Abstract:
An aqueous dispersion-type pressure-sensitive adhesive composition for an optical film includes a emulsion particles of a core-shell structure, wherein the emulsion particles include a (meth)acryl-based copolymer (A) having a glass transition temperature of −55° C. to 0° C. and a (meth)acryl-based copolymer (B) having a glass transition temperature of 0° C. to 180° C., in a single emulsion particle, one of the copolymers (A) and (B) forms a core layer, and another forms a shell layer, at least one of the copolymers (A) and (B) contains a carboxyl group-containing monomer, a difference of the glass transition temperatures between the copolymers (A) and (B) is 50° C. or more, and a ratio (A)/(B) (by weight) is in the range of 50/50 to 90/10.
Abstract:
The present invention aims at providing an antistatic pressure-sensitive adhesive optical film exhibiting excellent antistatic effect, optical properties, and water resistance and having excellent adhesion between the antistatic layer and the pressure-sensitive adhesive layer. An antistatic pressure-sensitive adhesive optical film, the optical film having an antistatic layer laminated on at least one side of the optical film, and a pressure-sensitive adhesive layer further laminated on the antistatic layer, wherein the antistatic layer comprises a conductive polymer and a sulfonic acid compound as raw material components, and the pressure-sensitive adhesive layer is formed of an acryl-based pressure-sensitive adhesive containing nitrogen.
Abstract:
An antistatic optical film comprising an antistatic layer laminated on at least one side of an optical film, wherein the antistatic layer comprises a water soluble or a water dispersible conductive polymer, has excellent antistatic effect, optical characteristics and appearance.
Abstract:
A pressure-sensitive adhesive layer for an optical film of the invention, which is formed by applying an aqueous dispersion pressure-sensitive adhesive including an aqueous dispersion containing at least a base polymer dispersed in water, and then drying the applied aqueous dispersion pressure-sensitive adhesive, has a content of residual monomer in the pressure-sensitive adhesive layer is 5 to 100 ppm per 1 g of the solid of the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer for an optical film has high durability so that foaming and peeling can be suppressed even under high temperature or high humidity environment.
Abstract:
A pressure-sensitive adhesive layer for an optical film of the invention which is formed by applying an aqueous dispersion pressure-sensitive adhesive include an aqueous dispersion containing a base polymer dispersed in water, and then drying the applied aqueous dispersion pressure-sensitive adhesive, wherein the aqueous dispersion comprises a product obtained by polymerizing a monomer or monomers in water in the presence of a surfactant and a radical polymerization initiator, and the content of the surfactant is from 0.3 to 5 parts by weight based on 100 parts by weight of the monomer or monomers, when the pressure-sensitive adhesive layer is allowed to stand in water at 23° C. for one week and to separate into a water-soluble component and a water-insoluble component, the content of the water-insoluble component in the pressure-sensitive adhesive layer is from 95 to 99% by weight, and the content of the surfactant in the water-soluble component is 50% by weight or less based on the amount of the water-soluble component. The pressure-sensitive adhesive layer for an optical film has high durability so that foaming and peeling can be suppressed even under high temperature or high humidity environment.
Abstract:
A pressure-sensitive adhesive optical film of the invention includes an optical film; and a pressure-sensitive adhesive layer placed on at least one side of the optical film, wherein the pressure-sensitive adhesive layer is a product formed by applying a pressure-sensitive adhesive coating liquid having a dissolved oxygen concentration of 0.02 to 3 mg/L and then drying the pressure-sensitive adhesive coating liquid. The pressure-sensitive adhesive optical film can satisfy heat durability, humidity durability, and high contrast.
Abstract:
An object of the invention is to provide a pressure-sensitive adhesive optical film-peeling method capable of easily detaching the pressure-sensitive adhesive optical film from a glass substrate with no damage to the glass substrate or no adhesive deposit on the glass substrate, and to provide a pressure-sensitive adhesive optical film suitable for use in such a peeling method. The invention is directed to a method for peeling a pressure-sensitive adhesive optical film from an optical film-carrying glass substrate including a glass substrate and the pressure-sensitive adhesive optical film bonded thereto, which includes: exposing the optical film-carrying glass substrate to an environment at a temperature of 40 to 98° C. and a relative humidity of 60 to 99% for three minutes or more; and then peeling the pressure-sensitive adhesive optical film from the glass substrate under the environment.
Abstract:
The present invention aims at providing an antistatic pressure-sensitive adhesive optical film exhibiting excellent antistatic effect, optical properties, and water resistance and having excellent adhesion between the antistatic layer and the pressure-sensitive adhesive layer. An antistatic pressure-sensitive adhesive optical film, the optical film having an antistatic layer laminated on at least one side of the optical film, and a pressure-sensitive adhesive layer further laminated on the antistatic layer, wherein the antistatic layer comprises a conductive polymer and a sulfonic acid compound as raw material components, and the pressure-sensitive adhesive layer is formed of an acryl-based pressure-sensitive adhesive containing nitrogen.
Abstract:
The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.
Abstract:
A pressure-sensitive adhesive layer for an optical film made from an aqueous dispersion-type pressure-sensitive adhesive composition, wherein the aqueous dispersion-type pressure-sensitive adhesive composition is an aqueous dispersion comprising a water-dispersible (meth)acryl-based copolymer (A) having a glass transition temperature from −55° C. to less than 0° C.; and a water-soluble or water-dispersible component (B) having a glass transition temperature of 0° C. or more, a mixture ratio (A)/(B) is in the range of 50-97/3-50, the component (B) forms domains with maximum lengths between 1 nm and 200 nm in a resin component made of the (meth)acryl-based copolymer (A), and the pressure-sensitive adhesive layer has a haze value (H20) of 1% or less when having a thickness of 20 μm. The pressure-sensitive adhesive layer for an optical film, which is made from an aqueous dispersion-type pressure-sensitive adhesive composition has good reworkability or recyclability, and has a sufficient level of durability.