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    Printable Media Sensing Device, System and Method
    1.
    发明申请
    Printable Media Sensing Device, System and Method 审中-公开
    可打印介质感应装置，系统和方法

    公开(公告)号：US20120008964A1

    公开(公告)日：2012-01-12

    申请号：US12834084

    申请日：2010-07-12

    申请人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

    发明人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

    IPC分类号： G03G15/00

    CPC分类号： G03G15/6588 ,  G03G15/5062 ,  G03G2215/00721 ,  G03G2215/00734

    摘要： Printable media sensing devices, systems and methods are disclosed herein. An array of light emitters projects light through a printable media sheet for detection by a corresponding array of light sensors. A processor is operably connected to the array of light emitters and light sensors, and is configured to activate the light emitters, and receive output signals from the light sensors, and permit the accurate detection and determination of the locations of top of form (TOF) and bottom of form (BOF) for a given printable media sheet, as well as multiple widths corresponding to such sheet. According to some embodiments, the locations of labels on a sheet may also be detected with heightened accuracy, as may regions having no labels disposed thereover.

    摘要翻译： 本文公开了可打印介质感测装置，系统和方法。 光发射器阵列通过可印刷的介质片投射光，以便由相应的光传感器阵列进行检测。 处理器可操作地连接到光发射器和光传感器阵列，并且被配置为激活光发射器并且接收来自光传感器的输出信号，并且允许精确检测和确定形式顶部（TOF）的位置， 和用于给定的可打印介质片的形状底部（BOF），以及对应于这种片材的多个宽度。 根据一些实施例，也可以以更高的精度检测片材上的标签的位置，因为在其上没有设置标签的区域。

    Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate
    3.
    发明申请
    Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate 有权
    紧凑型光学接近传感器，具有球栅阵列和窗形基板

    公开(公告)号：US20110057108A1

    公开(公告)日：2011-03-10

    申请号：US12557438

    申请日：2009-09-10

    申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

    发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

    IPC分类号： H01L27/14 ,  H01L31/167

    CPC分类号： H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H03K17/941 ,  H03K2017/9455 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

    摘要翻译： 公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。 在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器， 至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件， 分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。

    Miniaturized Optical Proximity Sensor
    4.
    发明申请
    Miniaturized Optical Proximity Sensor 有权
    小型光学接近传感器

    公开(公告)号：US20110057104A1

    公开(公告)日：2011-03-10

    申请号：US12631804

    申请日：2009-12-04

    申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

    发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

    IPC分类号： H01J40/14 ,  G01J5/00 ,  H05K3/36

    CPC分类号： G01J1/32 ,  G01J1/44 ,  H01L2224/48465 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00

    摘要： Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

    摘要翻译： 公开了一种小型化光学接近传感器的各种实施例。 在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。 在环境光传感器，光检测器，集成电路，发射器和衬底的周边部分上模制透光的红外线通过化合物。 接下来，将光学上不透光的红外线切割化合物模制到透光性红外线通过化合物上方，以提供不具有金属屏蔽但呈现非常低串扰特性的小型化光学接近传感器。

    SEMICONDUCTOR LAYER STRUCTURE
    5.
    发明申请
    SEMICONDUCTOR LAYER STRUCTURE 审中-公开
    半导体层结构

    公开(公告)号：US20100265976A1

    公开(公告)日：2010-10-21

    申请号：US12741217

    申请日：2008-10-21

    申请人： Valerie Bousquet ,  Matthias Kauer ,  Wei-Sin Tan ,  Jonathan Heffernan ,  Koji Takahashi

    发明人： Valerie Bousquet ,  Matthias Kauer ,  Wei-Sin Tan ,  Jonathan Heffernan ,  Koji Takahashi

    IPC分类号： H01S5/323 ,  H01L33/30 ,  H01L21/20

    CPC分类号： H01L21/0254 ,  H01L21/02389 ,  H01L21/02631 ,  H01S5/221 ,  H01S5/2216 ,  H01S5/2231 ,  H01S5/32341

    摘要： A III-nitride compound device which has a layer of AlInN (7) having a non-zero In content, for example acting as a current blocking layer, is described. The layer of AlInN (7) has at least aperture defined therein. The layer of AlInN (7) is grown with a small lattice-mismatch with an underlying layer, for example an underlying GaN layer, thus preventing added crystal strain in the device. By using optimised growth conditions the resistivity of the AlInN is made higher than 102 ohm·cm thus preventing current flow when used as a current blocking layer in a multilayer semiconductor device with layers having smaller resistivity. As a consequence, when the AlInN layer has an opening and is placed in a laser diode device, the resistance of the device is lower resulting in a device with better performance.

