公开(公告)号：US06551920B2

公开(公告)日：2003-04-22

申请号：US10082238

申请日：2002-02-26

申请人： Tomoyuki Uchiyama ,  Kazuhisa Sasaki ,  Taro Muraki

发明人： Tomoyuki Uchiyama ,  Kazuhisa Sasaki ,  Taro Muraki

IPC分类号： H01L214763

CPC分类号： H01L21/76807 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76877

摘要： A semiconductor device includes first and second conductive layers which are electrically connected to each other through a contact plug. A first insulating film is formed on the first conductive layer and has a first opening which reaches the surface of the first conductive layer. A second insulating film is formed on the first insulating film and has a second opening at the same position as the first opening. The contact plug is filled in the first and second openings and has the surface which is substantially flush with the surface of the second insulating film and also contains a metal having a high melting point. The second conductive layer is formed on the second insulating film and on the contact plug.

公开(公告)号：US5716465A

公开(公告)日：1998-02-10

申请号：US649701

申请日：1996-08-27

申请人： Takuya Hara ,  Asahi Hitoshi ,  Hiroshi Tamehiro ,  Taro Muraki ,  Akira Kawakami

发明人： Takuya Hara ,  Asahi Hitoshi ,  Hiroshi Tamehiro ,  Taro Muraki ,  Akira Kawakami

IPC分类号： C21D1/18 ,  C21D8/02 ,  C22C38/42

CPC分类号： C22C38/42 ,  C21D8/0205 ,  C21D1/18 ,  C21D2211/008

摘要： A high-corrosion-resistant martensitic stainless steel possessing excellent weldability and SSC resistance, having a tempered martensitic structure, characterized by comprising steel constituents satisfying by weight C: 0.005 to 0.035%, Si: not more than 0.50%, Mn: 0.1 to 1.0%, P: not more than 0.03%, S: not more than 0.005%, Mo: 1.0 to 3.0%, Cu: 1.0 to 4.0%, Ni: 1.5 to 5.0%, Al: not more than 0.06%, N: not more than 0.01%, and Cr satisfying a requirement represented by the formula 13>Cr+1.6Mo.gtoreq.8, C+N.gtoreq.0.03, 40C+34N+Ni+0.3Cu-1.1Cr-1.8 Mo.gtoreq.10, or further comprising at least one element selected from the group consisting of Ti: 0.05 to 0.1%, Zr: 0.01 to 0.2%, Ca: 0.001 to 0.02%, and REM: 0.003 to 0.4%, with the balance consisting essentially of Fe. A process for producing a martensitic stainless steel, comprising the steps of: subjecting a steel plate, produced by hot-rolling a stainless steel slab having the above composition, to austenitization at a temperature of Ac.sub.3 point to 1000.degree. C. to harden the steel plate; subjecting the hardened steel plate to final tempering at a temperature of 550.degree. C. to Ac.sub.1 point; and cold-rolling the steel plate.

摘要翻译： PCT No.PCT / JP95 / 01950 Sec。 371日期：1996年8月27日 102（e）日期1996年8月27日PCT提交1995年9月27日PCT公布。 公开号WO96 / 10654 日期1996年4月11日具有回火马氏体组织的耐焊接性和耐SSC性优异的高耐腐蚀马氏体系不锈钢，其特征在于，含有C：0.005〜0.035％，Si：0.50％以下， Mn：0.1〜1.0％，P：0.03％以下S：0.005％以下，Mo：1.0〜3.0％，Cu：1.0〜4.0％，Ni：1.5〜5.0％，Al：0.06以下 ％，N：0.01以下，Cr满足式13> Cr + 1.6Mo> / = 8，C + N> = 0.03,40C + 34N + Ni + 0.3Cu-1.1Cr- 或者还包含选自Ti：0.05〜0.1％，Zr：0.01〜0.2％，Ca：0.001〜0.02％，REM：0.003〜0.4％的至少一种元素，与 余量基本上由Fe组成。 一种马氏体不锈钢的制造方法，其特征在于，包括以下步骤：将具有上述组成的不锈钢板进行热轧制成的钢板在Ac 3点〜1000℃的温度下进行奥氏体化，使钢 盘子; 使淬火钢板在550℃至Ac1点的温度下进行最终回火; 并冷轧钢板。

