公开(公告)号：US20090072256A1

公开(公告)日：2009-03-19

申请号：US12000958

申请日：2007-12-19

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：US08541800B2

公开(公告)日：2013-09-24

申请号：US13140652

申请日：2009-12-21

申请人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

发明人： Seong Ah Joo ,  Hyo Jin Lee ,  Il Woo Park ,  Kyung Tae Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/50 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/3025 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.

摘要翻译： 提供了一种发光器件封装，包括：封装体，其提供芯片安装区域并且包括第一和第二引线端子; LED芯片安装在芯片安装区域上并电连接到第一和第二引线端子; 设置在所述芯片安装区域中的所述LED芯片周围的槽部; 以及由包含波长转换材料的树脂形成的波长转换部分，用于封装LED芯片并具有由凹槽部分限定的外形。

公开(公告)号：US08445927B2

公开(公告)日：2013-05-21

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L21/50

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

公开(公告)号：US08168997B2

公开(公告)日：2012-05-01

申请号：US12192175

申请日：2008-08-15

申请人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

发明人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H05K1/09 ,  H05K3/24 ,  H05K2201/10106 ,  H01L2924/00014

摘要： Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

摘要翻译： 提供了一种包括印刷电路板（PCB）的LED封装; 导电结构，其形成在PCB上并且由选自硅结构和铝结构中的任何一种构成; 以及安装在PCB上并通过导电结构电连接到PCB的LED芯片。

公开(公告)号：US08143634B2

公开(公告)日：2012-03-27

申请号：US12000958

申请日：2007-12-19

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：US07705278B2

公开(公告)日：2010-04-27

申请号：US12000959

申请日：2007-12-19

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

IPC分类号： G01J1/32 ,  G09G3/36

CPC分类号： G01J5/60 ,  G01J1/32 ,  G01J2001/4252

摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.

摘要翻译： 提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED） 具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

公开(公告)号：US20090085052A1

公开(公告)日：2009-04-02

申请号：US12207615

申请日：2008-09-10

申请人： Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi ,  Seong Ah Joo ,  Jung Kyu Park

发明人： Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi ,  Seong Ah Joo ,  Jung Kyu Park

IPC分类号： H01L33/00

CPC分类号： H01L33/0075 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16

摘要： The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form.Further, the present invention provides a method of manufacturing the GaN type LED device.

摘要翻译： 本发明涉及GaN型LED器件及其制造方法。 更具体地，提供了包括LED芯片的GaN型LED器件; 以及通过粘合剂层与LED芯片共晶结合的底座，其中，所述粘合层通过焊接多个金属层构成，其中第一金属层和第二金属层依次层叠，并且形成所述第二金属层 以糊状形式。 此外，本发明提供一种制造GaN型LED器件的方法。

公开(公告)号：US08132953B2

公开(公告)日：2012-03-13

申请号：US12244393

申请日：2008-10-02

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

IPC分类号： F21V7/04

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

公开(公告)号：US08507299B2

公开(公告)日：2013-08-13

申请号：US12785024

申请日：2010-05-21

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US20100227424A1

公开(公告)日：2010-09-09

申请号：US12785024

申请日：2010-05-21

申请人： Seong Ah JOO ,  Chang Hoon KWAK ,  Na Na PARK ,  Il Woo PARK

发明人： Seong Ah JOO ,  Chang Hoon KWAK ,  Na Na PARK ,  Il Woo PARK

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.