Abstract:
A solid preparation packaging apparatus includes a solid preparation accommodating unit, a transfer mechanism unit and a solid preparation packaging mechanism unit each individually accommodated in a main body so as to be capable of being pulled out or pushed back in the back-and-forth direction; an electrical component chamber containing a CPU circuit board and a power supply at the lowest portion of the solid preparation packaging apparatus, and a flexible wiring cover mounted across the electrical component chamber and the solid preparation packaging mechanism unit in order to pass, through the flexible wiring cover, a wiring of the solid preparation accommodating unit, the transfer mechanism unit and the solid preparation packaging mechanism unit to the CPU circuit board and the power supply.
Abstract:
A culture apparatus includes a culture chamber in which culture is cultured, a shelf plate included in the culture chamber, on which the culture is placed, and shelf rests in a left-and-right pair configured to support the shelf plate and a plurality of shelf supports configured to support the shelf rests. The shelf rests each include one piece supporting the shelf plate and the other piece supported by the shelf supports. The shelf rests are in an L-shape in a cross-sectional manner whose angle between the one piece and the other piece is an acute angle. The one piece is in line contact with a lower face of the shelf plate at an end of the one piece extending obliquely upward from a side face of the culture chamber toward the inside of the culture chamber. The culture chamber is supplied with sterilizing gas to be sterilized.
Abstract:
A Group III nitride semiconductor device and method for producing the same. The device includes a substrate, and a plurality of Group III nitride semiconductor layers provided on the substrate. A first layer which is in contact with the substrate is composed of AlxGa1-x N (0≦x≦1), and the difference in height between a protrusion and a depression which are present at the interface between the first layer and a second layer provided thereon is 10 nm or more and is equal to, or less than, 99% the thickness of the first layer. The method includes a first step of depositing on a substrate, a layer containing fine Group III metal particles containing silicon; a second step of nitridizing the fine particles in an atmosphere containing a nitrogen source; and a third step of growing a Group III nitride semiconductor single crystal on the thus-nitridized fine particles.
Abstract translation:一种III族氮化物半导体器件及其制造方法。 该器件包括衬底和设置在衬底上的多个III族氮化物半导体层。 与基板接触的第一层由Al x Ga 1-x N(0< n 1; x&n 1; 1)构成,并且存在于第一层与第二层之间的界面处的突起与凹陷之间的高度差 其上设置有10nm以上且等于或小于第一层的厚度的99%。 该方法包括沉积在基底上的第一步骤,包含含有硅的细小的III族金属颗粒; 在含氮源的气氛中氮化微粒子的第二步骤; 以及在这样的氮化微粒上生长III族氮化物半导体单晶的第三步骤。
Abstract:
An object of the present invention is to provide a gallium nitride compound semiconductor multilayer structure useful for producing a gallium nitride compound semiconductor light-emitting device which operates at low voltage while maintaining a satisfactory light emission output. The inventive gallium nitride compound semiconductor multilayer structure comprises a substrate, and an n-type layer, an active layer, and a p-type layer formed on the substrate, the active layer being sandwiched by the n-type layer and the p-type layer, and the active layer comprising a thick portion and a thin portion, wherein the active layer has a flat lower surface (on the substrate side) and an uneven upper surface so as to form the thick portion and the thin portion.
Abstract:
An object of the present invention is to provide a gallium nitride compound semiconductor multilayer structure useful for producing a gallium nitride compound semiconductor light-emitting device which operates at low voltage while maintaining satisfactory light emission output. The inventive gallium nitride compound semiconductor multilayer structure comprises a substrate, and an n-type layer, a light-emitting layer, and a p-type layer formed on the substrate, the light-emitting layer having a multiple quantum well structure in which a well layer and a barrier layer are alternately stacked repeatedly, said light-emitting layer being sandwiched by the n-type layer and the p-type layer, wherein the well layer comprises a thick portion and a thin portion, and the barrier layer contains a dopant.
Abstract:
An object of the present invention is to provide a gallium nitride compound semiconductor multilayer structure useful for producing a gallium nitride compound semiconductor light-emitting device which operates at low voltage while maintaining satisfactory light emission output. The inventive gallium nitride compound semiconductor multilayer structure comprises a substrate, and an n-type layer, a light-emitting layer, and a p-type layer formed on the substrate, the light-emitting layer having a multiple quantum well structure in which a well layer and a barrier layer are alternately stacked repeatedly, said light-emitting layer being sandwiched by the n-type layer and the p-type layer, wherein the well layer comprises a thick portion and a thin portion, and the barrier layer contains a dopant.
Abstract:
The digital synthesizer comprises a system control unit, a read control unit, and a write drive control unit, and based on a magnification fine adjustment value set using a magnification fine adjustment panel, in the copy mode, a magnification of an image in the main scanning direction is finely adjusted by controlling a write reference clock frequency for modulating a laser beam for image formation so that a desired pixel density is obtained and also a magnification of the image in the auxiliary scanning direction is finely adjusted by controlling a scan speed when reading an image from a document, while in the printer mode, a magnification of an image in the main scanning direction is finely adjusted by controlling a write reference clock frequency and also a magnification of the image in the auxiliary scanning direction is finely adjusted by controlling a rotational speed of a polygon mirror for scanning a photosensitive mirror with a write beam.
Abstract:
An image scanner, including an optical image reading unit which reads an image from a document and a carriage which carries the optical image reading unit. Also included is a motor which drives the carriage, and a driver which outputs a sequence of drive signals to drive the motor. Further, a timing of each drive signal of the sequence of drive signals output by the driver is selected in accordance with a desired incremental magnification of the document. In addition, the incremental magnification of the document may be selected in steps of 0.1%.
Abstract:
An imaging device includes: an imaging module configured to have a plurality of photoelectric conversion elements corresponding to a frame composed of a plurality of lines, with start of an accumulation period of electric charge by the plural photoelectric conversion elements being different depending on each of the lines, and reading the accumulated electric charge to repeatedly output the read electric charge as an image signal; a light source configured to irradiate an imaging range of the imaging module; and a controller configured to control an irradiation time of the light source according to a motion of an image captured by the imaging module.