公开(公告)号：US20100232744A1

公开(公告)日：2010-09-16

申请号：US12785786

申请日：2010-05-24

申请人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US06181057B2

公开(公告)日：2001-01-30

申请号：US09152789

申请日：1998-09-14

申请人： Satoshi Inoue ,  Toyoaki Tanaka

发明人： Satoshi Inoue ,  Toyoaki Tanaka

IPC分类号： H01J120

CPC分类号： C25D7/12 ,  C25D17/001 ,  C25D17/10

摘要： An electrode assembly, including a cathode member is provided with a hole enclosed by a frame portion and a contact surface that comes into contact with an object to be plated at one surface of the frame portion. The cathode member include a conductive material such as copper plate. The cathode member is provided with a lead conductor. An insulating member is provided with holes and enclosed by frame portions, with the frame portions and placed on another surface of the frame portion of the cathode member. The frame portion of the first insulating member covers the internal circumferential edge of the cathode member over a width W1.

摘要翻译： 包括阴极部件的电极组件设置有由框架部分和与框架部分的一个表面处被镀物体接触的接触表面所包围的孔。 阴极构件包括诸如铜板的导电材料。 阴极部件设有引线导体。 绝缘构件设置有孔并由框架部分包围，框架部分被放置在阴极构件的框架部分的另一个表面上。 第一绝缘构件的框架部分在宽度W1上覆盖阴极构件的内周边缘。

公开(公告)号：US6090260A

公开(公告)日：2000-07-18

申请号：US48328

申请日：1998-03-26

申请人： Satoshi Inoue ,  Toyoaki Tanaka ,  Yoshiro Nakagawa

发明人： Satoshi Inoue ,  Toyoaki Tanaka ,  Yoshiro Nakagawa

IPC分类号： C25D5/00 ,  C25D17/10 ,  C25D21/12 ,  C25D5/10

CPC分类号： C25D17/10 ,  C25D21/12 ,  Y10S204/07 ,  Y10S205/917 ,  Y10S205/918

摘要： A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.

摘要翻译： 电镀被镀物体的电镀方法，该方法是将电镀液的下部部分电镀，由电镀液排出，并在每次镀敷工序中供给新的电镀液。 该方法具有提供附加电流的步骤，使得待镀覆的对象总是具有阴极电位，同时将被镀物体浸入镀浴中，并且不进行电镀。

公开(公告)号：US4822668A

公开(公告)日：1989-04-18

申请号：US44373

申请日：1987-04-30

申请人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

发明人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

IPC分类号： A61F13/00 ,  A61F13/15 ,  A61F13/53 ,  B32B7/00 ,  B32B27/12 ,  D01G13/00 ,  D04H1/54 ,  B32B5/16

CPC分类号： D04H1/54 ,  A61F13/15642 ,  D21H17/71 ,  D21H23/10 ,  D21H5/2628 ,  A61F2013/00119 ,  A61F2013/15048 ,  A61F2013/15821 ,  A61F2013/530481 ,  A61F2013/53445 ,  Y10S428/913 ,  Y10T428/25 ,  Y10T428/253 ,  Y10T428/2982 ,  Y10T442/676 ,  Y10T442/678

摘要： Disclosed is an elastic absorbent which comprises a substantially homogeneous mixture of pulverized cellulose pulp and staple fibers of a split yarn obtained by splitting a tape-form oriented laminate comprising at least one layer of a synthetic resin having a high melting point and at least one layer of a synthetic resin having a low melting point, in which the layer of the synthetic resin having a low melting point is at least partially exposed to the surface. Another elastic absorbent comprises an intermediate layer of a powdery polymeric water-absorbing agent, which is interposed between upper and lower layers, each of the upper and lower layers comprising a substantially homogeneous mixture of pulverized cellulose pulp and staple fibers of the same split yarn as mentioned above. At the crossing points of the staple fibers, of the split yarn, the synthetic resin having a low melting point is at least partially fusion-bonded and the staple fibers of the split yarn are connected to one another in the state where the cellulose pulp is partially enclosed therein.

