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    Electrical modules and modular electronic building systems
    6.
    发明授权
    Electrical modules and modular electronic building systems 有权

    公开(公告)号：US09980405B2

    公开(公告)日：2018-05-22

    申请号：US15066903

    申请日：2016-03-10

    申请人： Microduino Inc. ,  Meike Technology (Beijing) Ltd.

    发明人： Jian Hu ,  Kejia Pan ,  Zhenshan Wang ,  Xi Li ,  Bin Feng

    IPC分类号： H05K7/02 ,  A63H33/04 ,  A63H33/26

    CPC分类号： H05K7/023 ,  A63H33/042 ,  A63H33/046 ,  A63H33/26 ,  H05K7/026

    摘要： The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.