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1.发明授权公开(公告)号：US08110492B2
公开(公告)日：2012-02-07
申请号：US12855904
申请日：2010-08-13
CPC分类号： H01L23/49531 , H01L23/49537 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
摘要翻译： 在本说明书中公开了具有芯片附接焊盘和引线框架的半导体封装，其通过导电丝带彼此电连接和机械连接。 这种配置减少了封装占地面积，并且还允许不同类型的管芯附接焊盘和引线框架互换，从而降低生产成本。
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2.发明申请公开(公告)号：US20100304534A1
公开(公告)日：2010-12-02
申请号：US12855904
申请日：2010-08-13
IPC分类号： H01L21/60
CPC分类号： H01L23/49531 , H01L23/49537 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
摘要翻译： 在本说明书中公开了具有芯片附接焊盘和引线框架的半导体封装，其通过导电丝带彼此电连接和机械连接。 这种配置减少了封装占地面积，并且还允许不同类型的管芯附接焊盘和引线框架互换，从而降低生产成本。
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公开(公告)号：US20090091010A1
公开(公告)日：2009-04-09
申请号：US11869307
申请日：2007-10-09
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49562 , H01L23/4952 , H01L23/49524 , H01L23/49575 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/29111 , H01L2224/2919 , H01L2224/45014 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/49111 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/157 , H01L2924/181 , H01L2924/00 , H01L2224/29116 , H01L2924/0665 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.
摘要翻译： 在本说明书中公开的是具有多个管芯的无线半导体封装件，其中至少两个管芯连接到导热和导热的散热器。 该封装提供了散热的有效手段。
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公开(公告)号：US07586179B2
公开(公告)日：2009-09-08
申请号：US11869307
申请日：2007-10-09
IPC分类号： H01L23/495 , H01L23/02 , H01L23/10 , H01L23/34
CPC分类号： H01L23/49562 , H01L23/4952 , H01L23/49524 , H01L23/49575 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/29111 , H01L2224/2919 , H01L2224/45014 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/49111 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/157 , H01L2924/181 , H01L2924/00 , H01L2224/29116 , H01L2924/0665 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.
摘要翻译： 在本说明书中公开的是具有多个管芯的无线半导体封装件，其中至少两个管芯连接到导热和导热的散热器。 该封装提供了散热的有效手段。
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公开(公告)号：US08497164B2
公开(公告)日：2013-07-30
申请号：US13548250
申请日：2012-07-13
IPC分类号： H01L21/00
CPC分类号： H01L23/492 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/36 , H01L24/40 , H01L2224/32245 , H01L2224/40245 , H01L2224/40247 , H01L2224/73263 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
摘要翻译： 半导体管芯封装。 半导体管芯封装包括具有夹子结构的预成型夹子结构组件，附接到夹子结构的半导体管芯以及覆盖夹子结构和半导体管芯的至少一部分的第一模制材料。 半导体管芯封装还包括具有管芯附接焊盘的引线框结构，其中引线框架结构附接到预成型夹结构组件。
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6.发明申请公开(公告)号：US20090102031A1
公开(公告)日：2009-04-23
申请号：US11873725
申请日：2007-10-17
IPC分类号： H01L23/495
CPC分类号： H01L23/49531 , H01L23/49537 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
摘要翻译： 在本说明书中公开了具有芯片附接焊盘和引线框架的半导体封装，其通过导电丝带彼此电连接和机械连接。 这种配置减少了封装占地面积，并且还允许不同类型的管芯附接焊盘和引线框架互换，从而降低生产成本。
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公开(公告)号：US20120329214A1
公开(公告)日：2012-12-27
申请号：US13548250
申请日：2012-07-13
IPC分类号： H01L21/50
CPC分类号： H01L23/492 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/36 , H01L24/40 , H01L2224/32245 , H01L2224/40245 , H01L2224/40247 , H01L2224/73263 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
摘要翻译： 半导体管芯封装。 半导体管芯封装包括具有夹子结构的预成型夹子结构组件，附接到夹子结构的半导体管芯以及覆盖夹子结构和半导体管芯的至少一部分的第一模制材料。 半导体管芯封装还包括具有管芯附接焊盘的引线框结构，其中引线框架结构附接到预成型夹结构组件。
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公开(公告)号：US07402462B2
公开(公告)日：2008-07-22
申请号：US11179348
申请日：2005-07-12
申请人： Ruben P. Madrid , Marvin Gestole , Erwin Victor R. Cruz , Romel N. Madatad , Arniel Jaud , Paul Armand Calo
发明人： Ruben P. Madrid , Marvin Gestole , Erwin Victor R. Cruz , Romel N. Madatad , Arniel Jaud , Paul Armand Calo
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/495
CPC分类号： H01L23/49562 , H01L21/4842 , H01L23/49503 , H01L2224/16 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/15311 , H01L2924/00
摘要： A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35. Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.
摘要翻译： 折叠框架托架具有管芯附接垫（DAP）30和一个或多个折叠边32,33,34,35。 每个折叠边缘具有一个或多个螺栓36，并且每个螺柱具有梯形末端。 折叠框架托架可以由单规格铜或铜合金制成。 可以在引线框架的相对的导轨之间形成多个折叠的框架架。 折叠的边缘用一个释放槽切割。 尖端形成在DAP的边缘，然后将尖端竖立折叠。 尖端提供与安装在DAP上的功率半导体的后表面上的端子的电连接。
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公开(公告)号：US08222718B2
公开(公告)日：2012-07-17
申请号：US12366039
申请日：2009-02-05
IPC分类号： H01L23/495
CPC分类号： H01L23/492 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/36 , H01L24/40 , H01L2224/32245 , H01L2224/40245 , H01L2224/40247 , H01L2224/73263 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
摘要翻译： 半导体管芯封装。 半导体管芯封装包括具有夹子结构的预成型夹子结构组件，附接到夹子结构的半导体管芯以及覆盖夹子结构和半导体管芯的至少一部分的第一模制材料。 半导体管芯封装还包括具有管芯附接焊盘的引线框结构，其中引线框架结构附接到预成型夹结构组件。
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10.发明授权公开(公告)号：US07800207B2
公开(公告)日：2010-09-21
申请号：US11873725
申请日：2007-10-17
IPC分类号： H01L23/495
CPC分类号： H01L23/49531 , H01L23/49537 , H01L24/37 , H01L24/39 , H01L24/45 , H01L24/48 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
摘要翻译： 在本说明书中公开了具有芯片附接焊盘和引线框架的半导体封装，其通过导电丝带彼此电连接和机械连接。 这种配置减少了封装占地面积，并且还允许不同类型的管芯附接焊盘和引线框架互换，从而降低生产成本。
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