公开(公告)号：US20100315510A1

公开(公告)日：2010-12-16

申请号：US12483088

申请日：2009-06-11

申请人： Gregory J. Dunn ,  Robert T. Croswell ,  Zhiyuan Z. Li

发明人： Gregory J. Dunn ,  Robert T. Croswell ,  Zhiyuan Z. Li

IPC分类号： H04N7/18

CPC分类号： H04N5/272 ,  H04N5/2723

摘要： A device for use with an imaging system that is operable to provide an image signal based on an object disposed at a first distance from the imaging system. The imaging system includes a first camera, a second camera and a display. The first camera is operable to generate a first image signal based on the object and includes a first optics system and a first detector. The first optics system has a focal length, whereas the first detector has a resolution. The second camera is operable to generate a second image signal based on the object. The second camera includes a second optics system and a second detector. The second optics system has the same focal length of the first optics system and the second detector has the same resolution as the first detector. The second camera is separated from the first camera by a second distance. The display is operable to display an image based on a modified image. The device comprises an image processor that is operable to establish a virtual separation membrane and to output a modified image based on the first image signal, the second image signal, the virtual separation membrane, the second distance, the focal length and the resolution.

摘要翻译： 一种与成像系统一起使用的装置，其可操作以基于设置在离成像系统第一距离处的物体提供图像信号。 成像系统包括第一相机，第二相机和显示器。 第一相机可操作以基于对象生成第一图像信号，并且包括第一光学系统和第一检测器。 第一光学系统具有焦距，而第一检测器具有分辨率。 第二相机可操作以基于对象生成第二图像信号。 第二相机包括第二光学系统和第二检测器。 第二光学系统具有与第一光学系统相同的焦距，第二检测器具有与第一检测器相同的分辨率。 第二个相机与第一个相机分离第二个距离。 显示器可操作以基于修改的图像显示图像。 该装置包括图像处理器，其可操作以建立虚拟分离膜并且基于第一图像信号，第二图像信号，虚拟分离膜，第二距离，焦距和分辨率来输出修改的图像。

公开(公告)号：US07833292B2

公开(公告)日：2010-11-16

申请号：US12098593

申请日：2008-04-07

申请人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chelini ,  Robert T. Croswell

发明人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chelini ,  Robert T. Croswell

IPC分类号： H01G9/00

CPC分类号： H01G9/15 ,  H01G9/0029 ,  Y10T29/417

摘要： An improved method for forming a capacitor. The method includes providing a carrier with a channel therein, providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil, securing the metal foil into the channel with the first dielectric away from a channel floor, inserting an insulative material between the metal foil and each side wall of the channel, forming a cathode layer on the first dielectric between the insulative material, forming a conductive layer on the cathode layer and in electrical contact with the carrier, lap cutting the carrier parallel to the metal foil such that the valve metal is exposed, and dice cutting to form singulated capacitors.

摘要翻译： 一种形成电容器的改进方法。 该方法包括在其中提供具有通道的载体，在金属箔的第一面上提供具有阀金属的金属箔，其具有第一电介质，将金属箔固定到通道中，使第一电介质远离通道底板，插入 在金属箔和通道的每个侧壁之间的绝缘材料，在绝缘材料之间的第一电介质上形成阴极层，在阴极层上形成导电层并与载体电接触，将载体平行于 金属箔使得金属金属暴露，并且切割切割以形成单个电容器。

公开(公告)号：US07138068B2

公开(公告)日：2006-11-21

申请号：US11084938

申请日：2005-03-21

申请人： Gregory J. Dunn ,  Robert T. Croswell ,  Jaroslaw A. Magera ,  Jovica Savic ,  Aroon V. Tungare

发明人： Gregory J. Dunn ,  Robert T. Croswell ,  Jaroslaw A. Magera ,  Jovica Savic ,  Aroon V. Tungare

IPC分类号： H01L21/302

CPC分类号： C23F1/40 ,  C23F1/02 ,  C23F1/32 ,  C23F1/34 ,  H05K1/162 ,  H05K3/0044 ,  H05K3/025 ,  H05K3/06 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0746

摘要： A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.

公开(公告)号：US07528788B2

公开(公告)日：2009-05-05

申请号：US12174960

申请日：2008-07-17

申请人： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

发明人： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

IPC分类号： H01Q3/40

CPC分类号： H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

摘要： A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

摘要翻译： 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器 在印刷电路板（302）内。

公开(公告)号：US20080272982A1

公开(公告)日：2008-11-06

申请号：US12174960

申请日：2008-07-17

申请人： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

发明人： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

IPC分类号： H01Q15/24

CPC分类号： H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

摘要： A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

摘要翻译： 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器 在印刷电路板（302）内。

公开(公告)号：US07193838B2

公开(公告)日：2007-03-20

申请号：US10744695

申请日：2003-12-23

申请人： Gregory J. Dunn ,  Remy J. Chilini ,  Robert T. Croswell ,  Timothy B. Dean ,  Claudia V. Gamboa ,  Jovica Savic

发明人： Gregory J. Dunn ,  Remy J. Chilini ,  Robert T. Croswell ,  Timothy B. Dean ,  Claudia V. Gamboa ,  Jovica Savic

IPC分类号： H01G4/30

CPC分类号： H05K1/162 ,  H05K3/025 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

摘要： A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm2).

