公开(公告)号：US20230272295A1

公开(公告)日：2023-08-31

申请号：US18016418

申请日：2021-07-19

申请人： RONDA HIGH TECH S.R.L.

发明人： Shahram ROSHANPOUR ,  Anton DANILENKO

IPC分类号： C10K3/00 ,  C10J3/64 ,  C10J3/84 ,  B01J19/12 ,  H05H1/46 ,  B01J12/00 ,  B01J19/08

CPC分类号： C10K3/008 ,  C10J3/64 ,  C10J3/84 ,  B01J19/126 ,  H05H1/4622 ,  B01J12/002 ,  B01J19/088 ,  C10J2300/0916 ,  C10J2300/1603 ,  H05H2245/10 ,  B01J2219/19

摘要： A plasma processing method for a gas comprises supplying a gas inside a cavity for plasma processing, supplying microwaves having a predetermined frequency and power in order to generate a plasma of the gas, and propagating the microwaves in the gas by means of a waveguide which communicates directly with the cavity so as to provide a plasma cracking processing operation for the gas inside the cavity (2).