公开(公告)号：US4504432A

公开(公告)日：1985-03-12

申请号：US572610

申请日：1984-01-23

申请人： Ryosuke Kamei ,  Toyoaki Tanaka ,  Takeshi Sano ,  Masataka Kotani

发明人： Ryosuke Kamei ,  Toyoaki Tanaka ,  Takeshi Sano ,  Masataka Kotani

IPC分类号： D01F6/46 ,  D01D5/16 ,  D01F6/04 ,  D01D5/12

CPC分类号： D01D5/16 ,  D01F6/04

摘要： A monofilament of a thermoplastic resin having a high tenacity is produced by a process in which a monofilament is melt spun at a temperature of 220.degree. C. to 310.degree. C. from a thermoplastic resin through a nozzle having a cross-sectional area S (mm.sup.2) satisfying the following equations: ##EQU1## wherein I is a maximum cross-sectional secondary moment max (Ix, Iy) (i.e., the maximum secondary moment in the cross-sectional secondary moments with respect to the main x axis and y axis passing through the center of the gravity of the cross-section); and, then, is subjected to a multi-stage stretching under the conditions satisfying the following equations: ##EQU2## wherein i is a number of stretching stages, e is a base of natural logarithm (i.e., 2.71828), V.sub.1 is the first take-off linear velocity (m/min), V.sub.i+1 is the final take-off linear velocity (m/min) at the i-stretching stage, DR.sub.Ti is the total stretching ratio at the i-stretching stage, DR.sub.Tiw is the DR.sub.Ti from which the monofilament begins to become whitened at the i-stretching stage, T.sub.m is the melting point of the thermoplastic resin and .theta..sub.i is the temperature of the filament at the i-stretching stage.

摘要翻译： 具有高强度的热塑性树脂的单丝通过一种方法制备，其中将单丝在220℃至310℃的温度下从热塑性树脂通过具有横截面积S（ mm2）满足以下等式：0.503mm2 θi / = 2）其中i是拉伸阶段的数量，e是自然对数的基数（即2.71828），V1是第一个起飞线速度（m / min），Vi + 1是最终的 起始线速度（m / min）在第i个拉伸阶段，DRTi是i拉伸阶段的总拉伸比，DRTiw是在i拉伸阶段单丝开始变白的DRTi 是热塑性树脂的熔点，θi是在i拉伸阶段的长丝的温度。

公开(公告)号：US06184613B2

公开(公告)日：2001-02-06

申请号：US09152787

申请日：1998-09-14

申请人： Satoshi Inoue ,  Toyoaki Tanaka

发明人： Satoshi Inoue ,  Toyoaki Tanaka

IPC分类号： H01J120

CPC分类号： C25D7/12 ,  C25D17/001 ,  C25D17/10

摘要： An electrode assembly including a first cathode member provided with a hole enclosed by a frame portion. The frame portion surrounding the hole has a contact surface that comes into contact with an object to be plated at one of its surfaces, and an insulating member is provided with holes and enclosed by a frame portion, with one surface of the frame portion placed on top of another surface of the frame portion of the first cathode member. A second cathode member also provided with a hole enclosed by a frame portion, with one surface of the frame portion placed on top of one surface of the other frame portion of the insulating member. The smallest bore diameter at the hole of the second cathode member is larger than the smallest bore diameter at the holes and of the insulating member.

摘要翻译： 一种电极组件，包括设置有由框架部分包围的孔的第一阴极部件。 围绕孔的框架部分具有接触表面，该接触表面与其表面中的一个处被镀覆的物体接触，并且绝缘构件设置有孔并被框架部分包围，框架部分的一个表面放置在 第一阴极部件的框架部分的另一个表面的顶部。 第二阴极部件还设置有由框架部分包围的孔，框架部分的一个表面放置在绝缘构件的另一框架部分的一个表面的顶部上。 在第二阴极部件的孔处的最小孔径大于孔和绝缘部件处的最小孔径。

