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公开(公告)号：US20220117168A1
公开(公告)日：2022-04-21
申请号：US17563328
申请日：2021-12-28
发明人： Joerg Desler , David Meadows , David Athey , Casey McKay
IPC分类号： A01G9/24
摘要： An HVAC system for controlling conditions in one or more grow rooms. The HVAC system includes pumps, sensors, controller(s) and valve(s) that mitigate undesired over cooling, which may result in thermally stressing the plants. To counteract the undesired overcooling the HVAC system utilizes reheat to return grow room temperatures to optimal conditions.
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公开(公告)号：US20200236820A1
公开(公告)日：2020-07-23
申请号：US16841108
申请日：2020-04-06
发明人： David Meadows , Joerg Desler
IPC分类号： H05K7/20 , F25B49/02 , F25B45/00 , F25B43/00 , F25B41/06 , F25B39/00 , F25B5/02 , F28D1/04 , F25B41/04 , F28D7/00 , F28D7/10 , F28D1/047
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US10653042B2
公开(公告)日：2020-05-12
申请号：US15720637
申请日：2017-09-29
发明人： David Meadows , Joerg Desler
IPC分类号： H05K7/20 , F28D1/04 , F28D1/047 , F28D7/10 , F28D7/00 , F25B41/04 , F25B5/02 , F25B39/00 , F25B41/06 , F25B43/00 , F25B45/00 , F25B49/02 , F25B25/00 , F25B39/02
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US20180093291A1
公开(公告)日：2018-04-05
申请号：US15723632
申请日：2017-10-03
CPC分类号： B05B17/0607 , A61M11/005 , A61M16/16 , A61M16/161 , A61M16/162 , A61M2205/3368 , A61M2205/3382 , A61M2205/3386 , A61M2205/3553 , A61M2205/3561 , A61M2205/3584 , A61M2205/3592 , A61M2205/3606 , A61M2205/50 , A61M2205/502 , B05B9/002 , B06B1/0207 , B06B1/06 , B06B2201/20 , B06B2201/77 , F24F6/12 , G05B15/02
摘要： A humidifier includes a water supply and a nebulizer bank having a plurality of ultrasonic nebulizers, where each of the plurality of ultrasonic nebulizers is in fluid communication with the water supply and is structurally configured for breaking up water in liquid form into aerosol droplets for humidifying a volume. The humidifier may further include a controller in communication with each of the plurality of ultrasonic nebulizers to selectively activate each of the plurality of ultrasonic nebulizers independently from one another, where the controller is configured to stage activation of one or more of the plurality of ultrasonic nebulizers while accounting for at least one of: (i) a time from startup to a production of an aerosol droplet for each ultrasonic nebulizer; (ii) a threshold power consumption for the humidifier; (iii) a temperature of a component of the humidifier; and (iv) a predetermined humidity of the volume.
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公开(公告)号：US20180139870A1
公开(公告)日：2018-05-17
申请号：US15720637
申请日：2017-09-29
发明人： David Meadows , Joerg Desler
CPC分类号： H05K7/20818 , F25B5/02 , F25B25/005 , F25B39/00 , F25B39/028 , F25B41/043 , F25B41/062 , F25B43/003 , F25B45/00 , F25B49/027 , F25B2339/047 , F25B2341/0661 , F25B2400/075 , F25B2400/16 , F25B2500/28 , F25B2600/111 , F25B2600/112 , F25B2600/2513 , F25B2600/2515 , F25B2700/197 , F25B2700/2103 , F25B2700/21171 , F25B2700/21175 , F28D1/0443 , F28D1/0461 , F28D1/0477 , F28D7/0066 , F28D7/106 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20736 , Y02B30/743
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US20230204257A1
公开(公告)日：2023-06-29
申请号：US18108691
申请日：2023-02-13
发明人： David Meadows , Joerg Desler
IPC分类号： F25B5/02 , F28D1/04 , F28D1/047 , F28D7/10 , F28D7/00 , F25B41/22 , F25B39/00 , F25B43/00 , F25B45/00 , F25B49/02 , H05K7/20
CPC分类号： F25B5/02 , F25B39/00 , F25B41/22 , F25B43/003 , F25B45/00 , F25B49/027 , F28D1/0443 , F28D1/0461 , F28D1/0477 , F28D7/0066 , F28D7/106 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20736 , H05K7/20818 , F25B25/005 , F25B2339/047 , F25B2400/075 , F25B2600/112 , F25B2600/2515 , F25B2700/21171 , F25B2700/21175
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US11578897B2
公开(公告)日：2023-02-14
申请号：US16841108
申请日：2020-04-06
发明人： David Meadows , Joerg Desler
IPC分类号： F25B5/02 , F28D1/04 , F28D7/10 , F25B39/00 , F25B41/385 , F25B41/34 , H05K7/20 , F28D1/047 , F28D7/00 , F25B41/22 , F25B43/00 , F25B45/00 , F25B49/02 , F25B25/00 , F25B39/02
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US11499758B2
公开(公告)日：2022-11-15
申请号：US16841128
申请日：2020-04-06
发明人： David Meadows , Joerg Desler
IPC分类号： F25B5/02 , F28D1/04 , F28D7/10 , F25B39/00 , F25B25/00 , F25B41/385 , F25B39/02 , F28D1/047 , H05K7/20 , F28D7/00 , F25B41/22 , F25B43/00 , F25B45/00 , F25B49/02 , F25B41/34
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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公开(公告)号：US20200236821A1
公开(公告)日：2020-07-23
申请号：US16841128
申请日：2020-04-06
发明人： David Meadows , Joerg Desler
IPC分类号： H05K7/20 , F25B49/02 , F25B45/00 , F25B43/00 , F25B41/06 , F25B39/00 , F25B5/02 , F28D1/04 , F25B41/04 , F28D7/00 , F28D7/10 , F28D1/047
摘要： Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.
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