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公开(公告)号:US08652920B2
公开(公告)日:2014-02-18
申请号:US13409424
申请日:2012-03-01
Applicant: John D. Prymak , Chris Stolarski , Alethla Melody , Antony P. Chacko , Gregory J. Dunn
Inventor: John D. Prymak , Chris Stolarski , Alethla Melody , Antony P. Chacko , Gregory J. Dunn
IPC: H01L27/108 , H01G4/005
CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
Abstract translation: 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤:提供衬底并将导电箔层压在衬底上,其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对,并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号:US08125766B2
公开(公告)日:2012-02-28
申请号:US12138898
申请日:2008-06-13
Applicant: John D. Prymak , Peter Blais , George Haddox , Michael Prevallet , Jim Piller , Chris Stolarski , Chris Wayne
Inventor: John D. Prymak , Peter Blais , George Haddox , Michael Prevallet , Jim Piller , Chris Stolarski , Chris Wayne
IPC: H01G4/38
Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
Abstract translation: 一种电容器组件,其具有带有第一面和第二面的基板。 多个电容器安装在第一面上,其中每个电容器具有与第一引线相反极性的第一引线和第二引线。 桥与多个第一引线电接触。 树与桥接电接触,其中树通过基底的通孔并与第二面的第一迹线电接触。 第二迹线在第二面上,其中第二引线与第二迹线电接触。
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公开(公告)号:US20100177460A1
公开(公告)日:2010-07-15
申请号:US12726467
申请日:2010-03-18
Applicant: Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
Inventor: Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
CPC classification number: H01G9/15 , H01G9/0029
Abstract: An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.
Abstract translation: 一种形成电容器的改进方法。 该方法包括:在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中,使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体,使得阀金属暴露; 和骰子切割以形成单个电容器。
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公开(公告)号:US07745281B2
公开(公告)日:2010-06-29
申请号:US12031092
申请日:2008-02-14
Applicant: John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
Inventor: John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
IPC: H01L21/8242
CPC classification number: H01G9/0029 , H01G9/012 , H01G9/0425 , H01G9/055 , H01G9/15 , H05K1/185 , Y10T29/417
Abstract: An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
Abstract translation: 一种形成电容器的改进方法。 该方法包括以下步骤:提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极,电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。
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公开(公告)号:US20120162857A1
公开(公告)日:2012-06-28
申请号:US13409424
申请日:2012-03-01
Applicant: John D. Prymak , Chris Stolarski , Alethla Melody , Antony P. Chacko , Gregory J. Dunn
Inventor: John D. Prymak , Chris Stolarski , Alethla Melody , Antony P. Chacko , Gregory J. Dunn
CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
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公开(公告)号:US20120081834A1
公开(公告)日:2012-04-05
申请号:US13315931
申请日:2011-12-09
Applicant: John D. Prymak , Peter Par Blais , George Haddox , Michael Prevallet , Jim Piller , Chris Stolarski , Chris Wayne
Inventor: John D. Prymak , Peter Par Blais , George Haddox , Michael Prevallet , Jim Piller , Chris Stolarski , Chris Wayne
IPC: H01G4/005
Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
Abstract translation: 一种电容器组件,其具有带有第一面和第二面的基板。 多个电容器安装在第一面上,其中每个电容器具有与第一引线相反极性的第一引线和第二引线。 桥与多个第一引线电接触。 树与桥接电接触,其中树通过基底的通孔并与第二面的第一迹线电接触。 第二迹线在第二面上,其中第二引线与第二迹线电接触。
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公开(公告)号:US20110149477A1
公开(公告)日:2011-06-23
申请号:US12975662
申请日:2010-12-22
Applicant: Brandon Summey , Jeffrey Poltorak , Philip M. Lessner , Yongjian Qiu , Randolph S. Hahn , David Jacobs , Keith R. Brenneman , Albert Harrington , Chris Stolarski
Inventor: Brandon Summey , Jeffrey Poltorak , Philip M. Lessner , Yongjian Qiu , Randolph S. Hahn , David Jacobs , Keith R. Brenneman , Albert Harrington , Chris Stolarski
CPC classification number: H01G9/15 , H01G9/0029 , H01G9/012 , H01G9/048 , Y10T29/41 , Y10T29/417 , Y10T29/43
Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
Abstract translation: 描述了改进的固体电解电容器和形成固体电解电容器的方法。 该方法包括形成包括阀金属或阀金属的导电氧化物的阳极,其中阳极引线延伸部从阳极伸出。 在阳极上形成电介质,在电介质上形成阴极层。 阳极,电介质和阴极层被封装在非导电材料中,并且阳极引线延伸部暴露在外壳的外侧的侧表面处。 导电金属层粘附到阳极引线延伸部,其优选地通过将预制的固体金属端子,最优选地L形端子电连接到侧表面处的导电金属层来终止。
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公开(公告)号:US06798645B2
公开(公告)日:2004-09-28
申请号:US10759311
申请日:2004-01-16
Applicant: Brian John Melody , John Tony Kinard , Daniel F. Persico , Chris Stolarski , Phillip Michael Lessner , Qingping Chen , Kim Pritchard , Albert Kennedy Harrington , David Alexander Wheeler
Inventor: Brian John Melody , John Tony Kinard , Daniel F. Persico , Chris Stolarski , Phillip Michael Lessner , Qingping Chen , Kim Pritchard , Albert Kennedy Harrington , David Alexander Wheeler
IPC: H01G4228
CPC classification number: H01G9/012 , H01L23/49586 , H01L2224/32245 , Y10T29/417
Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
Abstract translation: 通过将热可固化预涂树脂施加到电容器的端子的一部分并用保护树脂封装元件来保护表面贴装电容器免受湿气和氧气腐蚀的方法。 预涂树脂在环境温度下基本上是刚性的,并且在高温下是柔性的,并且优选是含内酯的环氧树脂。 在用保护树脂封装电容器元件之前,可以通过刷子或擦拭器将预涂树脂施加到端子的无焊料涂层部分。
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公开(公告)号:US08675349B2
公开(公告)日:2014-03-18
申请号:US13325659
申请日:2011-12-14
Applicant: Liancai Ning , Chris Stolarski , Qun Ya
Inventor: Liancai Ning , Chris Stolarski , Qun Ya
IPC: H01G9/042
CPC classification number: H01G9/15 , H01G9/0036 , H01G9/012 , H01G9/02 , H01G9/025 , H01G9/028 , H01G9/032 , H01G9/0425 , H01G9/26 , Y10T29/43
Abstract: An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.
Abstract translation: 阐述了改进的电容器和制造改进的电容器的方法。 电容器具有平面阳极,每个阳极包括熔化端和分离端,并且阳极平行布置,每个阳极与融合端处的所有相邻阳极直接电接触。 电介质位于每个阳极的所述分离端上,其中电介质至少覆盖电容器的有效面积。 隔板分离相邻的电介质,并且相邻电介质和间隔物之间的间隙空间中的导电材料。
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公开(公告)号:US08470680B2
公开(公告)日:2013-06-25
申请号:US12180768
申请日:2008-07-28
Applicant: John D. Prymak , Chris Stolarski , Alethia Melody , Antony P. Chacko , Gregory J. Dunn
Inventor: John D. Prymak , Chris Stolarski , Alethia Melody , Antony P. Chacko , Gregory J. Dunn
IPC: H01G4/005
CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
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