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公开(公告)号:US07151049B2
公开(公告)日:2006-12-19
申请号:US10816627
申请日:2004-04-02
申请人: Rozalia Beica , Neil D. Brown , Kai Wang
发明人: Rozalia Beica , Neil D. Brown , Kai Wang
CPC分类号: C25D3/60 , H01L2224/11
摘要: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
摘要翻译: 公开了用于在基材上沉积锡合金的电解质组合物。 电解质组合物包括锡离子,一种或多种合金金属的离子,酸,硫脲衍生物和选自烷醇胺,聚乙烯亚胺,烷氧基化芳族醇及其组合的添加剂。 还公开了在基板上沉积锡合金的方法以及在半导体器件上形成互连凸点的方法。
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公开(公告)号:US06508924B1
公开(公告)日:2003-01-21
申请号:US09584124
申请日:2000-05-31
申请人: Luis A. Gomez , Rozalia Beica , Denis Morrissey , Eugene N. Step
发明人: Luis A. Gomez , Rozalia Beica , Denis Morrissey , Eugene N. Step
IPC分类号: C25D2118
CPC分类号: H01L21/2885 , C25D7/12 , C25D21/12
摘要: Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
摘要翻译: 公开了用于分析电镀浴中的添加剂分解产物的方法以及在电镀浴中控制这种分解产物的存在的方法。
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