公开(公告)号：US4775439A

公开(公告)日：1988-10-04

申请号：US516677

申请日：1983-07-25

Applicant: Richard E. Seeger, Jr. ,  Noredin H. Morgan

Inventor： Richard E. Seeger, Jr. ,  Noredin H. Morgan

IPC: H05K1/09 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  B05D5/12 ,  B29C33/40 ,  B44C1/16

CPC classification number: H05K3/207 ,  H05K3/4664 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K3/386

Abstract: A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.

Abstract translation: 一种在塑料基板上形成电路图案的低温方法，包括将可蒸发的溶剂，金属颗粒和少量粘合剂的浆料以所需的电路图案的形式施加到可移除层，蒸发溶剂，覆盖 粉末金属和粘合剂，其具有将粉末金属和载体保持在可移除层上的适当位置的粘合剂，用压力和热量层压含烃基材以引起所述粉末的压实并且通过粘合剂层将所述压实的粉末粘合到所述基底上，所述 热不足以破坏所述粘合剂，基底和可移除层，以及分离可移除层。 还公开了通过覆盖其上的粘合剂保持在可移除层上的电路图案。

公开(公告)号：US4931479A

公开(公告)日：1990-06-05

申请号：US267599

申请日：1988-11-07

Applicant: Noredin H. Morgan

Inventor： Noredin H. Morgan

IPC: C08J9/02 ,  C08J9/00 ,  C08K3/04 ,  C08K3/08 ,  C08K9/12 ,  C08L75/00 ,  C08L75/04 ,  H01B1/06 ,  H01B1/22 ,  H01B1/24 ,  H05K9/00

CPC classification number: H01B1/24 ,  C08J9/0066 ,  C08K3/04 ,  C08K3/08 ,  C08K9/12 ,  H01B1/22 ,  H05K9/0015 ,  C08J2375/04

Abstract: An electrically conductive elastomeric foam for use in EMI/RFI shielding applications, especially as a gap filler or caulk. The foam is based upon a polyurethane system wherein the electrically conductive filler is intermixed with either the isocyanate or active hydrogen containing component before reacting the two components to create the foam. The foam is lightweight, flexible, highly conductive, capable of withstanding cyclical vibration and is capable of adhering to various conductive surfaces such as metal, composites and glass. The foam is preferably room temperature curable and consists of a water activable prepolymer or quasi prepolymer system.

公开(公告)号：US5284888A

公开(公告)日：1994-02-08

申请号：US783281

申请日：1991-10-28

Applicant: Noredin H. Morgan

Inventor： Noredin H. Morgan

IPC: C09D175/04 ,  C08G18/10 ,  C08G18/50 ,  C08G18/62 ,  C08G18/80 ,  C09D5/08 ,  C09D5/24 ,  C09D175/00 ,  H01B1/22 ,  H01B1/24 ,  H05K9/00 ,  C08K3/08 ,  C08K3/10 ,  C08K5/34

CPC classification number: H05K9/0083 ,  C08G18/10 ,  C08G18/5027 ,  C08G18/6279 ,  C08G18/8051 ,  C09D5/08 ,  C09D5/24 ,  H01B1/22 ,  H01B1/24 ,  Y10T428/31551 ,  Y10T428/3158 ,  Y10T428/31605 ,  Y10T428/31609

Abstract: A corrosion inhibiting, EMI/RFI shielding composition is provided comprising a polyurethane resin which comprises a hydroxy or amine functional first polymer and an isocyanate, or isocyanurate terminated second polymer, a stabilized conductive filler, and an azole. In one embodiment of the invention a composition is provided comprising a polyurethane which comprises a fluoroolefin vinyl ether and an isocyanurate, a stabilized copper powder, and a triazole selected from the group consisting of alkyl substituted aromatic triazoles and other azoles. The invention further provides a method of composition a substrate with a composition of the invention in order to provide EMI/RFI shielding and prevent corrosion, and a substrate thus coated.

Abstract translation: 提供了一种防腐蚀EMI / RFI屏蔽组合物，其包含聚氨酯树脂，其包含羟基或胺官能的第一聚合物和异氰酸酯，或异氰脲酸酯封端的第二聚合物，稳定的导电填料和唑。 在本发明的一个实施方案中，提供了包含聚氨酯的组合物，其包含氟烯烃乙烯基醚和异氰脲酸酯，稳定化的铜粉末和选自烷基取代的芳族三唑和其它吡唑的三唑。 本发明还提供了组合具有本发明组合物的基底以提供EMI / RFI屏蔽和防止腐蚀的方法以及如此涂覆的基底。

公开(公告)号：US4946733A

公开(公告)日：1990-08-07

申请号：US222435

申请日：1988-07-21

Applicant: Richard E. Seeger, Jr. ,  Noredin H. Morgan ,  Joseph R. Landry, Jr.

Inventor： Richard E. Seeger, Jr. ,  Noredin H. Morgan ,  Joseph R. Landry, Jr.

IPC: H01B1/22 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H05K3/24

CPC classification number: H05K3/246 ,  H01B1/22 ,  H01L23/13 ,  H01L23/145 ,  H01L23/498 ,  H01L23/49883 ,  H01L2224/32225 ,  H01L2924/15311 ,  H01L2924/1532 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.

Abstract translation: 新的芯片载体型装置具有具有限定多个不同电路路径的颗粒负载油墨的基板。 电路通路带有导电金属电镀。 油墨设计有粘合剂和粘合剂装置，其用于将油墨牢固地附着到可以是有机树脂的基材上。

公开(公告)号：US4759970A

公开(公告)日：1988-07-26

申请号：US43684

申请日：1987-04-27

Applicant: Richard E. Seeger, Jr. ,  Noredin H. Morgan ,  Joseph R. Landry, Jr.

Inventor： Richard E. Seeger, Jr. ,  Noredin H. Morgan ,  Joseph R. Landry, Jr.

IPC: H01B1/22 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H05K3/24 ,  B32B3/00 ,  B32B5/16 ,  H05K1/00 ,  H05K1/18

CPC classification number: H05K3/246 ,  H01B1/22 ,  H01L23/13 ,  H01L23/145 ,  H01L23/498 ,  H01L23/49883 ,  H01L2224/32225 ,  H01L2924/1532 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.

Abstract translation: 新的芯片载体型装置具有具有限定多个不同电路路径的颗粒负载油墨的基板。 电路通路带有导电金属电镀。 油墨设计有粘合剂和粘合剂装置，其用于将油墨牢固地附着到可以是有机树脂的基材上。