Target/rotor connection for use in x-ray tube rotating anode assemblies
    1.
    发明授权
    Target/rotor connection for use in x-ray tube rotating anode assemblies 失效
    靶/转子连接用于x射线管旋转阳极组件

    公开(公告)号:US5548628A

    公开(公告)日:1996-08-20

    申请号:US321024

    申请日:1994-10-06

    IPC分类号: H01J35/10

    CPC分类号: H01J35/101 H01J2235/1006

    摘要: An improved high performance x-ray system having a rotating anode therein which includes an improved target/stem assembly comprising a metallic target and a large bore, thin-walled tubular metal stem which, when connected to a rotor body assembly, provides a rotating x-ray tube anode assembly is disclosed. An insert of an alloy, for example, tantalum alloy, is placed between the target layer and the large bore, thin-walled tubular stem and then bonded thereto to produce a composite x-ray tube target/stem assembly. The target/stem assembly is then connected to a rotor body assembly by fasteners, preferably threaded, applied through a plate connected to the tubular stem and preferably through a thermal washer to produce a rotating anode assembly having high bond strength that provides acceptable balance during x-ray tube operations.

    摘要翻译: 一种改进的高性能x射线系统,其中具有旋转阳极,其包括改进的目标/杆组件,其包括金属靶和大孔薄壁管状金属杆,当连接到转子主体组件时,其提供旋转x 公开了射线管阳极组件。 将合金例如钽合金的插入件放置在目标层和大孔,薄壁管状杆之间,然后结合到其上以产生复合X射线管靶/杆组件。 目标/杆组件然后通过紧固件连接到转子主体组件,该紧固件优选是通过连接到管状杆的板施加的螺纹,并且优选地通过热垫圈产生具有高粘合强度的旋转阳极组件,其在x期间提供可接受的平衡 射线管操作。

    Apparatus for solder joining metal tapes with improved cover
    4.
    发明授权
    Apparatus for solder joining metal tapes with improved cover 失效
    用于焊接金属带的改进盖的装置

    公开(公告)号:US5156317A

    公开(公告)日:1992-10-20

    申请号:US856425

    申请日:1992-03-23

    CPC分类号: B23K1/16 H01L39/2409

    摘要: An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes exess solder from tapes passing through the seal means.

    Method of melt forming a superconducting joint between superconducting
tapes
    5.
    发明授权
    Method of melt forming a superconducting joint between superconducting tapes 失效
    在超级磁带之间形成超导体接头的熔融方法

    公开(公告)号:US5109593A

    公开(公告)日:1992-05-05

    申请号:US561438

    申请日:1990-08-01

    IPC分类号: H01R43/00 H01L39/02 H01R43/02

    摘要: Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate is removed to form exposed sections, and the tapes are positioned so that the exposed sections are in contact. A melt zone within the exposed sections where the exposed sections are in contact is melted. The melt zone is at least large enough to provide sufficient parent-metal, superconductive alloy, and reactive-metal to form a melt that resolidifies as a continuous precipitate of the superconductive alloy. The melt resolidifies as a continuous precipitate of the superconductive alloy that is continuous with the superconductive alloy on the superconducting tape. Optionally, sections of the outer laminate material corresponding to the size of the exposed sections are bonded to the outermost surfaces of the joined exposed sections.

    System for manufacturing x-ray tubes
    6.
    发明授权
    System for manufacturing x-ray tubes 失效
    制造x射线管的系统

    公开(公告)号:US5628664A

    公开(公告)日:1997-05-13

    申请号:US538145

    申请日:1995-10-02

    IPC分类号: H01J9/385 H01J9/40

    摘要: A system for sealing a large diameter tube under vacuum including: a tube having a diameter greater than about 20 mm, a disk operatively positioned inside the tube and having a smaller diameter than the tube, a vacuum operatively connected to the tube, heating means, operatively positioned on the outside of the tube, for heating the tube to a temperature sufficient to collapse the tube onto the disk, means for positioning the disk inside the tube proximate the position of the heating means on the outside of the tube and means for cooling the tube proximate the disk sufficiently to formulate a seal between the tube and the disk where the disk collapsed onto the disk is disclosed.

