Abstract:
There is provided a method of programming a non-volatile memory which can solve the problem of the data write system of the existing flash memory that a load capacitance of bit lines becomes large, the time required by the bit lines to reach the predetermined potential becomes longer, thereby the time required for data write operation becomes longer and power consumption also becomes large because the more the memory capacitance of memory array increases, the longer the length of bit lines becomes and the more the number of bit lines increases. In the non-volatile memory of the invention comprising the AND type memory array in which a plurality of memory cells are connected in parallel between the local bit lines and local drain lines, the local drain lines are precharged by supplying thereto a comparatively higher voltage from the common drain line side (opposite side of the main bit lines), the main bit lines are selectively precharged by applying thereto the voltage of 0V or a comparatively small voltage depending on the write data and thereafter a drain current is applied only to the selected memory cells to which data is written by applying the write voltage to the word lines in order to implant the hot electrons to the floating gate.
Abstract:
A nonvolatile semiconductor storage unit can prevent erratic sense operations in a sense latch circuit by adopting a single-end sensing system capable of reducing an area (decreasing the number of elements). There is provided a flash memory chip using the single-end sensing system and an NMOS gate sensing system together. In the single-end sensing system, the sense latch circuit is connected to one end of a global bit line to detect data on the global bit line corresponding to a threshold voltage for a memory cell. The NMOS gate sensing system uses an NMOSFET to receive data on the global bit line at a gate and drive a node for the sense latch circuit. The NMOSFET senses a sense voltage. The sense latch circuit is activated with a sufficient signal quantity ensured. An output voltage from a threshold voltage applying power supply precharges the global bit line. In this manner, it is possible to always keep a constant difference between a precharge voltage and a threshold voltage for the NMOSFET.
Abstract:
Data are generated based on additional write data input to data latch circuits (DLR and DLL) and data read from memory cells (MC) to program non-volatile memory cells in a write state into the same write state and to program non-volatile memory cells in an erase state into a write state indicated by the additional write data. The generated data are latched in the data latch circuits to perform a logical synthesis process for additional writing. Even after the additional write operation, the logically synthesized data remain in the data latch circuits, and the latched data can be reused against abnormality in writing. This eliminates the need for receiving write data again from the outside when the additional write operation is to be retried.
Abstract:
A control of a flash memory includes control for supplying a pulse-shaped voltage to each of non-volatile memory cells until a threshold voltage of the non-volatile memory cell having a first threshold voltage is changed to a second threshold voltage. The control involves a first write mode (coarse write) in which the amount of change in threshold voltage of each non-volatile memory cell, which is varied each time the pulse-shaped voltage is applied, is relatively rendered high, and a second write mode (high-accuracy write) in which the amount of change in threshold voltage thereof is relatively rendered low. As compared with the high-accuracy mode, the number of pulses required to change the threshold voltage of each memory cell is smaller than that in the coarse write mode. Therefore, the number of verify operations at the time that the coarse write mode is used, is small and hence the entire write operation can be speeded up.
Abstract:
Externally supplied program data is latched into data latch circuits DLL and DLR. A judgment is made as to whether or not the latched program data corresponds to any threshold value of multi-levels every time each of plural programing operations is carried out. The program control information corresponding to the judgment result is latched into a sense latch circuit SL. Based upon the latched program control information, the programing operation for setting threshold voltages having multi-levels to a memory cell is carried out in a stepwise manner. Even when the programing operation is ended, the externally supplied program data is left in the data latch circuit. Even when the programing operation of the memory cell is retried due to the overprograming condition, the program data is no longer required to be again received from the external device.
Abstract:
Data are generated based on additional write data input to data latch circuits (DLR and DLL) and data read from memory cells (MC) to program non-volatile memory cells in a write state into the same write state and to program non-volatile memory cells in an erase state into a write state indicated by the additional write data. The generated data are latched in the data latch circuits to perform a logical synthesis process for additional writing. Even after the additional write operation, the logically synthesized data remain in the data latch circuits, and the latched data can be reused against abnormality in writing. This eliminates the need for receiving write data again from the outside when the additional write operation is to be retried.
Abstract:
The self-refresh operation of one round of a RAM using dynamic memory cells is accomplished on the basis of the periodic pulses which are formed by an oscillating circuit substantially having no temperature dependency, and the self-refresh period is controlled by a timer circuit using a time constant circuit corresponding to the temperature dependency of the data storage in the memory cells. The operating voltage or boosted output voltage is monitored to switch the circuit operation for generating a plurality kinds of boosted voltages rising sequentially two and three times so that the boosted voltage may be a desired voltage. A control voltage to be fed to the gate of a MOSFET connected between the substrate and the earth potential of the circuit is generated by a dummy substrate voltage generator having a leakage current path varying to follow the fluctuations in a supply voltage.
Abstract:
In a nonvolatile semiconductor memory in which multiple-value information is stored in one memory cell by setting a plurality of threshold values, data is successively read from word lines while continuously changing the word-line read level from a lowest level to a highest level, and the next bit line is selectively precharged in accordance with the data stored in latch means for storing read data.
Abstract:
There is provided a method of programming a non-volatile memory which can solve the problem of the data write system of the existing flash memory that a load capacitance of bit lines becomes large, the time required by the bit lines to reach the predetermined potential becomes longer, thereby the time required for data write operation becomes longer and power consumption also becomes large because the more the memory capacitance of memory array increases, the longer the length of bit lines becomes and the more the number of bit lines increases. In the non-volatile memory of the invention comprising the AND type memory array in which a plurality of memory cells are connected in parallel between the local bit lines and local drain lines, the local drain lines are precharged by supplying thereto a comparatively higher voltage from the common drain line side (opposite side of the main bit lines), the main bit lines are selectively precharged by applying thereto the voltage of 0V or a comparatively small voltage depending on the write data and thereafter a drain current is applied only to the selected memory cells to which data is written by applying the write voltage to the word lines in order to implant the hot electrons to the floating gate.
Abstract:
Disclosed is a semiconductor memory having an internal booster, such as a flash memory, in which a situation that the program cannot escape from a writing operation can be avoided, and the writing operation can be promptly finished according to the level of an external source voltage. This semiconductor memory having an internal booster has a voltage detecting circuit (limiter LM) for detecting whether a boosted voltage has reached a predetermined potential or not and a timer capable of counting predetermined time. A control circuit applies the boosted voltage to a selected memory cell when the voltage detecting circuit detects that the boosted voltage has reached the predetermined potential and, when it is detected on the basis of counting information of the timer that the predetermined time has elapsed since the booster started the boosting operation, the control circuit applies the boosted voltage to the selected memory cell even if the boosted voltage generated by the booster has not reached the predetermined potential yet.