摘要:
There is described a joining device (1) comprising a stamp which can be moved up and down between a lower working position and an upper loading position. For example a hot embossing film (14) and a substrate (13) arranged under the hot embossing film (14) can be arranged between the stamp and the support table (12). The support table (12) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the stamp (11) forms a rigid support in the working position. Alternatively the stamp (11) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the support table (12) forms a rigid support in the working position.
摘要:
There is described a joining device (1) comprising a stamp which can be moved up and down between a lower working position and an upper loading position. For example a hot embossing film (14) and a substrate (13) arranged under the hot embossing film (14) can be arranged between the stamp and the support table (12). The support table (12) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the stamp (11) forms a rigid support in the working position. Alternatively the stamp (11) is mounted pivotably about two pivot axes which are perpendicular to each other and which are perpendicular to the axis of movement of the stamp (11) and is pivotable by means of adjusting devices (18) about the two pivot axes, wherein the support table (12) forms a rigid support in the working position.