    摘要翻译: 一种用于在真空下密封大直径管的系统,包括:直径大于约20mm的管,盘可操作地定位在管内并具有比管更小的直径,可操作地连接到管的真空,加热装置, 可操作地定位在管的外侧,用于将管加热到足以将管塌缩到盘上的温度;用于将盘定位在管内的加热装置的位置附近的装置和用于冷却的装置 公开了靠近盘的管道,以充分地配制管和盘之间的密封,其中盘折叠到盘上。

    Strippable mask patterning of stop-off for diffusion bond processing
    7.
    发明授权
    Strippable mask patterning of stop-off for diffusion bond processing 失效
    可剥离掩模图案化用于扩散键合处理

    公开(公告)号:US5513791A

    公开(公告)日:1996-05-07

    申请号:US218925

    申请日:1994-03-28

    IPC分类号: B23K1/20 B23K20/18 H05K3/34

    CPC分类号: B23K1/20 B23K20/18

    摘要: An improved method for forming fluid inflatable metal structures is taught. The improvement concerns the patterning of the portion of the structure to be inflated. Patterning is accomplished by first applying a strippable flexible mask coating and then scoring this coating so that a patterned portion may be removed therefrom. The parent portion is the portion of the sheet article to be inflated by subsequent processing. After the patterned portion has been removed, a stop-off is applied to the exposed surface of the first sheet. After the stop-off material has been applied, the remainder of the strippable mask is removed and washed with a detergent to remove the residue from the mask. The sheet having stop-off applied in the pattern to the first sheet is then superposed over a second sheet, and heat and pressure are applied to cause diffusion bonding between the exposed surfaces of the two sheets. Following this bonding, the portion of the sheet carrying the stop-off is inflated to give the article its final configuration.

    摘要翻译: 教导了一种用于形成流体充气金属结构的改进方法。 改进涉及要膨胀的结构的部分的图案化。 通过首先施加可剥离的柔性掩模涂层,然后对该涂层进行刻痕,从而从其中去除图案化部分,来实现图案化。 母体部分是通过后续处理来膨胀的片材制品的部分。 在图案化部分被去除之后,将停止施加到第一片材的暴露表面。 在施加停止材料之后,除去剩余的可剥离掩模并用洗涤剂洗涤以从掩模中除去残余物。 然后将以图案形式停止的第一片材​​的片材叠加在第二片材上,并且施加热和压力以引起两片材的暴露表面之间的扩散接合。 在该接合之后,承载停止的片材的部分被充气以使制品成为其最终构型。

    Method for filtering a molten solder bath
    9.
    发明授权
    Method for filtering a molten solder bath 失效
    过滤熔融焊料浴的方法

    公开(公告)号:US5176742A

    公开(公告)日:1993-01-05

    申请号:US767452

    申请日:1991-09-30

    IPC分类号: B23K1/08 B23K35/26 C22B9/02

    摘要: An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a channel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.

    摘要翻译: 用于过滤熔融焊料浴的设备包括:壳体,其具有入口端和封闭从入口端延伸到靠近出口端的过滤器装置的通道装置的出口端。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上,用于冷却流过通道装置的焊剂,而不与焊料反应。 用于过滤熔融焊料浴的方法包括:以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料,并将高纯度焊料返回到熔池中。 优选地,熔融焊料由不与焊料反应的惰性气氛保护。

    Molten solder filter
    10.
    发明授权
    Molten solder filter 失效
    熔融焊料过滤器

    公开(公告)号:US5169128A

    公开(公告)日:1992-12-08

    申请号:US880430

    申请日:1992-05-08

    IPC分类号: B23K1/08 B23K35/26 C22B9/02

    摘要: An apparatus for filtering a molten solder bath comprises, a housing having an entrance end and an exit end enclosing a chanel means extending from the entrance end to a filter means adjacent the exit end. The channel means being configured for receiving molten solder at the entrance end and directing the solder to the filter means in a turbulent flow. The filter means being configured to filter particles from the flow and direct the filtered flow to the exit end. A cooling means is positioned on the housing for cooling solder flowing through the channel means without reacting with the solder. A method for filtering a molten solder bath comprises, directing solder from the bath in a turbulent flow and cooling the flow to form a precipitate of an impurity in the molten solder. The cooled flow is filtered to remove particles and form a high-purity solder, and the high-purity solder is returned to the bath. Preferably, the molten solder is protected by an inert atmosphere that does not react with the solder.

    摘要翻译: 用于过滤熔融焊料浴的设备包括:壳体,其具有入口端和出口端,所述出口端包围从入口端延伸到靠近出口端的过滤器装置的香烟装置。 通道装置被配置为在入口端处接收熔融焊料并且以湍流将焊料引导到过滤器装置。 过滤装置被配置为从流中过滤颗粒并将过滤的流引导到出口端。 冷却装置位于壳体上,用于冷却流过通道装置的焊剂,而不与焊料反应。 用于过滤熔融焊料浴的方法包括:以湍流方式从焊锡引导焊料并冷却流动以在熔融焊料中形成杂质沉淀物。 将冷却的流过滤以除去颗粒并形成高纯度焊料,并将高纯度焊料返回到熔池中。 优选地,熔融焊料由不与焊料反应的惰性气氛保护。