公开(公告)号：US08419493B2

公开(公告)日：2013-04-16

申请号：US13441229

申请日：2012-04-06

申请人： Shinichi Oe ,  Kazutaka Ikeda ,  Akira Nakamura ,  Motoaki Tamaya

发明人： Shinichi Oe ,  Kazutaka Ikeda ,  Akira Nakamura ,  Motoaki Tamaya

IPC分类号： H01J9/24

CPC分类号： H01S5/02252 ,  G02F1/377 ,  H01S5/0092 ,  H01S5/02415 ,  H01S5/06837 ,  Y10T29/49826

摘要： An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.

摘要翻译： 提供了一种用于制造光源的装置及其方法，即使使用其特性显着变化的光学元件，也能够制造高效光源。 在将激光装置和波长转换元件的温度维持在从装置和元件中的每一个发射的光的输出等于或大于最大输出的预定速率的温度下，激光装置和波长转换 将其温度保持的元件连接在一起，使得从波长转换元件发射的光的输出等于或大于预定值。

公开(公告)号：US20100260218A1

公开(公告)日：2010-10-14

申请号：US12741149

申请日：2007-12-28

申请人： Shinichi Oe ,  Motoaki Tamaya ,  Akira Nakamura ,  Keiichi Fukuda

发明人： Shinichi Oe ,  Motoaki Tamaya ,  Akira Nakamura ,  Keiichi Fukuda

IPC分类号： H01S3/042

CPC分类号： H01S3/09415 ,  G02F1/353 ,  G02F2001/3505 ,  H01S3/0092 ,  H01S3/025 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0627 ,  H01S5/02248 ,  H01S5/02469

摘要： In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.

摘要翻译： 在具有光学元件和多个散热器的激光光源装置中，光学元件直接地或通过副安装座接合，并且通过接合材料将散热器彼此接合而获得，使得光学元件 所述激光光源装置包括在所述激光光源装置的与所述激光光源装置的光的大致正交的方向上延伸的槽部，所述槽部在所述光学元件的接合面或所述副安装座 与散热器和散热器的接合表面连接以与光学元件或副安装座连接。

公开(公告)号：US20110122898A1

公开(公告)日：2011-05-26

申请号：US12852281

申请日：2010-08-06

申请人： Kazutaka IKEDA ,  Shinichi OE ,  Akira NAKAMURA ,  Motoaki TAMAYA

发明人： Kazutaka IKEDA ,  Shinichi OE ,  Akira NAKAMURA ,  Motoaki TAMAYA

IPC分类号： H01S3/10

CPC分类号： H01S3/086 ,  H01S3/025 ,  H01S3/0621 ,  H01S3/063 ,  H01S3/09415 ,  H01S3/109

摘要： Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element. A second reflector is provided that is located opposite a first reflector of the solid-state laser element and that partially transmits through the fundamental wave emitted from the solid-state laser element and reflects the rest of the wave. The semiconductor laser and the solid-state laser element are joined together at a relative position such that the output of light having passed through the second reflector reaches or exceeds a predetermined value.

摘要翻译： 因为反射从固态激光元件产生的基波形成光谐振器的反射器设置在波长转换元件的出射表面上，所以在波长转换元件为波长转换元件之前的阶段中，基波不能被谐振和放大 连接到固态激光元件。 结果，产生固体激光元件发射低电平光输出的问题，使得半导体激光器和固体激光元件的相对位置不能适当地调节。 为了克服上述问题，即使在将波长转换元件接合到固体激光元件之前的阶段中，通过适当地调整半导体激光器和固态激光元件的相对位置，能够使半导体激光器和固体激光元件接合 激光和激光元件。 提供了与固态激光元件的第一反射器相对的第二反射器，并且部分透射通过从固态激光元件发射的基波并反射波的其余部分。 半导体激光器和固体激光元件在相对位置处接合在一起，使得通过第二反射器的光的输出达到或超过预定值。

公开(公告)号：US20100260226A1

公开(公告)日：2010-10-14

申请号：US12740055

申请日：2007-12-21

申请人： Motoaki Tamaya ,  Keiichi Fukuda ,  Shinichi Oe ,  Chise Nanba ,  Akira Nakamura

发明人： Motoaki Tamaya ,  Keiichi Fukuda ,  Shinichi Oe ,  Chise Nanba ,  Akira Nakamura

IPC分类号： H01S5/42

CPC分类号： H01S5/02276 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02492 ,  H01S5/4031 ,  H01L2924/00014

摘要： A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.

