Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same
    1.
    发明授权
    Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same 有权
    光敏树脂组合物,薄膜晶体管基板的制造方法以及使用该薄膜晶体管基板的公共电极基板的制造方法

    公开(公告)号:US07799509B2

    公开(公告)日:2010-09-21

    申请号:US11445846

    申请日:2006-06-02

    CPC classification number: G03F7/0233 G02F1/133707 G02F1/133711 G03F7/40

    Abstract: A photosensitive resin composition for an organic layer pattern includes about 100 parts by weight of an acryl-based copolymer and about 5 to about 100 parts by weight of a 1,2-quinonediazide compound. The acryl-based copolymer is prepared by copolymerizing about 5 to about 60 percent by weight of an isobonyl carboxylate-based compound based on a total weight of the acryl-based copolymer, about 10 to about 30 percent by weight of an unsaturated compound carrying an epoxy group, about 20 to about 40 percent by weight of an olefin-based unsaturated compound, and about 10 to about 40 percent by weight of one selected from unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, and a mixture thereof. Methods of manufacturing a TFT substrate and a common electrode substrate using the photosensitive resin composition are also provided. Advantageously, the organic layer pattern may have a mountain structure having an improved local flatness without concave and convex structures.

    Abstract translation: 用于有机层图案的感光性树脂组合物包括约100重量份的丙烯酸类共聚物和约5至约100重量份的1,2-醌二叠氮化合物。 基于丙烯酸类的共聚物通过基于丙烯酸类共聚物的总重量共聚约5至约60重量%的基于羧酸异冰片的化合物来制备,约10至约30重量%的不饱和化合物携带 约20至约40重量%的烯烃基不饱和化合物,和约10至约40重量%的选自不饱和羧酸,不饱和羧酸酐及其混合物的一种。 还提供了使用该感光性树脂组合物制造TFT基板和公共电极基板的方法。 有利地,有机层图案可以具有具有改进的局部平坦度而没有凹凸结构的山体结构。

    Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same
    2.
    发明申请
    Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same 有权
    光敏树脂组合物,薄膜晶体管基板的制造方法以及使用该薄膜晶体管基板的公共电极基板的制造方法

    公开(公告)号:US20060275700A1

    公开(公告)日:2006-12-07

    申请号:US11445846

    申请日:2006-06-02

    CPC classification number: G03F7/0233 G02F1/133707 G02F1/133711 G03F7/40

    Abstract: A photosensitive resin composition for an organic layer pattern includes about 100 parts by weight of an acryl-based copolymer and about 5 to about 100 parts by weight of a 1,2-quinonediazide compound. The acryl-based copolymer is prepared by copolymerizing about 5 to about 60 percent by weight of an isobonyl carboxylate-based compound based on a total weight of the acryl-based copolymer, about 10 to about 30 percent by weight of an unsaturated compound carrying an epoxy group, about 20 to about 40 percent by weight of an olefin-based unsaturated compound, and about 10 to about 40 percent by weight of one selected from unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, and a mixture thereof. Methods of manufacturing a TFT substrate and a common electrode substrate using the photosensitive resin composition are also provided. Advantageously, the organic layer pattern may have a mountain structure having an improved local flatness without concave and convex structures.

    Abstract translation: 用于有机层图案的感光性树脂组合物包括约100重量份的丙烯酸类共聚物和约5至约100重量份的1,2-醌二叠氮化合物。 基于丙烯酸类的共聚物通过基于丙烯酸类共聚物的总重量共聚约5至约60重量%的基于羧酸异冰片的化合物来制备,约10至约30重量%的不饱和化合物携带 约20至约40重量%的烯烃基不饱和化合物,和约10至约40重量%的选自不饱和羧酸,不饱和羧酸酐及其混合物的一种。 还提供了使用该感光性树脂组合物制造TFT基板和公共电极基板的方法。 有利地,有机层图案可以具有具有改进的局部平坦度而没有凹凸结构的山体结构。

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