CUTTING APPARATUS
    1.
    发明申请
    CUTTING APPARATUS 审中-公开

    公开(公告)号:US20200001418A1

    公开(公告)日:2020-01-02

    申请号:US16551023

    申请日:2019-08-26

    申请人: THE SHODA COMPANY

    发明人: Hiroshi SHODA

    摘要: To provide a cutting apparatus capable of effectively removing swarf that scatters in a machining space, while reducing cost. A cutting apparatus includes: a machining mechanism on which a tool for machining a workpiece is mounted; a placement base that is disposed to face the machining mechanism in a machining space and that is movable in a first direction with the workpiece placed thereon; an open/close covering member that extends in the first direction thereby to contain therein the placement base and to form at least part of the machining space; and a drive mechanism that is isolated from the machining space and that moves the placement base in the first direction.