摘要翻译： 散热器由导热性优异的材料制成，并安装在杆上; 副安装基板由绝缘性优异的材料制成，并安装在散热片上; 由导电性和导热性优异的材料制成的具有类似于半导体激光器阵列的线性膨胀系数的第一引线框安装在安装有半导体激光器阵列的子安装基板上，并组成 半导体激光器阵列的馈电路径; 由导电性和导热性优异的材料构成的第二引线框架与第一引线框并排配置在副安装基板上，构成半导体激光器阵列的馈电路径; 并且导线将半导体激光器阵列和第二引线框架电连接。

公开(公告)号：US08553738B2

公开(公告)日：2013-10-08

申请号：US12741149

申请日：2007-12-28

申请人： Shinichi Oe ,  Motoaki Tamaya ,  Akira Nakamura ,  Keiichi Fukuda

发明人： Shinichi Oe ,  Motoaki Tamaya ,  Akira Nakamura ,  Keiichi Fukuda

IPC分类号： H01S3/04

CPC分类号： H01S3/09415 ,  G02F1/353 ,  G02F2001/3505 ,  H01S3/0092 ,  H01S3/025 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0627 ,  H01S5/02248 ,  H01S5/02469

摘要： In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.

摘要翻译： 在具有光学元件和多个散热器的激光光源装置中，光学元件直接地或通过副安装座接合，并且通过接合材料将散热器彼此接合而获得，使得光学元件 所述激光光源装置包括在所述激光光源装置的与所述激光光源装置的光的大致正交的方向上延伸的槽部，所述槽部在所述光学元件的接合面或所述副安装座 与散热器和散热器的接合表面连接以与光学元件或副安装座连接。

公开(公告)号：US08314378B2

公开(公告)日：2012-11-20

申请号：US12782745

申请日：2010-05-19

申请人： Shinichi Oe ,  Kazutaka Ikeda ,  Akira Nakamura ,  Takayuki Yanagisawa

发明人： Shinichi Oe ,  Kazutaka Ikeda ,  Akira Nakamura ,  Takayuki Yanagisawa

IPC分类号： H01L21/66 ,  G02F1/37

CPC分类号： H01S3/0014 ,  H01S3/0092 ,  H01S3/094076 ,  H01S3/0941 ,  Y10T29/49004 ,  Y10T29/5313

摘要： A light source manufacturing apparatus, which manufactures a light source device by adhering a laser device and a wavelength converting device that converts the laser light emitted by the laser device to laser light of a different wavelength, includes a first stage that holds the wavelength converting device, a second stage that holds the laser device, a power meter that measures the amount of laser light emitted by the wavelength converting device, a light receiving device that detects the drive waveform of the laser light, and a controlling unit that changes relative positions of the first stage and the second stage in such a manner that the amount of laser light measured by the power meter is a predetermined value or greater and the drive waveform detected by the light receiving device falls within a reference range.

摘要翻译： 一种光源制造装置，其通过将激光装置和将由激光装置发射的激光转换成不同波长的激光的波长转换装置来制造光源装置，包括保持波长转换装置的第一级 ，保持激光装置的第二级，测量由波长转换装置发射的激光量的功率计，检测激光的驱动波形的光接收装置，以及改变相对位置的控制单元 第一级和第二级，使得由功率计测量的激光量为预定值或更大，并且由光接收装置检测的驱动波形落在参考范围内。

公开(公告)号：US20120263200A1

公开(公告)日：2012-10-18

申请号：US13514918

申请日：2010-12-16

申请人： Motoaki Tamaya ,  Chise Nanba ,  Takayuki Yanagisawa ,  Shinichi Oe ,  Shuhei Yamamoto ,  Akira Yokoyama

发明人： Motoaki Tamaya ,  Chise Nanba ,  Takayuki Yanagisawa ,  Shinichi Oe ,  Shuhei Yamamoto ,  Akira Yokoyama

IPC分类号： H01S3/04

CPC分类号： H01S5/02476 ,  H01L2224/48091 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4031 ,  H01L2924/00014

摘要： A laser module includes: a heat sink that releases heat from a member in contact with the heat sink; a sub-mount substrate that is disposed on the heat sink and made of an insulating material; a feeding layer that is disposed on the sub-mount substrate; and a laser diode array that has plural light-emitting portions disposed on the feeding layer in a parallel arrangement. A linear expansion coefficient of the sub-mount substrate is made smaller than a linear expansion coefficient of the laser diode array, and the linear expansion coefficient of the sub-mount substrate in a state connected to the heat sink having a larger linear expansion coefficient than the laser diode array is set to fall within a predetermined range including the linear expansion coefficient of the laser diode array.

