012-02-09

申请号：US13262127

申请日：2010-03-25

申请人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L29/84 ,  C09J167/06 ,  H01L21/00 ,  H01L31/0203 ,  H01L31/18 ,  C09J161/10 ,  C09J177/00

CPC分类号： C09J163/10 ,  C08L79/08 ,  H01L31/0203

摘要： According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).

摘要翻译： 根据本发明的一个方面，用于树脂间隔物（10）的膜包括由树脂组合物制成的粘合剂层（12）和覆盖粘合剂层（12）的表面的覆盖膜（14）。 在上述用于树脂间隔件（10）的膜中，设置粘合剂层（12）和覆盖膜（14）之间的粘附力C1和粘合剂层（12）和硅树脂之间的粘附力D 以满足条件C1> D。 因此，在切割用于树脂间隔物（10）的膜时，可以减少对切割台的树脂粘附性。

公开(公告)号：US07999354B2

公开(公告)日：2011-08-16

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L29/40

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US20100164126A1

公开(公告)日：2010-07-01

申请号：US12601642

申请日：2008-05-23

申请人： Toyosei Takahashi ,  Rie Takayama

发明人： Toyosei Takahashi ,  Rie Takayama

IPC分类号： H01L23/31 ,  C08K3/00

CPC分类号： G03F7/0047 ,  G03F7/032 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a resin composition. The resin composition is used for a resin spacer provided in a semiconductor device. The semiconductor device comprises of a substrate, a semiconductor element mounted on an interposer so as to face the substrate, and the resin spacer provided between the substrate and the interposer or the semiconductor element for bonding them together in a state that a space is formed between the substrate and the semiconductor element. The resin composition comprises an alkali solubility resin, a photopolimerization resin, and a particulate filler. An average particle size of the particulate filler is in the range of 0.05 to 0.35 μm. An amount of the particulate filler contained in the resin composition is in the range of 1 to 40 wt %. Further, the present invention also provides a resin spacer film. The resin spacer film is constituted of the resin composition described above.

摘要翻译： 本发明提供一种树脂组合物。 树脂组合物用于设置在半导体器件中的树脂间隔物。 该半导体器件包括基板，安装在插入件上以面对基板的半导体元件，以及设置在基板和插入件之间的树脂隔板或半导体元件，用于将它们接合在一起， 基板和半导体元件。 树脂组合物包含碱溶性树脂，光聚合树脂和颗粒填料。 粒状填料的平均粒径为0.05〜0.35μm。 树脂组合物中所含的颗粒状填料的量在1〜40重量％的范围内。 此外，本发明还提供一种树脂间隔膜。 树脂隔离膜由上述树脂组合物构成。

公开(公告)号：US20120196075A1

公开(公告)日：2012-08-02

申请号：US13502002

申请日：2010-10-14

申请人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： B32B3/02 ,  C09J163/00

CPC分类号： H01L23/3114 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/15311 ,  Y10T428/21 ,  H01L2924/00

摘要： A resin composition of the present invention is used for providing a spacer 104 having a grid-like shape at a planar view thereof between a semiconductor wafer 101′ and a transparent substrate 102. The resin composition includes a constituent material containing an alkali soluble resin, a thermosetting resin and a photo initiator. In the case where a semiconductor wafer 101′ and a transparent substrate 102 are bonded together through a spacer 104 formed on a substantially overall surface thereof to obtain a bonded body 2000, and then the semiconductor wafer makes one-fifth thickness, a warpage of the bonded body 2000 is 3,000 μm or less. Further, it is preferred that the warpage of the bonded body 2000 before the process thereof is 500 μm or less, and an increasing ratio of the warpage of the bonded body 2000 after the process thereof is 600% or less.