公开(公告)号：US20160300915A1

公开(公告)日：2016-10-13

申请号：US15069879

申请日：2016-03-14

申请人： Yutaka Majima ,  Toshiharu Teranishi ,  Taro Muraki ,  Daisuke Tanaka

发明人： Yutaka Majima ,  Toshiharu Teranishi ,  Taro Muraki ,  Daisuke Tanaka

IPC分类号： H01L29/41 ,  H01L29/66 ,  H01L21/288 ,  H01L29/76

CPC分类号： H01L29/413 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1607 ,  C23C18/161 ,  C23C18/44 ,  H01L21/288 ,  H01L21/76838 ,  H01L29/0673 ,  H01L29/66439 ,  H01L29/7613

摘要： A substrate 1 having metal layers 2A and 2B arranged to form a gap is dipped in an electroless plating solution mixed an electrolyte solution including metal ions with a reducing agent and a surfactant. Metal ions are reduced by the reducing agent to be precipitated on the metal layers 2A and 2B, and the surfactant is adhered to a surface of the metal on the metal layers, thereby forming a pair of electrodes 4A, 4B to be controlled to have a nanometer sized gap. These steps enable to provide a method for fabricating nanogap electrodes, a nanogap electrodes array, and a nanodevice with the same.

摘要翻译： 将具有布置成形成间隙的金属层2A和2B的基板1浸渍在将包含金属离子的电解质溶液与还原剂和表面活性剂混合的化学镀溶液中。 金属离子被还原剂还原，沉淀在金属层2A和2B上，并且表面活性剂被附着在金属层上的金属表面上，从而形成一对电极4A，4B以控制成具有 纳米尺寸差距。 这些步骤使得能够提供用于制造纳米间隙电极，纳米隙电极阵列和具有该纳米间隙电极的纳米器件的方法。

公开(公告)号：US20090044882A1

公开(公告)日：2009-02-19

申请号：US11921349

申请日：2006-06-09

申请人： Hitoshi Asahi ,  Taro Muraki ,  Hideyuki Nakamura ,  Eiji Tsuru

发明人： Hitoshi Asahi ,  Taro Muraki ,  Hideyuki Nakamura ,  Eiji Tsuru

IPC分类号： C21D9/08 ,  C22C38/00

CPC分类号： C22C38/002 ,  C21D1/22 ,  C21D1/25 ,  C21D9/14 ,  C21D9/50 ,  C21D2211/008 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/14

摘要： The invention provides an oil well pipe for expandable tubular applications excellent in post-expansion toughness and a method of manufacturing the oil well pipe. The oil well pipe for expandable tubular applications comprises, in mass %, C: 0.03 to 0.14%, Si: 0.8% or less, Mn: 0.3 to 2.5%, P: 0.03% or less, S: 0.01% or less, Ti: 0.005 to 0.03%, Al: 0.1% or less, N: 0.001 to 0.01%, B: 0.0005 to 0.003%, optionally comprises one or move of Nb, Ni, Mo, Cr, Cu and V, and further optionally comprises one or both of Ca and REM, satisfies the relationship A=2.7C+0.4Si+Mn+0.45Ni+0.45Cu+0.8Cr+2Mo≧1.8, has a balance of iron and unavoidable impurities, and is formed of tempered martensite structure. The manufacturing method according to the invention is characterized in subjecting a steel stock pipe of the foregoing composition to hardening from a temperature range of Ac3 point+30° C. or greater and to tempering at a temperature of 350 to 720° C.

摘要翻译： 本发明提供了一种用于后膨胀韧性优异的可膨胀管状应用的油井管和一种制造油井管的方法。 可膨胀管状的油井管以质量％计含有C：0.03〜0.14％，Si：0.8％以下，Mn：0.3〜2.5％，P：0.03％以下，S：0.01％以下，Ti ：0.005〜0.03％，Al：0.1％以下，N：0.001〜0.01％，B：0.0005〜0.003％，任选地包含Nb，Ni，Mo，Cr，Cu和V中的一种或多种， 或Ca和REM两者满足A = 2.7C + 0.4Si + Mn + 0.45Ni + 0.45Cu + 0.8Cr + 2Mo> = 1.8的关系，其余为铁和不可避免的杂质，并且由回火马氏体组织形成 。 根据本发明的制造方法的特征在于，将上述组成的钢坯管从Ac 3点+ 30℃以上的温度范围进行硬化，并在350〜720℃的温度下回火。

