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    METHOD FOR CLEANING OF SEMICONDUCTOR SUBSTRATE AND ACIDIC SOLUTION
    1.
    发明申请
    METHOD FOR CLEANING OF SEMICONDUCTOR SUBSTRATE AND ACIDIC SOLUTION 审中-公开
    清洗半导体衬底和酸性溶液的方法

    公开(公告)号：US20120080053A1

    公开(公告)日：2012-04-05

    申请号：US13266255

    申请日：2010-04-30

    申请人： Makoto Hidaka ,  Taku Ogura ,  Maiko Kikuchi ,  Motohiro Kageyama ,  Masayuki Takashima

    发明人： Makoto Hidaka ,  Taku Ogura ,  Maiko Kikuchi ,  Motohiro Kageyama ,  Masayuki Takashima

    IPC分类号： B08B3/08 ,  C11D7/60 ,  C23G1/02

    CPC分类号： C11D3/046 ,  C11D3/2075 ,  C11D3/33 ,  C11D3/3947 ,  C11D7/10 ,  C11D7/265 ,  C11D7/3245 ,  C11D11/0047 ,  H01L21/02052

    摘要： Disclosed is a cleaning method which can remove, particularly, all of an organic contaminant, a particle contaminant, and a metal contaminant adhered to a semiconductor substrate at a high cleaning level, and which can realize the reduction in environmental load caused by the cleaning. The method of cleaning the semiconductor substrate includes a first cleaning process of cleaning the semiconductor substrate with a cleaning composition including a transition-metal-containing water-soluble salt (A), a chelating agent (B1), and a peroxide (C), a ratio of the chelating agent (B1) to the transition-metal-containing water-soluble salt (A) being 0.5 molar equivalent or more; and a second cleaning process of cleaning the semiconductor substrate, which is cleaned through the first cleaning process, with an acidic solution containing a chelating agent (B2).

    摘要翻译： 公开了一种可以清除特别是全部有机污染物，颗粒污染物和在高清洁水平附着于半导体衬底上的金属污染物的清洁方法，并且能够实现由清洁引起的环境负荷的降低。 清洗半导体衬底的方法包括用包含含过渡金属的水溶性盐（A），螯合剂（B1）和过氧化物（C）的清洁组合物清洗半导体衬底的第一清洁工艺， 螯合剂（B1）与过渡金属的水溶性盐（A）的比例为0.5摩尔当量以上; 以及通过第一清洗处理清洗半导体衬底的第二清洁工艺，其中含有螯合剂（B2）的酸性溶液。

    Electronic parts cleaning solution
    3.
    发明授权
    Electronic parts cleaning solution 失效
    电子零件清洗液

    公开(公告)号：US07485612B2

    公开(公告)日：2009-02-03

    申请号：US11174061

    申请日：2005-06-30

    申请人： Masayuki Takashima

    发明人： Masayuki Takashima

    IPC分类号： H01L21/00

    CPC分类号： C11D11/0047 ,  H01L21/02052 ,  H01L21/02068

    摘要： (Object) To provide a new electronic parts cleaning solution that inhibits the corrosion of silicon or metals other than the silicon, and that efficiently cleans off fine dust or organic matters adhered on the surface of electronic parts, and that does not have white turbidity easily.(Solution) An electronic parts clearing solution which is characterized in containing an anionic surfactant, hydroxide, metal corrosion inhibitor, water, and a nonionic surfactant represented by formula (I) and/or a nonionic surfactant represented by formula (II): HO-((EO)x—(PO)y)z—H  (I) R-[((EO)a—(PO)b)c—H]m  (II) (EO is an oxyethylene group, and PO is an oxypropylene group. x and y, and a and b are positive number, which x(x+y) and a(a+b) are 0.05 to 0.5 respectively, and z and c are positive integers. R is a residue group wherein hydrogen atoms are removed from hydroxyl group of alcohol or amine represented by a group having valency of 1˜4).

