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    Led lighting system with reflective board
    2.
    发明申请
    Led lighting system with reflective board 有权
    带反光板的LED照明系统

    公开(公告)号：US20060012991A1

    公开(公告)日：2006-01-19

    申请号：US10891722

    申请日：2004-07-15

    申请人： Stanton Weaver ,  Thomas Stecher

    发明人： Stanton Weaver ,  Thomas Stecher

    IPC分类号： F21V1/00

    CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

    摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

    Portable light generation and detection system
    3.
    发明授权
    Portable light generation and detection system 有权
    便携式发光和检测系统

    公开(公告)号：US07820428B2

    公开(公告)日：2010-10-26

    申请号：US11427504

    申请日：2006-06-29

    申请人： Steven Tysoe ,  Eugene Barash ,  Thomas Stecher

    发明人： Steven Tysoe ,  Eugene Barash ,  Thomas Stecher

    IPC分类号： C12M1/34 ,  C12M3/00 ,  G01J1/10

    CPC分类号： G01N21/0303 ,  B01L3/5027

    摘要： A field deployable optical assembly for use in testing a light-responsive sample is disclosed. The assembly includes a microfluidic device, a first optical package, and a second optical package. The first optical package includes a light emitting diode (LED), a first optical device, and a first light-path control, the first optical package configured to guide and focus light from the LED onto the sample. The microfluidic device includes a tethered control substance. In response to a substance within the sample being associated with, and attaching to, the tethered control, the sample emits light. The second optical package includes a photo sensor, a second optical device, and a second light-path control, the second optical package configured to guide and focus the light emitted from the sample onto the photo sensor.

    摘要翻译： 公开了用于测试光响应样品的现场部署光学组件。 组件包括微流体装置，第一光学封装和第二光学封装。 第一光学封装包括发光二极管（LED），第一光学器件和第一光路控制，第一光学封装构造成将来自LED的光引导并聚焦到样品上。 微流体装置包括栓系对照物质。 响应于样品中的物质与束缚对照相关联并连接到束带对照，样品发光。 第二光学封装包括光传感器，第二光学器件和第二光路控制，第二光学封装构造成将从样品发射的光引导并聚焦到光传感器上。

    FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME
    5.
    发明申请
    FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME 审中-公开
    电气设备的柔性互连结构及其相关的光源

    公开(公告)号：US20060292722A1

    公开(公告)日：2006-12-28

    申请号：US11468709

    申请日：2006-08-30

    申请人： Charles Becker ,  Stanton Weaver ,  Thomas Stecher

    发明人： Charles Becker ,  Stanton Weaver ,  Thomas Stecher

    IPC分类号： H01L21/00 ,  H01L33/00

    CPC分类号： H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

    摘要： A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

    摘要翻译： 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

    LED lighting system with reflective board
    6.
    发明申请
    LED lighting system with reflective board 有权
    LED照明系统带反光板

    公开(公告)号：US20070165402A1

    公开(公告)日：2007-07-19

    申请号：US11725410

    申请日：2007-03-19

    申请人： Stanton Weaver ,  Thomas Stecher

    发明人： Stanton Weaver ,  Thomas Stecher

    IPC分类号： F21V1/00

    CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

    摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

    PORTABLE LIGHT GENERATION AND DETECTION SYSTEM
    8.
    发明申请
    PORTABLE LIGHT GENERATION AND DETECTION SYSTEM 有权
    便携式发光和检测系统

    公开(公告)号：US20080003664A1

    公开(公告)日：2008-01-03

    申请号：US11427504

    申请日：2006-06-29

    申请人： Steven Tysoe ,  Eugene Barash ,  Thomas Stecher

    发明人： Steven Tysoe ,  Eugene Barash ,  Thomas Stecher

    IPC分类号： H01J3/14 ,  C12M1/34

    CPC分类号： G01N21/0303 ,  B01L3/5027

    摘要： A field deployable optical assembly for use in testing a light-responsive sample is disclosed. The assembly includes a microfluidic device, a first optical package, and a second optical package. The first optical package includes a light emitting diode (LED), a first optical device, and a first light-path control, the first optical package configured to guide and focus light from the LED onto the sample. The microfluidic device includes a tethered control substance. In response to a substance within the sample being associated with, and attaching to, the tethered control, the sample emits light. The second optical package includes a photo sensor, a second optical device, and a second light-path control, the second optical package configured to guide and focus the light emitted from the sample onto the photo sensor.

    摘要翻译： 公开了用于测试光响应样品的现场部署光学组件。 组件包括微流体装置，第一光学封装和第二光学封装。 第一光学封装包括发光二极管（LED），第一光学器件和第一光路控制，第一光学封装构造成将来自LED的光引导并聚焦到样品上。 微流体装置包括栓系对照物质。 响应于样品中的物质与束缚对照相关联并连接到束带对照，样品发光。 第二光学封装包括光传感器，第二光学器件和第二光路控制，第二光学封装构造成将从样品发射的光引导并聚焦到光传感器上。