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公开(公告)号:US20230039264A1
公开(公告)日:2023-02-09
申请号:US17788622
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin PARK , Ying-Won JEON , Jin-A PARK
摘要: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
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公开(公告)号:US11715601B2
公开(公告)日:2023-08-01
申请号:US17788981
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin Park , Ying-Won Jeon , Jin-A Park , Hyeon-Jin Kim , Taek-Hyeon Lee
摘要: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
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公开(公告)号:US09842697B2
公开(公告)日:2017-12-12
申请号:US14947209
申请日:2015-11-20
申请人: NUINTEK CO., LTD.
发明人: Dae Jin Park , Young Won Jeon , Ki Ju Han , Jin A Park
摘要: A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.
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公开(公告)号:US20170148570A1
公开(公告)日:2017-05-25
申请号:US14947209
申请日:2015-11-20
申请人: NUINTEK CO., LTD.
发明人: Dae Jin PARK , Young Won JEON , Ki Ju HAN , Jin A PARK
摘要: A capacitor housing case with output terminal withdrawn forward comprises: a rear plate for forming the placement space which is divided by division portion being projected longitudinally; a top plate which is vertically formed forward from a top of the rear plate; a bottom plate which is formed parallel to the top plate forward from a bottom of the rear plate; a side plate for forming the placement space having a front opening by coupling to both sides of the rear plate, a top plate and a bottom plate; and at least two fixed mount, which is exposed outside parallel to the rear plate, for having a fixation groove penetrating up and down; wherein a capacitor output terminal is extended through the front opening, and epoxy is inserted through the front opening, and the capacitor elements and the first, the second busbar-formed portion are epoxy molded.
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公开(公告)号:US11929209B2
公开(公告)日:2024-03-12
申请号:US17788622
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin Park , Ying-Won Jeon , Jin-A Park
摘要: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).
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公开(公告)号:US20230053806A1
公开(公告)日:2023-02-23
申请号:US17788816
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin PARK , Ying-Won JEON , Jin-A PARK , Hyeon-Jin KIM , Taek-Hyeon LEE
摘要: A capacitor comprises: a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
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公开(公告)号:US11935696B2
公开(公告)日:2024-03-19
申请号:US17788816
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin Park , Ying-Won Jeon , Jin-A Park , Hyeon-Jin Kim , Taek-Hyeon Lee
摘要: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
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公开(公告)号:US20230059398A1
公开(公告)日:2023-02-23
申请号:US17788981
申请日:2021-06-29
申请人: NUINTEK CO LTD
发明人: Dae-Jin PARK , Ying-Won JEON , Jin-A PARK , Hyeon-Jin KIM , Taek-Hyeon LEE
IPC分类号: H01G4/224
摘要: The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
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