公开(公告)号：US20080168413A1

公开(公告)日：2008-07-10

申请号：US11885831

申请日：2006-01-20

Applicant: Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

Inventor： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

IPC: G06F17/50 ,  H05K3/32

CPC classification number: G06F17/5018 ,  G06F2217/40 ,  G06F2217/80 ,  H05K1/181 ,  H05K3/0005

Abstract: A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.

Abstract translation: 一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B） 多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D） 通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。

公开(公告)号：US07873932B2

公开(公告)日：2011-01-18

申请号：US11885831

申请日：2006-01-20

Applicant: Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

Inventor： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

IPC: G06F17/50

CPC classification number: G06F17/5018 ,  G06F2217/40 ,  G06F2217/80 ,  H05K1/181 ,  H05K3/0005

Abstract: A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.

Abstract translation: 一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B） 多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D） 通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。