公开(公告)号：US06926849B2

公开(公告)日：2005-08-09

申请号：US10432844

申请日：2001-11-29

Applicant: Toshihiko Taguchi ,  Kunihito Takaura ,  Setsuko Tadokoro ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

Inventor： Toshihiko Taguchi ,  Kunihito Takaura ,  Setsuko Tadokoro ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  B23K35/36 ,  H01B1/02 ,  B23K35/363

CPC classification number: B23K35/3613 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3603 ,  B23K35/3615 ,  B23K35/3618

Abstract: A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.

Abstract translation: 包含与含有0.5-10.0重量％的异氰脲酸或其卤代烷基酯的含有活化剂的松香基助熔剂混合的含Zn Sn，无铅焊料的粉末的焊膏可以防止形成 在回流焊接期间焊球和空隙呈现良好的可焊性。 一种焊膏，其包含与含有活化剂的松香基焊剂混合的含Ag或Zn的Sn基，无铅焊料的粉末，其中0.01-10.0重量％的水杨酰胺化合物也不会发生变化 粘度和良好的可焊性。