公开(公告)号：US5824234A

公开(公告)日：1998-10-20

申请号：US725122

申请日：1996-10-02

Applicant: Chon-Shin Jou ,  Ting-Sing Wang ,  Chun-Lin Chen ,  Ming-Huan Tsai ,  Ming-Ru Tsai

Inventor： Chon-Shin Jou ,  Ting-Sing Wang ,  Chun-Lin Chen ,  Ming-Huan Tsai ,  Ming-Ru Tsai

IPC: H01L21/311 ,  H01L21/60 ,  H01L21/00

CPC classification number: H01L21/31138 ,  H01L24/03 ,  H01L2224/0381 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029

Abstract: The present invention provides a method for forming a bonding pad having a low contact resistance. The method includes steps of: a) forming a bonding pad structure on a substrate having a metal layer by forming a passivation layer over said metal layer and etching the passivation layer with a fluorine-containing gas by which a fluorine-containing layer is formed on a surface of said bonding pad structure; and b) removing the fluorine-containing layer for reducing a contact resistance of said bonding pad structure.

Abstract translation: 本发明提供一种形成接触电阻低的焊盘的方法。 该方法包括以下步骤：a）在具有金属层的衬底上形成焊盘结构，在所述金属层上形成钝化层，并用形成含氟层的含氟气体蚀刻钝化层 所述焊盘结构的表面; 以及b）除去所述含氟层以降低所述接合焊盘结构的接触电阻。