摘要:
A driving mechanism using shape memory alloys comprises a first and a second shape memory alloys coils (1, 2), a pin-like drive member (3) connected to each of the shape memory alloys coils (1, 2) extending in the axis direction, a substrate (4) having a wiring pattern (11) and a drive circuit (4a) to supply current to the shape memory alloys coils (1, 2), and a magnetic latch part (9) to hold the drive member (3), and the magnetic latch part (9) has a latch position in the axis direction of the drive member (3), the drive circuit (4a) selectively current-drives the first and the second shape memory alloys coils (1, 2), the driven first or second shape memory alloys coils (1, 2) is heated and compressed to move the drive member (3) in the axis direction, and magnetic bodies (9a, 9b) provided to the drive member (3) is magnetically fixed at the latch position, thereby fixed and held in the axis direction.
摘要:
An optical fiber coil and a production method therefor reduce the likelihood of optical transmission loss due to stress or temperature changes at low cost. Plural single optical fibers are arranged in parallel and are integrally covered with a covering portion so as to form an optical fiber ribbon, and the optical fiber ribbon is wound into a coiled state.
摘要:
An optical fiber coil and a production method therefor reduce the likelihood of optical transmission loss due to stress or temperature changes at low cost. Plural single optical fibers are arranged in parallel and are integrally covered with a covering portion so as to form an optical fiber ribbon, and the optical fiber ribbon is wound into a coiled state.
摘要:
An active tube and its system are offered which can be directed by bending its tip, controlling the degree of bend, thereby easily capable of insertion into difficult positions, and which can be driven at low temperature at which it can be used for inspection and medical treatment. A bending mechanism (21) is constructed by wiring an SMA coil (21e) along an outer side of a working channel tube (21a). The bending mechanism (21) is inserted into an outer skin tube (25) with a plurality of built-in weights (22). A front tip (23) is attached to the front end side of the bending mechanism (21) as a tip (2) of an active tube (1). A main tube (4) is connected through the working channel tube (21a) at the tip (2). A wire (21g) is connected to the SMA coil (21e). Said wire (21g) is inserted to the behind end side (41) of the main tube (4) in a wiring channel (4B9 of the main tube, thereby makes it possible to drive the bending mechanism (21) from outside.
摘要:
The present invention is to provide an electrostatic chucking device having improved heat conductivity and at the same time increased adsorption area and improved adsorptity as well as having no uneveness on the wafer-provided face. The electrostatic chucking device of the present invention comprises a metal base, an adhesive layer, an electrode layer comprising a metal-deposited or metal-plated layer, and an electrically insulating layer possessing a face for providing a substance to be adhered by suction, laminated thereon in this order. The electrostatic chucking device is produced by a process comprising a stage for forming a metal-deposited or metal-plated layer on one face of a heat resistant film, a stage for providing a photoresist layer on the surface of the electrode layer, carrying out pattern exposure, development, and an etching processing, a stage for forming a semi-cured adhesive layer on the surface of the etched electrode layer, a stage for punching the formed laminated sheet according to the shape of a metal base, and stage for laminating the metal base and the laminate sheet via the above-mentioned adhesive and curing the laminated product.
摘要:
An acceleration sensor is based on a semiconductor technique which is suitable for mass production. The resulting acceleration sensor is small in size and high in precision. The acceleration sensor includes a stationary section, an acting section to which a force is applied in response to acceleration, a flexible section through which the stationary section is coupled to the acting section, a plurality of distortion sensing elements coupled to the flexible section, a first weight having a bottomed hole which is gradually smaller in width towards the bottom of the hole, the first weight being coupled to the acting section and a second weight, greater in specific gravity than the first weight, coupled to the bottom of the hole of the first weight.
摘要:
The present invention is to provide an electrostatic chucking device having improved heat conductivity and at the same time increased adsorption area and improved adsorptity as well as having no uneveness on the wafer-provided face. The electrostatic chucking device of the present invention comprises a metal base, an adhesive layer, an electrode layer comprising a metal-deposited or metal-plated layer, and an electrically insulating layer possessing a face for providing a substance to be adhered by suction, laminated thereon in this order. The electrostatic chucking device is produced by a process comprising a stage for forming a metal-deposited or metal-plated layer on one face of a heat resistant film, a stage for providing a photoresist layer on the surface of the electrode layer, carrying out pattern exposure, development, and an etching processing, a stage for forming a semi-cured adhesive layer on the surface of the etched electrode layer, a stage for punching the formed laminated sheet according to the shape of a metal base, and stage for laminating the metal base and the laminate sheet via the above-mentioned adhesive and curing the laminated product.
摘要:
An optical fiber coil and a production method therefor reduce the likelihood of optical transmission loss due to stress or temperature changes at low cost. Plural single optical fibers are arranged in parallel and are integrally covered with a covering portion so as to form an optical fiber ribbon, and the optical fiber ribbon is wound into a coiled state.
摘要:
An acceleration sensor includes a first substrate, a second substrate and a third substrate. The second substrate has a through-hole, a first contact formed on an inner surface of the through-hole, and a first bonding pad connected to the first contact. An electrically conductive ball is accommodated in the through-hole. The third substrate has a recess, a second contact formed in the recess contacting the bottom of the electrically conductive ball, and a second bonding pad connected to the second contact.
摘要:
A semiconductor acceleration sensor comprising a rectangular semiconductor substrate on the moving electrode side and a rectangular semiconductor substrate on the fixed electrode side laminated on each other, the moving electrode side substrate being formed with a heavy weight and a thin cantilever, a moving electrode being provided on the heavy weight, a first electrostatic attraction electrode being provided on the cantilever, the fixed electrode side substrate being formed with a fixed electrode at a position opposed to the moving electrode and a second electrostatic attraction electrode at a position opposed to the electrostatic attraction electrode. The first and second electrostatic attraction electrodes are placed facing each other. A predetermined spacing is provided between the electrostatic attraction electrodes and a predetermined voltage is applied therebetween.