Power converter package with enhanced thermal management
    1.
    发明授权
    Power converter package with enhanced thermal management 有权
    电源转换器封装,增强了热管理功能

    公开(公告)号:US06724631B2

    公开(公告)日:2004-04-20

    申请号:US10127896

    申请日:2002-04-22

    IPC分类号: H05K720

    摘要: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.

    摘要翻译: 用于电源转换器的封装,其中所有部件与一个多层电路板电连接。 具有至少具有功率耗散芯片的子封装,具有裸露的顶部向上的热插块,通过多个对称引线与板电连接。 散热器直接连接到具有导热绝缘体的其他部件的子封装,平面磁性部件和顶表面的裸顶部热塞上。 由子封装消散的热量通过裸顶部散热片传递到附着的散热器,并进一步转移到环境中。 该组件具有紧凑且廉价的功率转换器封装,具有改进的电气性能和增强的热管理。