公开(公告)号：US20230053806A1

公开(公告)日：2023-02-23

申请号：US17788816

申请日：2021-06-29

申请人： NUINTEK CO LTD

发明人： Dae-Jin PARK ,  Ying-Won JEON ,  Jin-A PARK ,  Hyeon-Jin KIM ,  Taek-Hyeon LEE

IPC分类号： H01G4/224 ,  H01G2/08 ,  H01G4/232

摘要： A capacitor comprises: a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.

公开(公告)号：US20230059398A1

公开(公告)日：2023-02-23

申请号：US17788981

申请日：2021-06-29

申请人： NUINTEK CO LTD

发明人： Dae-Jin PARK ,  Ying-Won JEON ,  Jin-A PARK ,  Hyeon-Jin KIM ,  Taek-Hyeon LEE

IPC分类号： H01G4/224

摘要： The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.