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公开(公告)号：US5578351A
公开(公告)日：1996-11-26
申请号：US375997
申请日：1995-01-20
Applicant: Ranganathan Shashidhar , Brian Peek , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen , Renate J. Crawford
Inventor： Ranganathan Shashidhar , Brian Peek , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen , Renate J. Crawford
IPC: C09K19/04 , G02F1/13 , G02F1/1337 , B32B27/00
CPC classification number: G02F1/133719 , G02F1/133753 , Y10T428/1014 , Y10T428/31663
Abstract: A surface for the alignment of liquid crystals containing directionally-linked groups.
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公开(公告)号：US06773865B2
公开(公告)日：2004-08-10
申请号：US10414572
申请日：2003-04-15
Applicant: Elizabeth Dobisz , Walter J. Dressick , Susan L. Brandow , Mu-San Chen
Inventor： Elizabeth Dobisz , Walter J. Dressick , Susan L. Brandow , Mu-San Chen
IPC: G03F700
Abstract: This invention discloses an anti-charging layer for beam lithography and mask fabrication. This invention reduces beam displacement and increases pattern placement accuracy. The process will be used in the beam fabrication of high-resolution lithographic masks as well as beam direct write lithography of electronic devices. The anti-charging layer is formed by the use of metal films bound to metal ligating self-assembled monolayers (SAMs) as discharge layers.
Abstract translation: 本发明公开了一种用于光束光刻和掩模制造的防充电层。 本发明减少了光束位移并增加了图案放置精度。 该过程将用于高分辨率光刻掩模的光束制造以及电子器件的光束直写光刻。 通过使用与金属结合自组装单层（SAM）作为放电层结合的金属膜形成防充电层。
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公开(公告)号：US5468597A
公开(公告)日：1995-11-21
申请号：US111640
申请日：1993-08-25
Applicant: Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
Inventor： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
IPC: C23F1/00 , C23C18/16 , C23C18/31 , C23F4/00 , G03F7/40 , H01L21/288 , H05K3/06 , H05K3/18 , G03F7/00
CPC classification number: C23C18/1605 , C23C18/1608 , C23C18/1689 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , G03F7/40
Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
Abstract translation: 本发明涉及一种以选择性图案图案化衬底的方法。 在一个实施例中，该方法包括以下步骤：在衬底表面上形成图案化的涂层，由此衬底的部分被图案化的涂层覆盖，并且衬底的部分保持未涂覆。 在至少那些没有图案化涂层的基底部分上涂覆一层结扎材料。 连接层是能够与无电镀金属催化剂连接的结合层。 然后将如此形成的制品与无电金属化催化剂接触，然后与化学镀溶液接触，以在衬底上形成图案化的金属沉积物。
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公开(公告)号：US5510216A
公开(公告)日：1996-04-23
申请号：US520554
申请日：1995-08-29
Applicant: Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
Inventor： Gary S. Calabrese , Jeffrey M. Calvert , Mu-San Chen , Walter J. Dressick , Charles S. Dulcey , Jacque H. Georger, Jr. , John F. Bohland, Jr.
IPC: C23F1/00 , C23C18/16 , C23C18/31 , C23F4/00 , G03F7/40 , H01L21/288 , H05K3/06 , H05K3/18 , G03F7/16
CPC classification number: C23C18/1605 , C23C18/1608 , C23C18/1689 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , G03F7/40
Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
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公开(公告)号：US6156232A
公开(公告)日：2000-12-05
申请号：US246216
申请日：1999-01-20
Applicant: Ranganathan Shashidhar , Kirsten A. Grueneberg , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen
Inventor： Ranganathan Shashidhar , Kirsten A. Grueneberg , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen
IPC: B82B1/00 , C03C17/30 , C03C17/42 , C09K19/52 , G02F1/1337 , C09K19/56 , B32B27/14 , C07F7/10 , G02F1/135
CPC classification number: C03C17/30 , C03C17/42 , G02F1/133719 , G02F1/133788 , Y10T428/1005 , Y10T428/1086 , Y10T428/24802
Abstract: A surface for the alignment of liquid crystals containing directionally-linked groups and compounds useful for preparing such surfaces are disclosed.
Abstract translation: 公开了用于对准含有方向性连接基团的液晶的表面和用于制备这种表面的化合物。
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Patent Agency Ranking6.发明授权Fluroropolymeric substrates with metallized surfaces and methods for producing the same 失效具有金属化表面的含氟聚合物基材及其制备方法
公开(公告)号：US5696207A
公开(公告)日：1997-12-09
申请号：US697933
申请日：1996-09-03
Applicant: Terrence G. Vargo , Jeffrey M. Calvert , Joseph A. Gardella, Jr. , Mu-San Chen
Inventor： Terrence G. Vargo , Jeffrey M. Calvert , Joseph A. Gardella, Jr. , Mu-San Chen
CPC classification number: B82Y30/00 , C08F8/42 , C23C18/1605 , C23C18/2086 , C23C18/30 , H05K3/381 , H05K3/389
Abstract: Fluoropolymeric substrates with metallized surfaces may be prepared by self-assembly of a chemisorbed layer of a metal ion-chelating organosilane onto a fluoropolymer surface after radio-frequency glow discharge plasma surface hydroxylation. The silane covalently binds an aqueous palladium catalyst and subsequent electroless deposition yields homogeneous or patterned metal deposits that exhibit excellent adhesion to the fluoropolymer.
