摘要:
An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
摘要:
There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
摘要:
There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
摘要:
An information transmission method using arc and apparatus thereof are applied to a loudspeaker and the like having the function of illumination. The information transmission method is characterized in that arc current supplied to an arc generating device is modulated by a signal based on information to vibrate arc column so that at least one of audible waves, ultrasonic waves and arc light is employed to transmit the information. Arc having small mechanical inertia is employed as a sound producing device and accordingly can be used as a loudspeaker having a good frequency characteristic and large output. It can be used as a sound producing device having the function of illumination by utilizing strong light emitted from arc column.
摘要:
An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
摘要:
The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrate 17 and a second substrate 14 are disposed to face a first main surface 13a of the first substrate 13 and connected to the first main surface 13a of the first substrate 13. With this structure, no internal line or side surface line is necessary, and the structure of the first substrate 13 can be simplified. The length of the line can be decreased to decrease the resistance of the line, and good electrical characteristics can be achieved at low energy consumption. The strains in the semiconductor substrate 17 can also be reduced.
摘要:
In a ZIF connector having first and second connectors, the first connector includes an operating member rotatably held by a first insulator portion holding first contacts arranged adjacent to one another in a predetermined direction. The second connector includes a floating member held by a second insulator portion to be rotatable and slidable in the predetermined direction. The floating member has a first and a second surface which face the first contacts and the operating member, respectively, in a mutually fitted state of the first and the second connectors. Second contacts have one parts held by the first surface and arranged adjacent to one another in the predetermined direction. The floating member is rotated in a first rotating direction to bring the second contacts into contact with the first contacts when the operating member is rotated in the mutually fitted state.
摘要:
In a ZIF connector having first and second connectors, the first connector includes an operating member rotatably held by a first insulator portion holding first contacts arranged adjacent to one another in a predetermined direction. The second connector includes a floating member held by a second insulator portion to be rotatable and slidable in the predetermined direction. The floating member has a first and a second surface which face the first contacts and the operating member, respectively, in a mutually fitted state of the first and the second connectors. Second contacts have one parts held by the first surface and arranged adjacent to one another in the predetermined direction. The floating member is rotated in a first rotating direction to bring the second contacts into contact with the first contacts when the operating member is rotated in the mutually fitted state.
摘要:
An oxide superconductor which has a composition expressed by the following general formula and whose crystal structure is 1222-phase structure.Pb.sub.a (M.sub.1-x-y Ce.sub.x Sr.sub.y).sub.4 Cu.sub.3-a O.sub.z (I)(where M represents at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb, and Lu, and a, x, y, and z denote the numbers which satisfy 0.3.ltoreq.a.ltoreq.0.7, 0
摘要:
Novel phosphonium salts of the general formula ##STR1## wherein R.sup.1 and R.sup.2 each is a hydrogen atom or a hydrocarbon group of 1 to 12 carbon atoms which may optionally be substituted; R.sup.3 is a hydrogen atom or a hydrocarbon group of 1 to 5 carbon atoms which may optionally be substituted; R.sup.4, R.sup.5 and R.sup.6 each is a hydrocarbon group of 1 to 8 carbon atoms which may optionally be substituted; X is a hydroxyl group, a hydroxycarbonyloxy group or a lower alkylcarbonyloxy group, and processes for production of the salts are described. Telomerization catalysts containing said phosphonium salts and processes for production of straight-chain alkadienyl compounds using the same catalysts are also provided.