摘要翻译： 激光模块包括：散热器，其从与散热器接触的部件释放热量; 一个设置在散热器上并由绝缘材料制成的子安装基板; 馈送层，其设置在所述副安装基板上; 以及激光二极管阵列，其以平行布置设置在馈电层上的多个发光部分。 使得副安装基板的线膨胀系数小于激光二极管阵列的线膨胀系数，并且在与散热器连接的状态下的副安装基板的线膨胀系数比线膨胀系数大 将激光二极管阵列置于包括激光二极管阵列的线膨胀系数的预定范围内。

公开(公告)号：US08284806B2

公开(公告)日：2012-10-09

申请号：US12852281

申请日：2010-08-06

申请人： Kazutaka Ikeda ,  Shinichi Oe ,  Akira Nakamura ,  Motoaki Tamaya

发明人： Kazutaka Ikeda ,  Shinichi Oe ,  Akira Nakamura ,  Motoaki Tamaya

IPC分类号： H01S3/10

CPC分类号： H01S3/086 ,  H01S3/025 ,  H01S3/0621 ,  H01S3/063 ,  H01S3/09415 ,  H01S3/109

摘要： Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element. A second reflector is provided that is located opposite a first reflector of the solid-state laser element and that partially transmits through the fundamental wave emitted from the solid-state laser element and reflects the rest of the wave. The semiconductor laser and the solid-state laser element are joined together at a relative position such that the output of light having passed through the second reflector reaches or exceeds a predetermined value.

摘要翻译： 因为反射从固态激光元件产生的基波形成光谐振器的反射器设置在波长转换元件的出射表面上，所以在波长转换元件为波长转换元件之前的阶段，基波不能被谐振和放大 连接到固态激光元件。 结果，产生固体激光元件发射低电平光输出的问题，使得半导体激光器和固体激光元件的相对位置不能适当地调节。 为了克服上述问题，即使在将波长转换元件接合到固体激光元件之前的阶段中，通过适当地调整半导体激光器和固态激光元件的相对位置，能够使半导体激光器和固体激光元件接合 激光和激光元件。 提供了与固态激光元件的第一反射器相对的第二反射器，并且部分透射通过从固态激光元件发射的基波并反射波的其余部分。 半导体激光器和固体激光元件在相对位置处接合在一起，使得通过第二反射器的光的输出达到或超过预定值。

公开(公告)号：US08233512B2

公开(公告)日：2012-07-31

申请号：US12740055

申请日：2007-12-21

申请人： Motoaki Tamaya ,  Keiichi Fukuda ,  Shinichi Oe ,  Chise Nanba ,  Akira Nakamura

发明人： Motoaki Tamaya ,  Keiichi Fukuda ,  Shinichi Oe ,  Chise Nanba ,  Akira Nakamura

IPC分类号： H01S3/04

CPC分类号： H01S5/02276 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02492 ,  H01S5/4031 ,  H01L2924/00014

摘要： A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.

摘要翻译： 散热器由导热性优异的材料制成，并安装在杆上; 副安装基板由绝缘性优异的材料制成，并安装在散热片上; 由导电性和导热性优异的材料制成的具有类似于半导体激光器阵列的线性膨胀系数的第一引线框安装在安装有半导体激光器阵列的子安装基板上，并组成 半导体激光器阵列的馈电路径; 由导电性和导热性优异的材料构成的第二引线框架与第一引线框并排配置在副安装基板上，构成半导体激光器阵列的馈电路径; 并且导线将半导体激光器阵列和第二引线框架电连接。

公开(公告)号：US20110007762A1

公开(公告)日：2011-01-13

申请号：US12866918

申请日：2008-03-14

申请人： Keiichi Fukuda ,  Motoaki Tamaya ,  Shinichi Oe ,  Tsuneo Hamaguchi ,  Akira Nakamura

发明人： Keiichi Fukuda ,  Motoaki Tamaya ,  Shinichi Oe ,  Tsuneo Hamaguchi ,  Akira Nakamura

IPC分类号： H01S3/04 ,  H05K7/20

CPC分类号： H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02492 ,  H01S5/4031

摘要： To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.

摘要翻译： 为了构成其中梳形底座固定在散热器上的光学模块，并且具有光学功能单元的装置安装在梳形基座上，应力缓冲块可以缓和作用在散热片和 梳形底座放置在散热器和梳形底座之间。 利用这种构造，松弛在梳状基座和安装在其上的装置之间的热应力，结果，增强了梳状基座与装置之间的接合部分的长期可靠性。