摘要翻译： 本发明的树脂组合物用于在半导体晶片101'和透明基板102之间的平面视图中提供具有格子状的间隔物104.树脂组合物包括含有碱溶性树脂的构成材料， 热固性树脂和光引发剂。 在半导体晶片101'和透明基板102通过形成在其基本上整个表面上的间隔件104结合在一起以获得粘合体2000的情况下，然后半导体晶片形成五分之一厚度， 粘结体2000为3000μm以下。 此外，优选在其加工前的粘合体2000的翘曲为500μm以下，并且其加工后的粘合体2000的翘曲比例增加为600％以下。

公开(公告)号：US08034651B2

公开(公告)日：2011-10-11

申请号：US12668341

申请日：2008-02-19

申请人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

发明人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

IPC分类号： H01L21/00 ,  H01L21/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a transparent substrate 13 disposed so as to oppose the face of the support substrate 12 on which the photodetector 11 is provided. Between the support substrate 12 and the transparent substrate 13, a frame portion 14 is provided so as to surround the photodetector 11. The frame portion 14 is a photo-curing adhesive, and directly adhered to the transparent substrate 13 and the support substrate 12. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

摘要翻译： 光接收装置1包括设置有光电检测器11的支撑基板12，该光检测器11包括受光部分111和放置有光电检测部分111的基板112; 以及设置成与设置有光电检测器11的支撑基板12的表面相对的透明基板13。 在支撑基板12和透明基板13之间设置有围绕光电检测器11的框架部分14.框架部分14是光固化粘合剂，并且直接粘附到透明基板13和支撑基板12上。 这种结构提供能够表现出期望性能的光接收装置，并且还可以提供制造这种光接收装置的方法。

公开(公告)号：US07768089B2

公开(公告)日：2010-08-03

申请号：US12213485

申请日：2008-06-19

申请人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

发明人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

IPC分类号： G09B1/00

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion.

摘要翻译： 半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置， 透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面 所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分 一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从 通过薄壁部分到外部的空间。

公开(公告)号：US20100183983A1

公开(公告)日：2010-07-22

申请号：US12665175

申请日：2008-06-16

申请人： Rie Takayama ,  Toyosei Takahashi

发明人： Rie Takayama ,  Toyosei Takahashi

IPC分类号： G03F7/20

CPC分类号： H01L31/0203 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/18 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process of this invention contains forming a resin composition containing a filler and a photocurable resin over a substrate (a transparent substrate 13) having a mark or an electronic component (a light receiving unit 11 and a base substrate 12 on which the light receiving unit 11 is formed) having a mark such that the resin composition covers the mark; aligning a mask in an exposure machine with the substrate on which the resin composition is formed or the electronic component on which the resin composition is formed; selectively exposing the resin composition with light via the mask and then the developing the resin composition for leaving the resin composition in a predetermined region; and disposing the substrate and the electronic component such that they face each other and bonding these via the resin composition. In aligning a mask in an exposure machine with the substrate on which the resin composition is formed or the electronic component on which the resin composition is formed, the mark is detected using a light with a wavelength of 1.5 times or more of an average particle size of the filler in the resin composition.

摘要翻译： 本发明的方法包括在具有标记或电子部件的基板（透明基板13）上形成含有填料和光固化性树脂的树脂组合物（受光单元11和基板12，光接收单元 11）形成，其具有使树脂组合物覆盖标记的标记; 将曝光机中的掩模与其上形成树脂组合物的基材或形成有树脂组合物的电子部件对准; 通过掩模选择性地将树脂组合物曝光，然后将树脂组合物显影出预定区域; 并且将基板和电子部件配置成使得它们彼此面对并通过树脂组合物粘合它们。 在曝光机中与形成有树脂组合物的基板或其上形成有树脂组合物的电子部件对准掩模时，使用波长为平均粒径的1.5倍以上的光来检测标记 的树脂组合物中的填料。

公开(公告)号：US20090294887A1

公开(公告)日：2009-12-03

申请号：US12213485

申请日：2008-06-19

申请人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

发明人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion. The semiconductor device is capable of reliably preventing dust from infiltrating into the semiconductor device and capable of reliably preventing occurrence of dew condensation in an inner wall of the semiconductor device, particularly on an inner surface of a transparent substrate.

摘要翻译： 半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置， 透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面 所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分 一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从 通过薄壁部分到外部的空间。 半导体装置能够可靠地防止灰尘渗透到半导体装置中，能够可靠地防止在半导体装置的内壁，特别是在透明基板的内表面上发生结露。

公开(公告)号：US08268540B2

公开(公告)日：2012-09-18

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。