Abstract:
A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.
Abstract:
The present invention provides a preparation method of tea water comprising the following steps of: inactivating enzymes of raw tea leaves and juicing the tea leaves to obtain a tea juice; and removing ions of the tea juice obtained from the previous step to obtain tea water. In addition, the present invention provides tea water obtained by removing ions from a tea juice of raw tea leaves of which enzymes are inactivated. Skin-stimulating components are reduced in the tea water.
Abstract:
The present invention relates to a whitening cosmetic composition containing a green tea extract and, more particularly, to a whitening cosmetic composition containing a green tea extract that is prepared from green tea leaves by hot water extraction and liquid culture with Aspergillus oryzae to provide a high inhibitory effect on tyrosinase.
Abstract:
The present invention relates to a whitening cosmetic composition containing a green tea extract and, more particularly, to a whitening cosmetic composition containing a green tea extract that is prepared from green tea leaves by hot water extraction and liquid culture with Aspergillus oryzae to provide a high inhibitory effect on tyrosinase.