    摘要翻译： （目的）提供抑制硅或金属以外的硅腐蚀的新的电子部件清洗液，能够有效地清除附着在电子部件表面的细小尘埃或有机物，并且不容易发生白浊 。 （溶液）一种电子部件清除液，其特征在于含有式（I）所示的阴离子表面活性剂，氢氧化物，金属缓蚀剂，水和非离子表面活性剂和/或式（II）表示的非离子性表面活性剂： 在线公式描述=“在线公式”end =“lead”？HO - （（EO）x-（PO）y）zH（I）<？in-line-formula description =“In-line 公式“end =”tail“？> <？in-line-formula description =”In-line Formulas“end =”lead“？> R - [（（EO）a-（PO）b）cH] m （EO是氧化乙烯基，PO是氧化亚丙基）x和y，a和b是正数，其中 x（x + y）和a（a + b）分别为0.05〜0.5，z和c为正整数，R为残基，其中氢原子由醇或胺的羟基除去， 1〜4）。

    Photoresist stripper
    4.
    发明授权
    Photoresist stripper 失效
    光阻剥离器

    公开(公告)号：US07199091B2

    公开(公告)日：2007-04-03

    申请号：US11110533

    申请日：2005-04-19

    申请人： Masayuki Takashima

    发明人： Masayuki Takashima

    IPC分类号： C11D1/02 ,  C11D3/26 ,  C11D3/30

    CPC分类号： C11D3/046 ,  C11D3/042 ,  C11D3/044 ,  C11D3/30 ,  C11D11/0047

    摘要： Recently, use is made of copper wiring as the wiring material for semiconductor devices, and of low dielectric constant films as the insulating film between the lines of wiring. In this connection, a photoresist stripper is in need which can inhibit corrosion or damage on the copper wiring or the Low-k film, and which has excellent property of removing ashed photoresist residues. The invention provides a photoresist stripper (hereinafter, referred to as the stripper of the invention) characterized in containing a tertiary amine compound, an alkaline compound, a fluoro compound, and an anionic surfactant; and a process for preparation of semiconductor devices using the stripper of the invention.

    摘要翻译： 近来，使用铜布线作为半导体器件的布线材料，并且使用作为布线之间的绝缘膜的低介电常数膜。 在这方面，需要能够抑制对铜布线或Low-k膜的腐蚀或损伤的光致抗蚀剂剥离剂，其具有除去灰化的光致抗蚀剂残留物的优异性能。 本发明提供一种特征在于含有叔胺化合物，碱性化合物，氟化合物和阴离子表面活性剂的光致抗蚀剂剥离剂（以下称为本发明的剥离剂） 以及使用本发明的脱模剂制备半导体器件的方法。

    Anticorrosive treating concentrate
    5.
    发明授权
    Anticorrosive treating concentrate 有权
    防腐处理浓缩液

    公开(公告)号：US07186354B2

    公开(公告)日：2007-03-06

    申请号：US09797587

    申请日：2001-03-05

    申请人： Hidemitsu Aoki ,  Hiroaki Tomimori ,  Masayuki Takashima

    发明人： Hidemitsu Aoki ,  Hiroaki Tomimori ,  Masayuki Takashima

    IPC分类号： C09K3/00 ,  C23F11/00

    CPC分类号： H01L21/02071 ,  C23G1/26 ,  H01L21/32134

    摘要： According to the present invention, there is provided an anticorrosive treating concentrate usable for an exposed surface of a metal (e.g. copper or a copper alloy), containing an anticorrosive agent and a precipitation inhibitor and having a pH of 4 to 12 when used in the form of an aqueous solution, in which concentrate the anticorrosive agent is a triazole type compound and/or a derivative thereof and is contained in a concentration of 0.05 to 20% by weight and the precipitation inhibitor is a compound having at least one nitrogen atom but no metal atom in the molecule.

    摘要翻译： 根据本发明，提供了一种用于金属（例如铜或铜合金）的暴露表面的防腐蚀处理浓缩物，其含有防腐剂和沉淀抑制剂，并且当用于 形式的水溶液，其中防腐剂为三唑型化合物和/或其衍生物，浓度为0.05〜20重量％，沉淀抑制剂为具有至少一个氮原子的化合物，但为 分子中没有金属原子。

    Electrode and electrolyte composite for fuel cell, and method for manufacture thereof
    6.
    发明申请
    Electrode and electrolyte composite for fuel cell, and method for manufacture thereof 审中-公开
    用于燃料电池的电极和电解质复合材料及其制造方法

    公开(公告)号：US20060141336A1

    公开(公告)日：2006-06-29

    申请号：US10532010

    申请日：2003-10-21

    申请人： Masayuki Takashima ,  Susumu Yonezawa ,  Yuichi Matsumura ,  Hajime Kiyokawa ,  Mamoru Shimakawa ,  Toshihide Tsukatani ,  Koji Fujita