公开(公告)号：US06372630B1

公开(公告)日：2002-04-16

申请号：US09332154

申请日：1999-06-14

申请人： Tomoyuki Uchiyama ,  Kazuhisa Sasaki ,  Taro Muraki

发明人： Tomoyuki Uchiyama ,  Kazuhisa Sasaki ,  Taro Muraki

IPC分类号： H01L214763

CPC分类号： H01L21/76807 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76844 ,  H01L21/76877

摘要： A semiconductor device includes first and second conductive layers which are electrically connected to each other through a contact plug. A first insulating film is formed on the first conductive layer and has a first opening which reaches the surface of the first conductive layer. A second insulating film is formed on the first insulating film and has a second opening at the same position as the first opening. The contact plug is filled in the first and second openings and has the surface which is substantially flush with the surface of the second insulating film and also contains a metal having a high melting point. The second conductive layer is formed on the second insulating film and on the contact plug.

摘要翻译： 半导体器件包括通过接触插塞彼此电连接的第一和第二导电层。 在第一导电层上形成第一绝缘膜，并且具有到达第一导电层表面的第一开口。 在第一绝缘膜上形成第二绝缘膜，并且在与第一开口相同的位置处具有第二开口。 接触塞填充在第一和第二开口中，并且具有与第二绝缘膜的表面基本齐平的表面，并且还包含具有高熔点的金属。 第二导电层形成在第二绝缘膜和接触插塞上。

公开(公告)号：US20140054788A1

公开(公告)日：2014-02-27

申请号：US14003679

申请日：2012-02-28

申请人： Yutaka Majima ,  Toshiharu Teranishi ,  Taro Muraki ,  Daisuke Tanaka

发明人： Yutaka Majima ,  Toshiharu Teranishi ,  Taro Muraki ,  Daisuke Tanaka

IPC分类号： H01L29/41 ,  H01L21/288

CPC分类号： H01L29/413 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1607 ,  C23C18/161 ,  C23C18/44 ,  H01L21/288 ,  H01L21/76838 ,  H01L29/0673 ,  H01L29/66439 ,  H01L29/7613

摘要： A substrate 1 having metal layers 2A and 2B arranged to form a gap is dipped in an electroless plating solution mixed an electrolyte solution including metal ions with a reducing agent and a surfactant. Metal ions are reduced by the reducing agent to be precipitated on the metal layers 2A and 2B, and the surfactant is adhered to a surface of the metal on the metal layers, thereby forming a pair of electrodes 4A, 4B to be controlled to have a nanometer sized gap. These steps enable to provide a method for fabricating nanogap electrodes, a nanogap electrodes array, and a nanodevice with the same.

摘要翻译： 将具有布置成形成间隙的金属层2A和2B的基板1浸渍在将包含金属离子的电解质溶液与还原剂和表面活性剂混合的化学镀溶液中。 金属离子被还原剂还原，沉淀在金属层2A和2B上，并且表面活性剂被附着在金属层上的金属表面上，从而形成一对电极4A，4B以控制成具有 纳米尺寸差距。 这些步骤使得能够提供用于制造纳米间隙电极，纳米隙电极阵列和具有该纳米间隙电极的纳米器件的方法。

公开(公告)号：US6162307A

公开(公告)日：2000-12-19

申请号：US423836

申请日：1999-11-12

申请人： Yasushi Hasegawa ,  Taro Muraki

发明人： Yasushi Hasegawa ,  Taro Muraki

IPC分类号： C21D8/00 ,  C21D8/02 ,  C22C38/00 ,  C22C38/04 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/54 ,  C21D7/13

CPC分类号： C22C38/28 ,  C21D8/0226 ,  C22C38/04 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/32

摘要： This invention provides a ferritic heat-resistant steel that can improve HAZ softening resistance, can omit heat-treatment after welding and can reduce the construction cost of a power generation plant. This ferritic heat-resistant steel contains C: 0.01 to 0.06%, Si: 0.02 to 0.80%, Mn: 0.20 to 1.50%, Cr: 0.50 to 3.00%, Mo: 0.01 to 1.50%, W: 0.01 to 3.50%, V: 0.02 to 1.00%, Nb: 0.01 to 0.50%, N: 0.001 to 0.06%, B: 0.0003 to 0.008%, Ti: 0.001 to 0.5%, Zr: 0.001 to 0.5%, or containing one of Cu: 0.1 to 2.0%, Ni: 0.1 to 2.0% and Co: 0.1 to 2.0% either individually or in combination, and limiting P to not greater than 0.030%, S to not greater than 0.010% and O to not greater than 0.020%, wherein a weight ratio of TiN and BN in the steel is controlled to 1 to 100 in terms of a value (TiN+ZrN %)/(BN %), and a mean grain diameter of BN is not greater than 1 .mu.m.

