公开(公告)号：US07301767B2

公开(公告)日：2007-11-27

申请号：US11259314

申请日：2005-10-26

Applicant: Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

Inventor： Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

IPC: G06F1/20

CPC classification number: G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).

Abstract translation: 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，连接装置，并且用于根据壳体中的温度将散热器连接到壳体，并且 形成从电子部件到壳体的热传导路径，以及用于使冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。

公开(公告)号：US5703582A

公开(公告)日：1997-12-30

申请号：US627663

申请日：1996-04-01

Applicant: Seiji Koyama ,  Tohru Nozawa ,  Asao Terukina ,  Yasusuke Suzuki

Inventor： Seiji Koyama ,  Tohru Nozawa ,  Asao Terukina ,  Yasusuke Suzuki

IPC: H04N9/00 ,  H03M1/10 ,  H03M1/74 ,  H03M1/70

CPC classification number: H03M1/1023 ,  H03M1/742

Abstract: A D/A converter of a current output type desirably compensates for changes in the switching characteristic that arise in each constant current circuit. The D/A converter generates an analog output current that is in response to the level of input digital data and outputs it from an output side by switching each of output currents of a plurality of constant current circuits either to the output side or to a non-output side, in response to the input digital data. The D/A converter performs feedback control, for values of the output currents for the constant current circuits, based on an analog output current at the non-output side during a period when the output currents of all of the constant current circuits are connected to the non-output sides.

Abstract translation: 电流输出型的D / A转换器理想地补偿每个恒流电路中产生的开关特性的变化。 D / A转换器产生模拟输出电流，其响应于输入数字数据的电平并且通过将多个恒定电流电路的每个输出电流切换到输出侧或非输出侧而从输出侧输出， 输出端，响应输入的数字数据。 D / A转换器根据所有恒流电路的输出电流连接到非输出侧的模拟输出电流，对恒定电流电路的输出电流值进行反馈控制 非输出端。

公开(公告)号：US5745083A

公开(公告)日：1998-04-28

申请号：US846169

申请日：1997-04-29

Applicant: Masahiro Uematsu ,  Nobuharu Takahashi ,  Takashi Ojima ,  Hiroaki Kawaguchi ,  Yutaka Arai ,  Yoshikazu Takahashi ,  Seiji Koyama

Inventor： Masahiro Uematsu ,  Nobuharu Takahashi ,  Takashi Ojima ,  Hiroaki Kawaguchi ,  Yutaka Arai ,  Yoshikazu Takahashi ,  Seiji Koyama

IPC: H01P3/12 ,  H01P11/00 ,  H01Q13/10 ,  H01Q13/20 ,  H01Q21/00 ,  H01Q21/06

CPC classification number: H01Q13/10 ,  H01Q21/005 ,  H01Q21/068 ,  Y10T29/49016

Abstract: A slotted leaky waveguide array antenna comprises a flat, thin bottom plate made of a metallic material; a flat, thin slotted plate made of a metallic material, and disposed parallel with the bottom plate at a predetermined distance from the bottom plate to form a space between the slotted plate and the bottom plate, the slotted plate being formed with a plurality of slots arranged in substantially parallel rows extending in a predetermined guide axial direction; a plurality of flat, thin side walls made of a metallic material and arranged in the space so as to partition the space between the bottom plate and the slotted plate into a plurality of waveguides communicating with each other and including radiation waveguides extending in parallel in the guide axial direction, a lower surface of each of the side walls being fixed to the bottom plate and an upper surface thereof being fixed to the slotted plate; and an electrically conductive adhesive agent layer between the upper surface of each of the side walls and the slotted plate for fixing them to each other.