摘要翻译： 电介质电路板箔（400,600）包括导电金属箔层（210,660），邻近导电金属箔层的第一表面设置的结晶介电氧化物层（405,655），镍酸镧层（414） ，664）和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层（415,665）。 箔（400,600）可以粘附到印刷电路板子结构（700）上，并用于经济地制造多个嵌入式电容器，包括具有大电容密度（> 1000pf / mm 2）的隔离电容器， / SUP>）。

公开(公告)号：US20080273291A1

公开(公告)日：2008-11-06

申请号：US12098593

申请日：2008-04-07

申请人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T. Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chellni ,  Robert T. Croswell

发明人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T. Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chellni ,  Robert T. Croswell

IPC分类号： H01G9/00

CPC分类号： H01G9/15 ,  H01G9/0029 ,  Y10T29/417

摘要： An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.

摘要翻译： 一种形成电容器的改进方法。 该方法包括：在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中，使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体，使得阀金属暴露; 和骰子切割以形成单个电容器。

公开(公告)号：US06271150B1

公开(公告)日：2001-08-07

申请号：US09201447

申请日：1998-11-30

申请人： Robert T. Croswell ,  Arnold Reisman ,  Darrell L. Simpson ,  Dorota Temple ,  C. Kenneth Williams

发明人： Robert T. Croswell ,  Arnold Reisman ,  Darrell L. Simpson ,  Dorota Temple ,  C. Kenneth Williams

IPC分类号： H01L21324

CPC分类号： H01L21/02129 ,  H01L21/02126 ,  H01L21/022 ,  H01L21/02274 ,  H01L21/02337 ,  H01L21/3105 ,  H01L21/31051 ,  H01L21/31604 ,  H01L21/31625 ,  H01L29/66181

摘要： A layer of doped or undoped germanosilicate glass is formed on a substrate and the layer of germanosilicate glass is thermally treated in steam to remove germanium from the germanosilicate glass, and thereby raise the reflow temperature of the germanosilicate glass so treated. The layer of germanosilicate glass on the substrate may be a nonplanar layer of germanosilicate glass. When thermally treating the nonplanar layer of germanosilicate glass in steam, the layer of germanosilicate glass may be planarized simultaneously with the removal of germanium from the planarized germanosilicate glass. This process may be repeated to create a hierarchy of reflowed glass where each underlying layer reflows at a higher temperature than the next deposited glass layer. The steam thermal treatment step may be preceded by a thermal pretreatment of the layer of germanosilicate glass in at least one of a noble gas and nitrogen gas, to reflow the layer of germanosilicate glass. The thermal pretreating step may partially planarize the nonplanar layer of germanosilicate glass, and the thermal treating step may then fully planarize the partially planarized germanosilicate glass. Alternatively, the thermal pretreating step may fully planarize the layer of germanosilicate glass and the thermal treating step may then remove germanium from the fully planarized germanosilicate glass.

摘要翻译： 在衬底上形成一层掺杂或未掺杂的锗硅酸盐玻璃，并且将锗硅酸盐玻璃层在蒸汽中热处理以从锗硅酸盐玻璃中除去锗，从而提高如此处理的锗硅酸盐玻璃的回流温度。 基底上的锗硅酸盐玻璃层可以是锗硅酸盐玻璃的非平面层。 当在蒸汽中热处理锗硅酸盐玻璃的非平面层时，锗硅酸盐玻璃层可以与从平面化的硅酸锗玻璃中除去锗同时平坦化。 可以重复该过程以产生回流玻璃的层级，其中每个下层在比下一沉积玻璃层更高的温度下回流。 蒸汽热处理步骤之前可以在惰性气体和氮气中的至少一种中对锗硅酸盐玻璃层进行热预处理，以回流锗硅酸盐玻璃层。 热预处理步骤可以部分地平坦化锗硅酸盐玻璃的非平面层，然后热处理步骤可以使部分平坦化的硅酸锗玻璃完全平坦化。 或者，热预处理步骤可以使锗硅酸盐玻璃层完全平坦化，然后热处理步骤可以从完全平坦化的锗硅酸盐玻璃中除去锗。

公开(公告)号：US20100177460A1

公开(公告)日：2010-07-15

申请号：US12726467

申请日：2010-03-18

申请人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T. Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chelini ,  Robert T. Croswell

发明人： Keith R. Brenneman ,  Chris Wayne ,  Chris Stolarski ,  John T. Kinard ,  Alethia Melody ,  Gregory J. Dunn ,  Remy J. Chelini ,  Robert T. Croswell

IPC分类号： H01G4/008 ,  H01G4/00

CPC分类号： H01G9/15 ,  H01G9/0029

摘要： An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.

摘要翻译： 一种形成电容器的改进方法。 该方法包括：在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中，使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体，使得阀金属暴露; 和骰子切割以形成单个电容器。

公开(公告)号：US07745281B2

公开(公告)日：2010-06-29

申请号：US12031092

申请日：2008-02-14

申请人： John D. Prymak ,  Chris Stolarski ,  David Jacobs ,  Chris Wayne ,  Philip Lessner ,  John T. Kinard ,  Alethia Melody ,  Gregory Dunn ,  Robert T. Croswell ,  Remy J. Chelini

发明人： John D. Prymak ,  Chris Stolarski ,  David Jacobs ,  Chris Wayne ,  Philip Lessner ,  John T. Kinard ,  Alethia Melody ,  Gregory Dunn ,  Robert T. Croswell ,  Remy J. Chelini

IPC分类号： H01L21/8242

CPC分类号： H01G9/0029 ,  H01G9/012 ,  H01G9/0425 ,  H01G9/055 ,  H01G9/15 ,  H05K1/185 ,  Y10T29/417

摘要： An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

摘要翻译： 一种形成电容器的改进方法。 该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。