公开(公告)号：US20230035468A1

公开(公告)日：2023-02-02

申请号：US17743706

申请日：2022-05-13

Applicant: The Intel Corporation

Inventor： Ned M. Smith ,  Brinda Ganesh ,  Francesc Guim Bernat ,  Eoin Walsh ,  Evan Custodio

IPC: G06F21/60 ,  H04L9/40 ,  H04L41/5003 ,  H04L9/08

Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.

公开(公告)号：US20230022182A1

公开(公告)日：2023-01-26

申请号：US17710822

申请日：2022-03-31

Applicant: The Intel Corporation

Inventor： Juha Paavola ,  Justin M. Huttula ,  Jerrod Peterson ,  Shawn McEuen ,  Kerry A. Stevens

IPC: G06F1/20 ,  H05K7/20

Abstract: Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.

公开(公告)号：US11972001B2

公开(公告)日：2024-04-30

申请号：US17743706

申请日：2022-05-13

Applicant: The Intel Corporation

Inventor： Ned M. Smith ,  Brinda Ganesh ,  Francesc Guim Bernat ,  Eoin Walsh ,  Evan Custodio

IPC: G06F21/60 ,  H04L9/08 ,  H04L9/40 ,  H04L41/5003 ,  H04L67/01

CPC classification number: G06F21/602 ,  H04L9/0827 ,  H04L41/5003 ,  H04L63/0428 ,  H04L63/045 ,  H04L63/0485 ,  H04L67/01

Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.

公开(公告)号：US20240006285A1

公开(公告)日：2024-01-04

申请号：US17855662

申请日：2022-06-30

Applicant: The Intel Corporation

Inventor： Yi Yang ,  Suddhasattwa Nad ,  Xiaoying Guo ,  Jieying Kong ,  Ala Omer ,  Christy Sennavongsa ,  Wei Wei ,  Ao Wang

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  H05K1/11 ,  H05K3/40 ,  H05K3/22

CPC classification number: H01L23/49822 ,  H01L23/145 ,  H01L23/49866 ,  H01L21/4857 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/22 ,  H01L2224/16227 ,  H01L24/16

Abstract: Substrate assemblies having adhesion promotor layers and related methods are disclosed. An example apparatus includes a substrate, a dielectric layer, a first copper layer between the substrate and the dielectric layer, and a film between the dielectric layer and the first copper layer. The film including silicon and nitrogen and being substantially free of hydrogen. A via in the dielectric layer is to provide access to the first copper layer. A portion of the first copper layer uncovered in the via, a wall of the via and the portion of the first copper layer to be substantially free of fluorine. A seed copper layer positioned on the dielectric layer. The via wall and the portion of the first copper layer. The seed copper layer and the first copper layer define an undercut at an interface between the seed copper layer and the first copper layer.

公开(公告)号：US20220225536A1

公开(公告)日：2022-07-14

申请号：US17711821

申请日：2022-04-01

Applicant: The Intel Corporation

Inventor： Arunpandi R. ,  Kathiravan D ,  Triplicane Gopikrishnan Babu ,  Doddi Raghavendra ,  Ritu Bawa ,  Bijendra Singh

IPC: H05K7/20 ,  G06F1/20

Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.