Abstract translation: 具有金属化表面的含氟聚合物基材可以通过在射频辉光放电等离子体表面羟基化之后将金属离子螯合有机硅烷的化学吸附层自组装到含氟聚合物表面上来制备。 硅烷共价结合钯催化剂水溶液，随后的无电沉积产生均匀或图案化的金属沉积物，其对含氟聚合物表现出优异的附着力。
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公开(公告)号：US06586158B2
公开(公告)日：2003-07-01
申请号：US09864384
申请日：2001-05-25
Applicant: Elizabeth Dobisz , Walter J. Dressick , Susan L. Brandow , Mu-San Chen
Inventor： Elizabeth Dobisz , Walter J. Dressick , Susan L. Brandow , Mu-San Chen
IPC: G03F700
Abstract: This invention discloses an anti-charging layer for beam lithography and mask fabrication. This invention reduces beam displacement and increases pattern placement accuracy. The process will be used in the beam fabrication of high-resolution lithographic masks as well as beam direct write lithography of electronic devices. The anti-charging layer is formed by the use of metal films bound to metal ligating self-assembled monolayers (SAMs) as discharge layers.
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8.发明授权Patterned conducting polymer surfaces and process for preparing the same and devices containing the same 失效图案化导电聚合物表面及其制备方法和含有其的装置
公开(公告)号：US5976284A
公开(公告)日：1999-11-02
申请号：US855018
申请日：1997-05-12
Applicant: Jeffrey M. Calvert , Terrence G. Vargo , Ranganathan Shashidhar , Mu-San Chen
Inventor： Jeffrey M. Calvert , Terrence G. Vargo , Ranganathan Shashidhar , Mu-San Chen
IPC: G02F1/1333 , G02F1/1343 , G03F7/00 , H01B1/12 , H05K3/02 , H01B7/02
CPC classification number: H05K3/02 , G02F1/13439 , G03F7/00 , G03F7/0007 , H01B1/125 , H01B1/127 , H01B1/128 , H01G11/48 , H01G11/56 , G02F1/133305 , Y02E60/13
Abstract: Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by:(a) forming a surface of a conducting polymer on a surface of a substrate;(b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material;(c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; or (iii) increases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and(d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.
Abstract translation: 表现出优异性能的图案化的导电聚合物表面可以通过以下步骤制备：（a）在基材的表面上形成导电聚合物的表面; （b）以图案方式在所述导电聚合物的所述表面上形成阻挡材料的表面，以获得含有暴露的导电聚合物区域和阻挡材料区域的第一图案化表面; （c）用试剂处理所述第一图案化表面，所述试剂：（i）从暴露的导电聚合物的所述区域除去所述导电聚合物; （ii）降低所述导电聚合物在所述暴露的导电聚合物区域中的导电性; 或（iii）增加所述导电聚合物在暴露的导电聚合物的所述区域中的导电性; 和（d）去除所述阻挡材料以获得包含暴露的导电聚合物图案的第二图案化表面。
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公开(公告)号：US5948316A
公开(公告)日：1999-09-07
申请号：US559318
申请日：1995-11-15
Applicant: Ranganathan Shashidhar , Brian Peek , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen , Renate J. Crawford
Inventor： Ranganathan Shashidhar , Brian Peek , Banahalli R. Ratna , Jeffrey M. Calvert , Joel M. Schnur , Mu-San Chen , Renate J. Crawford
IPC: C09K19/04 , G02F1/13 , G02F1/1337 , C09K19/56 , C07F7/04
CPC classification number: G02F1/133719 , G02F1/133753 , Y10T428/1014 , Y10T428/31663
Abstract: A surface for the alignment of liquid crystals containing directionally-linked groups.
Abstract translation: 用于对准含有定向连接基团的液晶的表面。
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10.发明授权Fluoropolymeric substrates with metallized surfaces and methods for producing the same 失效具有金属化表面的含氟聚合物基材及其制备方法
公开(公告)号：US5945486A
公开(公告)日：1999-08-31
申请号：US939490
申请日：1997-09-29
Applicant: Terrence G. Vargo , Jeffrey M. Calvert , Joseph A. Gardella, Jr. , Mu-San Chen
Inventor： Terrence G. Vargo , Jeffrey M. Calvert , Joseph A. Gardella, Jr. , Mu-San Chen
CPC classification number: B82Y30/00 , C08F8/42 , C23C18/1605 , C23C18/2086 , C23C18/30 , H05K3/381 , H05K3/389
Abstract: Fluoropolymeric substrates with metallized surfaces may be prepared by self-assembly of a chemisorbed layer of a metal ion-chelating organosilane onto a fluoropolymer surface after radio-frequency glow discharge plasma surface hydroxylation. The silane covalently binds an aqueous palladium catalyst and subsequent electroless deposition yields homogeneous or patterned metal deposits that exhibit excellent adhesion to the fluoropolymer.
Abstract translation: 具有金属化表面的含氟聚合物基材可以通过在射频辉光放电等离子体表面羟基化之后将金属离子螯合有机硅烷的化学吸附层自组装到含氟聚合物表面上来制备。 硅烷共价结合钯催化剂水溶液，随后的无电沉积产生均匀或图案化的金属沉积物，其对含氟聚合物表现出优异的附着力。
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