    发明人： Masayuki Takashima ,  Susumu Yonezawa ,  Yuichi Matsumura ,  Hajime Kiyokawa ,  Mamoru Shimakawa ,  Toshihide Tsukatani ,  Koji Fujita

    IPC分类号： H01M4/86 ,  B05D5/12 ,  H01M4/88

    CPC分类号： H01M4/8882 ,  H01M4/8605 ,  H01M4/8825 ,  H01M8/1004 ,  Y02P70/56

    摘要： An electrode having a thermoplastic resin having gas permiability and a metal (3b) supported in a three-dimensional matrix form; an electrolyte composite having an electrolyte membrane (1) and a pair of electrodes (3), the electrodes (3) comprising a porous thermoplastic resin having gas permiability and a metal (3b) supported in a three-dimensional matrix form; a method of manufacturing an electrode (3) comprising plating a metal coating on surfaces of numerous particles (3a) of a thermoplastic resin, and pressurizing the particles; and a method of manufacturing an electrolyte composite having an electrolyte membrane (1), and a pair of electrodes (3), comprising manufacturing the electrodes (3) by plating a metal coating on surfaces of numerous particles (3a) of a thermoplastic resin and pressurizing the particles, and joining the electrolyte membrane (1) through the catalyst to one surface of each electrode and joining the electrolyte membranes, or joining the electrodes (3) through the catalysts (2) to opposite surfaces of the electrolyte membrane (1).

    摘要翻译： 具有具有气体容许性的热塑性树脂的电极和以三维矩阵形式负载的金属（3b）; 具有电解质膜（1）和一对电极（3）的电解质复合体，所述电极（3）包含具有气体可容许性的多孔热塑性树脂和以三维矩阵形式负载的金属（3b）; 一种制造电极（3）的方法，包括在热塑性树脂的许多颗粒（3a）的表面上镀覆金属涂层并对颗粒加压; 以及一种制造具有电解质膜（1）和一对电极（3）的电解质复合体的方法，包括通过在热塑性树脂的许多颗粒（3a）的表面上镀金属涂层来制造电极（3） 并对该粒子加压，将电解质膜（1）通过催化剂接合到各电极的一个表面，并接合电解质膜，或者将电极（3）通过催化剂（2）接合到电解质膜（1）的相对面 ）。

    Photoresist stripper
    7.
    发明申请
    Photoresist stripper 失效
    光阻剥离器

    公开(公告)号：US20050250660A1

    公开(公告)日：2005-11-10

    申请号：US11110533

    申请日：2005-04-19

    申请人： Masayuki Takashima

    发明人： Masayuki Takashima

    IPC分类号： G03F7/42 ,  C11D1/00 ,  C11D3/02 ,  C11D3/30 ,  C11D11/00 ,  H01L21/027

    CPC分类号： C11D3/046 ,  C11D3/042 ,  C11D3/044 ,  C11D3/30 ,  C11D11/0047

    摘要： (Problem) Recently, use is made of copper wiring as the wiring material for semiconductor devices, and of low dielectric constant films as the insulating film between the lines of wiring. In this connection, a photoresist stripper is in need which can inhibit corrosion or damage on the copper wiring or the Low-k film, and which has excellent property of removing ashed photoresist residues. (Solution) The invention provides a photoresist stripper (hereinafter, referred to as the stripper of the invention) characterized in containing a tertiary amine compound, an alkaline compound, a fluoro compound and an anionic surfactant; and a process for preparation of semiconductor devices using the stripper of the invention.

    摘要翻译： （问题）近来，使用铜布线作为半导体器件的布线材料，并且使用作为布线之间的绝缘膜的低介电常数膜。 在这方面，需要能够抑制对铜布线或Low-k膜的腐蚀或损伤的光致抗蚀剂剥离剂，其具有除去灰化的光致抗蚀剂残留物的优异性能。 （溶液）本发明提供了含有叔胺化合物，碱性化合物，氟化合物和阴离子表面活性剂的光致抗蚀剂剥离剂（以下称为本发明的剥离剂） 以及使用本发明的脱模剂制备半导体器件的方法。

    Hydrogen storage material
    8.
    发明授权
    Hydrogen storage material 失效
    储氢材料

