发明授权
- 专利标题: Anticorrosive treating concentrate
- 专利标题(中): 防腐处理浓缩液
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申请号: US09797587申请日: 2001-03-05
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公开(公告)号: US07186354B2公开(公告)日: 2007-03-06
- 发明人: Hidemitsu Aoki , Hiroaki Tomimori , Masayuki Takashima
- 申请人: Hidemitsu Aoki , Hiroaki Tomimori , Masayuki Takashima
- 申请人地址: JP Kanagawa JP Osaka
- 专利权人: NEC Electronics Corporation,Sumitomo Chemical Company Limited
- 当前专利权人: NEC Electronics Corporation,Sumitomo Chemical Company Limited
- 当前专利权人地址: JP Kanagawa JP Osaka
- 代理机构: Young & Thompson
- 优先权: JP2000-058376 20000303
- 主分类号: C09K3/00
- IPC分类号: C09K3/00 ; C23F11/00
摘要:
According to the present invention, there is provided an anticorrosive treating concentrate usable for an exposed surface of a metal (e.g. copper or a copper alloy), containing an anticorrosive agent and a precipitation inhibitor and having a pH of 4 to 12 when used in the form of an aqueous solution, in which concentrate the anticorrosive agent is a triazole type compound and/or a derivative thereof and is contained in a concentration of 0.05 to 20% by weight and the precipitation inhibitor is a compound having at least one nitrogen atom but no metal atom in the molecule.
公开/授权文献
- US20010030315A1 Anticorrosive treating concentrate 公开/授权日:2001-10-18
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