摘要翻译： PCT No.PCT / JP99 / 01226 Sec。 371日期：1999年11月12日 102（e）日期1999年11月12日PCT提交1999年3月12日PCT公布。 WO99 /​​ 46419 PCT公开号 日期1999年9月16日本发明提供一种可以提高HAZ抗软化性的铁素体耐热钢，可以省略焊接后的热处理，可以降低发电厂的施工成本。 该铁素体系耐热钢含有C：0.01〜0.06％，Si：0.02〜0.80％，Mn：0.20〜1.50％，Cr：0.50〜3.00％，Mo：0.01〜1.50％，W：0.01〜3.50％ ：0.02〜1.00％，Nb：0.01〜0.50％，N：0.001〜0.06％，B：0.0003〜0.008％，Ti：0.001〜0.5％，Zr：0.001〜0.5％，或Cu：0.1〜2.0 ％，Ni：0.1〜2.0％，Co：0.1〜2.0％，并且将P限制在不大于0.030％，S：0.010％以下，O：0.020％以下， 以TiN + ZrN％/（BN％）计，将钢中的TiN与BN的比例控制在1〜100，BN的平均粒径为1μm以下。

公开(公告)号：US06406564B1

公开(公告)日：2002-06-18

申请号：US09622083

申请日：2000-08-10

申请人： Taro Muraki ,  Yasushi Hasegawa ,  Junichi Okamoto

发明人： Taro Muraki ,  Yasushi Hasegawa ,  Junichi Okamoto

IPC分类号： C22C3818

CPC分类号： C22C38/38 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/32 ,  Y10S148/909

摘要： This invention provides a boiler steel pipe that exhibits a high creep rupture strength on a high-temperature high-pressure side and is excellent in electric weldability, and an electric welded boiler steel pipe having fewer defects at an electric welded portion. The boiler steel contains, in terms of wt %, C: 0.01 to 0.20%, Si: 0.01 to 1.0% and Mn: 0.10 to 2.0%, contains further Cr: 0.5 to 3.5%, and limits p≦0.030%, S≦0.010% and 0≦0.20%, wherein a weight ratio of (Si %)/(Mn %) or (Si %)/(Mn %+Cr %) is from 0.005 to 1.5, the balance Fe and unavoidable impurities, and the melting point of the mixed oxide of SiO2 and MnO, or SiO2, MnO and Cr2O3, is not higher than 1,600° C. The oxide that would otherwise result in the defects of the electric welded portion is molten and squeezed out as slag components. Therefore, a boiler steel excellent in electric weldability and the electric welded boiler steel pipe having fewer welding defects, excellent in creep rupture strength and toughness, and using the former, can be obtained.

摘要翻译： 本发明提供一种在高温高压侧具有高蠕变断裂强度并且电焊接性优异的锅炉钢管，以及在电焊接部分具有较少缺陷的电焊锅炉钢管。 锅炉钢以重量％计含有：C：0.01〜0.20％，Si：0.01〜1.0％，Mn：0.10〜2.0％，进一步含有Cr：0.5〜3.5％，p <= 0.030％，S <= 0.010％和0 <= 0.20％，其中（Si％）/（Mn％）或（Si％）/（Mn％+ Cr％）的重量比为0.005至1.5，余量为Fe和不可避免的杂质 ，SiO 2和MnO或SiO 2，MnO和Cr 2 O 3的混合氧化物的熔点不高于1600℃。否则会导致电焊接部分的缺陷的氧化物熔化并作为炉渣挤出 组件。 因此，可以获得具有焊接缺陷，蠕变断裂强度和韧性优异以及使用前者的电焊接性优异的电焊锅炉钢管。