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    Morphing fillers and thermal interface materials
    2.
    再颁专利
    Morphing fillers and thermal interface materials 有权
    变形填料和热界面材料

    公开(公告)号：USRE39992E1

    公开(公告)日：2008-01-01

    申请号：US11122210

    申请日：2005-05-04

    申请人： Sanjay Misra ,  GM Fazley Elahee

    发明人： Sanjay Misra ,  GM Fazley Elahee

    IPC分类号： C08K3/08

    CPC分类号： H01L2924/3011

    摘要： A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.

    摘要翻译： 一种在低于约120℃的温度下包含一定数量的镓和/或铟合金液体的导热机械柔性焊盘，以及掺入液态金属合金中的氮化硼颗粒固体以形成糊状物。 然后将该膏与一定量的基质形成可流动的塑料树脂如微蜡，硅蜡或其它硅氧烷聚合物，以形成导热机械柔性垫，该柔性垫包括约10％至90％的金属合金 涂布颗粒，平衡可流动的塑料树脂。

    Thermally conductive interface layers
    4.
    发明授权
    Thermally conductive interface layers 失效
    导热界面层

    公开(公告)号：US6165612A

    公开(公告)日：2000-12-26

    申请号：US312414

    申请日：1999-05-14

    申请人： Sanjay Misra

    发明人： Sanjay Misra

    IPC分类号： C08L81/06 ,  H01L23/373 ,  B32B15/04

    CPC分类号： C08L81/06 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T428/249994 ,  Y10T428/249998 ,  Y10T428/2804 ,  H01L2924/00

    摘要： An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with a particulate solid such as alumina, boron nitride, graphite, silicon carbide, diamond, metal powders, and mixtures or blends thereof. Advantageous formulations include up to 45% alumina. Another advantageous formulation includes between 10% and 20% by weight of boron nitride, balance polyphenylsulfone.

    摘要翻译： 用于与固态电子部件组合使用的改进的接口焊盘或层，其适于沿着电子设备和安装底盘或散热器表面之间的散热路径插入。 界面垫包括与诸如氧化铝，氮化硼，石墨，碳化硅，金刚石，金属粉末和其混合物或其混合物的颗粒固体共混的聚苯砜粘合剂或基质。 有利的配方包括高达45％的氧化铝。 另一有利的制剂包括10重量％至20重量％的氮化硼，余量为聚苯砜。

    Thermally and electrically conductive interconnect structures
    7.
    发明授权
    Thermally and electrically conductive interconnect structures 有权
    导热和导电互连结构

    公开(公告)号：US07760507B2

    公开(公告)日：2010-07-20

    申请号：US11964197

    申请日：2007-12-26

    申请人： Radesh Jewram ,  Sanjay Misra

    发明人： Radesh Jewram ,  Sanjay Misra

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.

    摘要翻译： 一种互连结构，用于在第一主体和第二主体之间可操作地布置，其中所述互连结构包括用于与所述第一主体可操作并置的第一表面，用于与所述第二主体可操作并置的第二表面，以及在所述第一主体 和第二表面。 所述互连结构包括第一导热材料和第二导电材料，其中所述第二导电材料形成为一个或多个不同结构，所述结构通过所述厚度尺寸形成所述第二材料的至少一个基本上连续的路径。 互连结构沿厚度轴线显示小于约100psi的压缩模量。

    Thermally and electrically conductive interconnect structures
    8.
    发明申请
    Thermally and electrically conductive interconnect structures 有权
    导热和导电互连结构

    公开(公告)号：US20090168354A1

    公开(公告)日：2009-07-02

    申请号：US11964197

    申请日：2007-12-26

    申请人： Radesh Jewram ,  Sanjay Misra

    发明人： Radesh Jewram ,  Sanjay Misra

    IPC分类号： H05K7/20 ,  H01B5/00

    CPC分类号： H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.

    摘要翻译： 一种互连结构，用于在第一主体和第二主体之间可操作地布置，其中所述互连结构包括用于与所述第一主体可操作并置的第一表面，用于与所述第二主体可操作并置的第二表面，以及在所述第一主体 和第二表面。 所述互连结构包括第一导热材料和第二导电材料，其中所述第二导电材料形成为一个或多个不同结构，所述结构通过所述厚度尺寸形成所述第二材料的至少一个基本上连续的路径。 互连结构沿厚度轴线显示小于约100psi的压缩模量。

    Thermal diffusion apparatus
    9.
    发明授权
    Thermal diffusion apparatus 有权
    热扩散装置

    公开(公告)号：US06898084B2

    公开(公告)日：2005-05-24

    申请号：US10621697

    申请日：2003-07-17

    申请人： Sanjay Misra

    发明人： Sanjay Misra

    IPC分类号： F28F20060101 ,  H01L23/367 ,  H01L23/373 ,  H01L23/50 ,  H05K7/20

    CPC分类号： H01L23/367 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： An apparatus for operably conveying heat away from a heat source includes a thermally conductive substrate having a thickness defining a planar boundary thereof, and an insert portion disposed in the substrate and being positioned so as not to extend beyond the planar boundary. The insert portion is a material having a thermal conductivity value of at least 1.5 times that of the substrate material along at least two axial directions, with one of such axial directions extending substantially perpendicularly to first and second opposed sides of the substrate.

    摘要翻译： 从热源可操作地传递热量的装置包括具有限定其平面边界的厚度的导热基板和设置在基板中并且被定位成不延伸超过平面边界的插入部分。 插入部分是沿着至少两个轴向具有至少1.5倍于基底材料的热导率值的材料，其中一个轴向方向基本上垂直于衬底的第一和第二相对侧延伸。