摘要:
A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
摘要:
The present invention provides novel virus vaccines with augmented, e.g., enhanced and/or extended immunogenicity. The virus vaccines of the invention comprise an envelope-bound immunomodulatory protein, e.g., a cytokine, chemokine or costimulatory molecule. The immunomodulatory protein serves as an adjuvant to augment, e.g., enhance or extend the immunogenicity of the virus vaccine, thereby augmenting, e.g., enhancing or extending immune response to the virus when administered to a subject.
摘要:
A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.