    公开(公告)号：US6143052A

    公开(公告)日：2000-11-07

    申请号：US106165

    申请日：1998-06-29

    申请人： Tadashi Kiyokawa ,  Hajime Kiyokawa ,  Masayuki Takashima

    发明人： Tadashi Kiyokawa ,  Hajime Kiyokawa ,  Masayuki Takashima

    IPC分类号： B22F1/02 ,  C01B3/00 ,  C22C32/00 ,  H01M4/24 ,  H01M4/62 ,  B22F3/00

    CPC分类号： H01M4/622 ,  B22F1/025 ,  C01B3/0031 ,  C01B3/0057 ,  C01B3/0078 ,  C22C32/0094 ,  H01M4/242 ,  H01M4/623 ,  Y02E60/327

    摘要： A hydrogen storage material is disclosed with no collapse due to pulverization of hydrogen storage alloy particles by repeated hydrogen absorption and desorption thereby permitting repeated use while manifesting excellent electric and thermal conductivities. Pressure molding of hydrogen storage alloy particles, each being covered with a plated metal film having microgranules of a thermoplastic resin, at a temperature higher than a glass transition temperature or a melting point of and below a thermal decomposition temperature of the thermoplastic resin can produce a porous hydrogen storage material of hydrogen storage alloy particles being bonded to each other via the thermoplastic resin. The hydrogen storage material can become firm and strong because the plated metal films covering the hydrogen storage alloy particles are clasped with each other complexly.

    摘要翻译： 公开了一种储氢材料，由于通过重复的氢吸收和解吸附而使储氢合金颗粒粉碎而没有崩溃，从而允许反复使用，同时表现出优异的电导率和热导率。 在高于玻璃化转变温度或低于热塑性树脂的热分解温度的熔点的温度下，各自被具有热塑性树脂微粒的电镀金属膜覆盖的储氢合金颗粒的加压成型可以产生 储氢合金颗粒的多孔储氢材料通过热塑性树脂相互结合。 由于覆盖储氢合金粒子的电镀金属膜复杂地夹紧，所以储氢材料变得牢固而牢固。

    Artificial tooth and manufacturing method of an acrylic resin denture
    9.
    发明授权
    Artificial tooth and manufacturing method of an acrylic resin denture 失效
    人造牙和丙烯酸树脂假牙的制造方法

    公开(公告)号：US5791901A

    公开(公告)日：1998-08-11

    申请号：US740214

    申请日：1996-10-25

    申请人： Masayuki Takashima

    发明人： Masayuki Takashima

    IPC分类号： A61C13/007 ,  A61C13/01 ,  A61C13/08

    CPC分类号： A61C13/081

    摘要： Disclosed is an artificial tooth that is structured such that the tooth is firmly held in its proper position in a core until a plate resin is fully polymerized and cured in succession to the manufacture of a wax denture. To this end, the artificial tooth has on its portion to be embedded into the core a projection for a temporary bond with the core. Also disclosed is a manufacturing method of an acrylic resin denture comprising the steps of forming a projection for a temporary bond with a core, on the portion of a finished artificial tooth to be -embedded into a core material before the finished artificial tooth is embedded into the core by applying a drop of resin that is of the same type as the material of the artificial tooth, and the step of removing the core along with the projection after a plate resin is polymerized. Instead of the application of a resin drop, a resin pellet can be glued on the portion of the finished artificial tooth to be embedded into a core material before the finished artificial tooth is embedded into the core.

    摘要翻译： 公开了一种人造牙齿，其被构造成使得牙齿牢固地保持在其适当位置的芯中，直到板树脂完全聚合并且连续固化以制造蜡义齿。 为此，人造牙齿的一部分被嵌入到芯部中以与芯部临时粘合的突起。 还公开了一种丙烯酸树脂义齿的制造方法，包括以下步骤：在最终的人造牙被嵌入之前，在最终的人造牙齿的最终人造牙齿的部分上形成用于临时粘合的突起，以嵌入到芯材中 通过应用与人造牙齿材料相同类型的一滴树脂的芯体，以及在板状树脂聚合之后沿着突出部去除芯体的步骤。 代替使用树脂滴，树脂颗粒可以在成品人造牙齿的部分上胶合，以便在成品人造牙嵌入芯之前嵌入芯材中。