公开(公告)号：US4931005A

公开(公告)日：1990-06-05

申请号：US304089

申请日：1989-01-31

申请人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

发明人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

IPC分类号： A61F13/00 ,  A61F13/15 ,  A61F13/53 ,  B32B7/00 ,  B32B27/12 ,  D01G13/00 ,  D04H1/54

CPC分类号： D04H1/54 ,  A61F13/15642 ,  D21H17/71 ,  D21H23/10 ,  D21H5/2628 ,  A61F2013/00119 ,  A61F2013/15048 ,  A61F2013/15821 ,  A61F2013/530481 ,  A61F2013/53445 ,  Y10S428/913 ,  Y10T428/25 ,  Y10T428/253 ,  Y10T428/2982 ,  Y10T442/676 ,  Y10T442/678

摘要： An apparatus for the preparation of an elastic absorbent composed of a mixed web. Elements of the apparatus can include two supply hoppers for separately supplying pulverized pulp and staple fibers of a synthetic fiber split yarn at a constant mixing ratio with each hopper having a pair of confronting moving belts, two guide mechanisms located below the hoppers, a pair of nip rollers located below the guide mechanisms, a garnet roll located below the pair of nip rollers, a vacuum device located below the garnet roll, and a mesh belt located between the vacuum device and the garnet roll. Each guide mechanism in the apparatus may include at least two gear guides arranged in series. The apparatus operates by feeding the pulverized pulp and the staple fibers of the split yarn from the hoppers to the nip rolls via the guide mechanisms. The nip rolls compress the material, which is then disintegrated and mixed by the garnet roll. The mixture is pulled onto the mesh belt by the vacuum device.

公开(公告)号：US07231073B2

公开(公告)日：2007-06-12

申请号：US10405490

申请日：2003-04-03

申请人： Toyoaki Tanaka

发明人： Toyoaki Tanaka

IPC分类号： G06K9/00

CPC分类号： A61B6/505 ,  A61B5/1075 ,  A61B5/4504 ,  A61B5/4561 ,  A61B6/4225 ,  G06T7/0012 ,  G06T7/60 ,  G06T2207/30012

摘要： A medical image processing apparatus processes a medical image resulting from a medical image equipment. The apparatus comprises an interface, a processor, and a calculator. The interface is configured to obtain the medical image. The processor is configured to determine a smooth line along an embowed part of a specimen in the medical image obtained by the interface. The calculator is configured to calculate a bow scale of the embowed part based on the smooth line determined by the processor.

摘要翻译： 医疗图像处理装置处理由医用图像设备产生的医学图像。 该装置包括接口，处理器和计算器。 该接口被配置为获得医学图像。 处理器被配置为沿着由界面获得的医学图像中的样本的被覆部分确定平滑线。 计算器被配置为基于由处理器确定的平滑线来计算被覆盖部分的弓形尺度。

公开(公告)号：US20060012967A1

公开(公告)日：2006-01-19

申请号：US10509899

申请日：2003-03-28

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H05K1/18

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

摘要翻译： 本发明的目的是提供一种用于安装IC芯片的基板，IC芯片是用于光通信的部件，其具有一体地设置在其上的IC芯片和光学部件，其可以确保IC芯片和光学部件之间的短距离， 其电信号传输可靠性优异，可以通过用于发送光信号的光路传输光信号。 用于安装本发明的IC芯片的基板是用于安装IC芯片的基板，其包括：基板，并且在其两个表面上串联构成导体电路和层间绝缘层，并且重复; 形成为最外层的阻焊层; 以及安装在其上的光学元件，其中设置用于透射光信号的光路，其穿透用于安装IC芯片的基板。

公开(公告)号：US06554976B1

公开(公告)日：2003-04-29

申请号：US09588680

申请日：2000-06-06

申请人： Satoshi Inoue ,  Toyoaki Tanaka ,  Yoshiro Nakagawa

发明人： Satoshi Inoue ,  Toyoaki Tanaka ,  Yoshiro Nakagawa

IPC分类号： C25D1700

CPC分类号： C25D17/10 ,  C25D21/12 ,  Y10S204/07 ,  Y10S205/917 ,  Y10S205/918

摘要： A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.

摘要翻译： 电镀被镀物体的电镀方法，该方法是将电镀液的下部部分电镀，由电镀液排出，并在每次镀敷工序中供给新的电镀液。 该方法具有提供附加电流的步骤，使得待镀覆的对象总是具有阴极电位，同时将被镀物体浸入镀浴中，并且不进行电镀。