Abstract translation: 开槽泄漏波导阵列天线包括由金属材料制成的扁平薄底板; 由金属材料制成的扁平薄的开槽板，并且与底板平行地设置在与底板预定距离处，以在开槽板和底板之间形成空间，开槽板形成有多个槽 布置成沿预定的导向轴向延伸的大致平行的行; 多个由金属材料制成并且布置在该空间中的平坦且薄的侧壁，以将底板和开槽板之间的空间分隔成彼此连通的多个波导，并且包括彼此平行延伸的辐射波导 引导轴向，每个侧壁的下表面固定到底板，并且其上表面固定到开槽板; 以及在每个侧壁的上表面和开槽板之间的导电粘合剂层，用于将它们彼此固定。

公开(公告)号：US07480141B2

公开(公告)日：2009-01-20

申请号：US11837637

申请日：2007-08-13

Applicant: Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

Inventor： Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

IPC: H05K7/20 ,  G02F1/1333

CPC classification number: G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).

Abstract translation: 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，用于根据壳体中的温度将散热器连接到壳体的连接装置，以及用于形成 从电子部件到壳体的热传导路径，以及用于将冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。

公开(公告)号：US20060126289A1

公开(公告)日：2006-06-15

申请号：US11259314

申请日：2005-10-26

Applicant: Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

Inventor： Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

IPC: G06F1/20

CPC classification number: G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).

Abstract translation: 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，连接装置，并且用于根据壳体中的温度将散热器连接到壳体，并且 形成从电子部件到壳体的热传导路径，以及用于使冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。

公开(公告)号：US20070291451A1

公开(公告)日：2007-12-20

申请号：US11837637

申请日：2007-08-13

Applicant: Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

Inventor： Hiroyuki Takenoshita ,  Hideki Sasaki ,  Tomohisa Nakamura ,  Seiji Koyama

IPC: H05K7/20

CPC classification number: G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).

Abstract translation: 本发明的电子设备包括壳体和基板，安装在基板上的电子部件，连接到电子部件的散热器，用于根据壳体中的温度将散热器连接到壳体的连接装置，以及用于形成 从电子部件到壳体的热传导路径，以及用于将冷却空气流入壳体的风扇。 基板，电子部件，散热器，连接装置和风扇布置在壳体中。 根据温度，除了使用风扇的冷却（辐射）操作之外，连接装置还促进从散热器向具有大的辐射面积的壳体的热传递。 结果，在操作期间促进壳体内的电子部件的冷却。 通过这种冷却效果，本发明提高了电子部件（特别是中央处理单元）的发热的可靠性和安全性。

公开(公告)号：US5748023A

公开(公告)日：1998-05-05

申请号：US668887

申请日：1996-06-24

Applicant: Martin Hassner ,  Seiji Koyama ,  Tohru Nozawa ,  Asao Terukina ,  Tamura Tetsuya

Inventor： Martin Hassner ,  Seiji Koyama ,  Tohru Nozawa ,  Asao Terukina ,  Tamura Tetsuya

IPC: G06G7/18 ,  G06G7/184 ,  G11B5/012 ,  G11B5/027 ,  G11B5/035 ,  G11B5/09 ,  G11B20/10 ,  H03F3/34 ,  G06G7/64

CPC classification number: G06G7/184 ,  G11B20/10009 ,  G11B5/012 ,  G11B5/035 ,  G11B5/09

Abstract: An integrator is disclosed that is capable of outputting the same integration result with respect to the same bit pattern even if there are fluctuations in the integrating period, semiconductor device process, or the power supply voltage. The disclosed integrator includes: (1) a first integrator having a first amplifier, for integrating a reference voltage during an integrating period, (2) a second integrator having a second amplifier, for integrating an input signal during the integrating period, and (3) control means for outputting a signal regulating a gain of the first amplifier to the first amplifier so that an output of the first integrator varies in correspondence with the integrating period, and for regulating a gain of the second amplifier by means of the signal.

Abstract translation: 公开了即使在积分周期，半导体器件处理或电源电压中存在波动的情况下也能够输出与相同位图案相同的积分结果的积分器。 所公开的积分器包括：（1）具有第一放大器的第一积分器，用于在积分周期期间积分参考电压，（2）具有第二放大器的第二积分器，用于在积分周期期间积分输入信号;以及（3 ）控制装置，用于将调节第一放大器的增益的信号输出到第一放大器，使得第一积分器的输出根据积分周期而变化，并且用于通过该信号调节第二放大器的增益。