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17 条记录 (耗时 0.011 秒)

    Multi-direction connectable electronic module and modular electronic building system
    1.
    发明授权
    Multi-direction connectable electronic module and modular electronic building system 有权

    公开(公告)号：US10585846B2

    公开(公告)日：2020-03-10

    申请号：US16021990

    申请日：2018-06-28

    申请人： Microduino Inc. ,  Meike Technology (Beijing) Ltd.

    发明人： Zhenshan Wang ,  Kejia Pan ,  Bin Feng ,  Xi Li

    IPC分类号： G06F15/78 ,  A63H33/04 ,  A63H33/26 ,  G06F1/16 ,  H03M1/66 ,  H03M1/12

    摘要： A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.

    APPARATUS AND METHOD FOR SMART SAND TABLE DEMONSTRATION
    2.
    发明申请
    APPARATUS AND METHOD FOR SMART SAND TABLE DEMONSTRATION 审中-公开

    公开(公告)号：US20180247568A1

    公开(公告)日：2018-08-30

    申请号：US15905493

    申请日：2018-02-26

    申请人： Microduino Inc. ,  Meike Technology (Beijing) Ltd.

    发明人： Zhenshan WANG ,  Hao CHEN ,  Xi LI ,  Kejia PAN ,  Bin FENG

    IPC分类号： G09B29/12

    CPC分类号： G09B29/12 ,  G06F3/0484 ,  G09B25/06 ,  H04W76/10

    摘要： Apparatus and method for smart sand table demonstration are provided. The demonstration apparatus includes: a sand table base, a sensor device, a demonstration device and a controller. The sensor device is placed on the sand table base which is also used as a demonstration carrier for the demonstration device. The sensor device includes a sensor module and a first wireless communication module, for monitoring a status of the sensor module and transmit the status information to the controller through a wireless connection. The controller determines demonstration information based at least one of smart demonstration project information and the status information, and transmits the demonstration information to the demonstration device. The demonstration device analyzes the received demonstration information and performs demonstration actions.

    ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS
    4.
    发明申请
    ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS 有权
    电气模块和模块化电子建筑系统

    公开(公告)号：US20160249478A1

    公开(公告)日：2016-08-25

    申请号：US14721341

    申请日：2015-05-26

    申请人： Microduino Inc. ,  Microduino Technologies (Beijing) Ltd. Inc.

    发明人： ZHENSHAN WANG ,  KEJIA PAN ,  BIN FENG

    IPC分类号： H05K7/14

    CPC分类号： H05K7/1435

    摘要： The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.

    摘要翻译： 本公开提供了一种电气模块和包括电气模块的模块化电气建筑系统。 电气模块包括印刷电路板（PCB），壳体构件，一个或多个磁体以及一个或多个互锁部件。 PCB具有顶表面，底表面和顶表面和底表面之间的相对侧。 壳体构件附接到PCB的两个相对侧的每一侧，并且在底表面中包括开口。 磁体布置在壳体构件内并且可磁性地将电气模块附接到另一电气模块。 每个互锁部件被配置成穿过PCB的每一侧上的壳体构件。 每个相互锁定部分具有从壳体构件的顶表面延伸并且暴露于壳体构件的底表面中的开口的突起。

    MULTI-DIRECTION CONNECTABLE ELECTRONIC MODULE AND MODULAR ELECTRONIC BUILDING SYSTEM
    5.
    发明申请
    MULTI-DIRECTION CONNECTABLE ELECTRONIC MODULE AND MODULAR ELECTRONIC BUILDING SYSTEM 审中-公开

    公开(公告)号：US20190042530A1

    公开(公告)日：2019-02-07

    申请号：US16021990

    申请日：2018-06-28

    申请人： Microduino Inc. ,  Meike Technology (Beijing) Ltd.

    发明人： Zhenshan WANG ,  Kejia PAN ,  Bin FENG ,  Xi LI

    IPC分类号： G06F15/78 ,  H03M1/12 ,  H03M1/66 ,  G06F1/16

    摘要： A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.