    摘要翻译： 描述了具有例如用作电流阻挡层的非零In含量的AlInN（7）层的III族氮化物复合器件。 AlInN（7）的层至少具有限定在其中的孔。 AlInN（7）的层与下层（例如下面的GaN层）以较小的晶格失配生长，从而防止在器件中增加晶体应变。 通过使用优化的生长条件，使AlInN的电阻率高于102欧姆·厘米，从而防止在具有较小电阻率层的多层半导体器件中用作电流阻挡层时的电流流动。 结果，当AlInN层具有开口并且放置在激光二极管器件中时，器件的电阻较低，导致具有更好性能的器件。

    Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly
    7.
    发明授权
    Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly 有权
    遥控接收设备和环境光光电传感器设备结合到单个复合组件中

    公开(公告)号：US07495204B2

    公开(公告)日：2009-02-24

    申请号：US11552036

    申请日：2006-10-23

    申请人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

    发明人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

    IPC分类号： G01J1/44 ,  H04B10/00 ,  H04B10/06

    CPC分类号： G08C23/04

    摘要： An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.

    摘要翻译： RC接收器装置和环境光光传感器（ALPS）装置安装在单个安装装置（例如，电路板或引线框架基板）上，使得它们是单个复合组件的一部分。 这减少了在其中安装组件的电子设备中消耗的空间量，这允许电子设备的尺寸更小。 此外，在单个复合组件中实现RC接收器装置和ALPS装置降低了与制造，组装和运输复合组件相关的成本。

    REMOTE CONTROL RECEIVER DEVICE AND AMBIENT LIGHT PHOTOSENSOR DEVICE INCORPORATED INTO A SINGLE COMPOSITE ASSEMBLY
    9.
    发明申请
    REMOTE CONTROL RECEIVER DEVICE AND AMBIENT LIGHT PHOTOSENSOR DEVICE INCORPORATED INTO A SINGLE COMPOSITE ASSEMBLY 有权
    远程控制接收器件和连接到单个复合组件中的环境光照射器件

    公开(公告)号：US20080011940A1

    公开(公告)日：2008-01-17

    申请号：US11552036

    申请日：2006-10-23

    申请人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

    发明人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

    IPC分类号： G01J1/44 ,  H04B10/06 ,  H05B37/02

    CPC分类号： G08C23/04

    摘要： An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.

    摘要翻译： RC接收器装置和环境光光传感器（ALPS）装置安装在单个安装装置（例如，电路板或引线框架基板）上，使得它们是单个复合组件的一部分。 这减少了在其中安装组件的电子设备中消耗的空间量，这允许电子设备的尺寸更小。 此外，在单个复合组件中实现RC接收器装置和ALPS装置降低了与制造，组装和运输复合组件相关的成本。

    System for identifying a characteristic of a printing media
    10.
    发明申请
    System for identifying a characteristic of a printing media 有权
    用于识别打印介质的特性的系统

    公开(公告)号：US20070278432A1

    公开(公告)日：2007-12-06

    申请号：US11443411

    申请日：2006-05-30

    申请人： Kuldeep Kumar Saxena ,  Wee Sin Tan ,  Deng Peng Chen

    发明人： Kuldeep Kumar Saxena ,  Wee Sin Tan ,  Deng Peng Chen

    IPC分类号： G01N21/86 ,  G01V8/00

    CPC分类号： G01V8/12 ,  G01N21/55

    摘要： A system for identifying a characteristic of a printing media includes a light source module that has a light emitting diode (LED) and an aspheric lens and a light detection module that has a photodetector and an aspheric lens. The light source module and light detection module are oriented with respect to a printing media such that the focusing points of the respective aspheric lenses are located at a common position on the printing media. The system differentiates between printing media types by applying light to the surface of the printing media and measuring the light that is reflected from the surface.

    摘要翻译： 用于识别打印介质的特性的系统包括具有发光二极管（LED）和非球面透镜的光源模块和具有光电检测器和非球面透镜的光检测模块。 光源模块和光检测模块相对于打印介质定向，使得各个非球面透镜的聚焦点位于打印介质上的公共位置。 该系统通过将光照射到打印介质的表面并测量从表面反射的光来区分打印介质类型。