公开(公告)号：US20080159691A1

公开(公告)日：2008-07-03

申请号：US11961512

申请日：2007-12-20

申请人： Motonari Aki

发明人： Motonari Aki

IPC分类号： G02B6/28

CPC分类号： H01L31/173 ,  H01L25/167 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In one embodiment, in a multi-channel optical coupling device, which is obtained by individually encapsulating a plurality of optical coupling elements within primary packages of light transmitting resin while encapsulating them within a secondary package of light blocking resin, a lead frame is provided with a common lead used to electrically interconnect the optical coupling elements, with the common lead being partially decoupled at the boundary location between the optical coupling elements.

摘要翻译： 在一个实施例中，在通过在光透射树脂的初级封装内单独地封装多个光耦合元件同时将它们封装在光阻树脂的次级封装内而获得的多通道光耦合器件中， 用于电耦合光耦合元件的公共引线，其中公共引线在光耦合元件之间的边界位置被部分解耦。

公开(公告)号：US07176473B2

公开(公告)日：2007-02-13

申请号：US10980264

申请日：2004-11-04

申请人： Motonari Aki ,  Taiji Maeda

发明人： Motonari Aki ,  Taiji Maeda

IPC分类号： G02B27/00

CPC分类号： H01L23/552 ,  H01L23/49537 ,  H01L31/0203 ,  H01L31/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optical semiconductor element includes a light-emitting element, a light-receiving element that is placed opposite to the light-emitting element, and two lead frames on which the light-emitting element and the light-receiving element are respectively die bonded. Shield plates are bent respectively toward the light-emitting element or the light-receiving element at a predetermined angle with respect to the surface of a die bonding region on the periphery of the die bonding region of the lead frames.

摘要翻译： 光学半导体元件包括发光元件，与发光元件相对放置的光接收元件，以及两个引线框，发光元件和光接收元件分别在其上结合。 屏蔽板相对于引线框架的芯片接合区域的周边上的芯片接合区域的表面以预定的角度朝向发光元件或光接收元件弯曲。

公开(公告)号：US20050116145A1

公开(公告)日：2005-06-02

申请号：US10980264

申请日：2004-11-04

申请人： Motonari Aki ,  Taiji Maeda

发明人： Motonari Aki ,  Taiji Maeda

IPC分类号： H01L23/48 ,  G01N21/00 ,  H01L23/13 ,  H01L23/495 ,  H01L23/552 ,  H01L25/00 ,  H01L31/00 ,  H01L31/0203 ,  H01L31/12

CPC分类号： H01L23/552 ,  H01L23/49537 ,  H01L31/0203 ,  H01L31/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optical semiconductor element includes a light-emitting element, a light-receiving element that is placed opposite to the light-emitting element, and two lead frames on which the light-emitting element and the light-receiving element are respectively die bonded. Shield plates are bent respectively toward the light-emitting element or the light-receiving element at a predetermined angle with respect to the surface of a die bonding region on the periphery of the die bonding region of the lead frames.

摘要翻译： 光学半导体元件包括发光元件，与发光元件相对放置的光接收元件，以及两个引线框，发光元件和光接收元件分别在其上结合。 屏蔽板相对于引线框架的芯片接合区域的周边上的芯片接合区域的表面以预定的角度朝向发光元件或光接收元件弯曲。

公开(公告)号：US07235804B2

公开(公告)日：2007-06-26

申请号：US11400220

申请日：2006-04-10

申请人： Motonari Aki

发明人： Motonari Aki

IPC分类号： G02B27/00

CPC分类号： H01L27/15 ,  H01L27/1446 ,  H01L31/153 ,  H01L31/18 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multichannel monolithic chip that has a number of photo-couplers provided on a single silicon substrate is mounted on an insulating substrate, a first cut groove is formed by dicing between a light-emitting element and a light-receiving element that constitute a photo-coupler, a transparent insulating resin is filled into the first cut groove and then a second cut groove is formed by dicing between the adjacent photo-couplers, each of the light-emitting element and the light-receiving element is electrically connected to an external terminal using a bonding wire, and the entirety of the insulating substrate is molded with a light-blocking resin.

摘要翻译： 具有设置在单个硅基板上的多个光耦合器的多通道单片芯片安装在绝缘基板上，通过在发光元件和构成光敏元件的光接收元件之间切割形成第一切割槽， 耦合器，透明绝缘树脂填充到第一切割槽中，然后通过在相邻的光耦合器之间切割形成第二切割槽，每个发光元件和光接收元件电连接到外部端子 使用接合线，并且用遮光树脂模制绝缘基板的整体。

公开(公告)号：US20060284124A1

公开(公告)日：2006-12-21

申请号：US11400220

申请日：2006-04-10

申请人： Motonari Aki

发明人： Motonari Aki

IPC分类号： G02B27/00

CPC分类号： H01L27/15 ,  H01L27/1446 ,  H01L31/153 ,  H01L31/18 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multichannel monolithic chip that has a number of photo-couplers provided on a single silicon substrate is mounted on an insulating substrate, a first cut groove is formed by dicing between a light-emitting element and a light-receiving element that constitute a photo-coupler, a transparent insulating resin is filled into the first cut groove and then a second cut groove is formed by dicing between the adjacent photo-couplers, each of the light-emitting element and the light-receiving element is electrically connected to an external terminal using a bonding wire, and the entirety of the insulating substrate is molded with a light-blocking resin.

摘要翻译： 具有设置在单个硅基板上的多个光耦合器的多通道单片芯片安装在绝缘基板上，通过在发光元件和构成光敏元件的光接收元件之间切割形成第一切割槽， 耦合器，透明绝缘树脂填充到第一切割槽中，然后通过在相邻的光耦合器之间切割形成第二切割槽，每个发光元件和光接收元件电连接到外部端子 使用接合线，并且用遮光树脂模制绝缘基板的整体。

公开(公告)号：US06784513B2

公开(公告)日：2004-08-31

申请号：US10421866

申请日：2003-04-24

申请人： Motonari Aki ,  Yoshiki Yasuda

发明人： Motonari Aki ,  Yoshiki Yasuda

IPC分类号： H01L3106

CPC分类号： H01L31/1105 ,  H01L31/167

摘要： A semiconductor light receiving device is provided, which comprises a semiconductor substrate, a collector region, a base region, and an emitter region, an insulating film covering the surface of the collector region, the base region, and the emitter region, a first metal line on the insulating film at a position corresponding to the base region and being electrically connected to the emitter region, and a second metal line on the insulating film at a position corresponding to a junction portion of the base region and the collector region and being electrically connected to the emitter region. The first metal line has a sloped surface such that incident light falling on the first metal line is reflected and directed toward the surface of the base region.

摘要翻译： 提供一种半导体光接收装置，其包括半导体基板，集电区域，基极区域和发射极区域，覆盖集电极区域，基极区域和发射极区域的表面的绝缘膜，第一金属 在与基极区域对应的位置并且电连接到发射极区域上的绝缘膜上的第二金属线，以及在与基极区域和集电极区域的接合部分对应的位置处的绝缘膜上的第二金属线， 连接到发射极区域。 第一金属线具有倾斜表面，使得落在第一金属线上的入射光被反射并指向基部区域的表面。