公开(公告)号：US20120212637A1

公开(公告)日：2012-08-23

申请号：US13360166

申请日：2012-01-27

Applicant: Koji Tsuduki ,  Takanori Suzuki ,  Hisatane Komori ,  Satoru Hamasaki

Inventor： Koji Tsuduki ,  Takanori Suzuki ,  Hisatane Komori ,  Satoru Hamasaki

IPC: H04N5/228 ,  H01L31/18 ,  H01L31/02

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/94

Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.

Abstract translation: 一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。 突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。 粘合剂材料将突出部分的顶面和盖部件结合。 粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。 在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

公开(公告)号：US07622812B2

公开(公告)日：2009-11-24

申请号：US11955504

申请日：2007-12-13

Applicant: Koji Tsuduki ,  Takanori Suzuki

Inventor： Koji Tsuduki ,  Takanori Suzuki

IPC: H01L23/28

CPC classification number: H01L21/56 ,  H01L23/3121 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

Abstract: A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

Abstract translation: 半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处 阻焊图案。

公开(公告)号：US08309433B2

公开(公告)日：2012-11-13

申请号：US13211161

申请日：2011-08-16

Applicant: Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

Inventor： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC: H01L21/30

CPC classification number: H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract translation: 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120044415A1

公开(公告)日：2012-02-23

申请号：US13212935

申请日：2011-08-18

Applicant: Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

Inventor： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Abstract translation: 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US20100155869A1

公开(公告)日：2010-06-24

申请号：US12640156

申请日：2009-12-17

Applicant: Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

Inventor： Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC: H01L31/0216 ,  H01L31/18

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

Abstract translation: 一种方法包括制备盖构件; 准备包括基板的图像拾取元件，所述基板包括在主表面上包括多个光电检测器的像素区域，所述第一凹凸部分包括被配置为将光聚集在所述多个光电检测器上的多个第一凸起部分，所述第一凸部 分别具有透镜形状的部分和围绕第一凹凸部的第二凹凸部，第二凹凸部包括多个第二凸部; 并且使用固定构件将盖构件固定到图像拾取元件的区域，该区域在第一凹凸部和第二凹凸部之间。

公开(公告)号：US20090298237A1

公开(公告)日：2009-12-03

申请号：US12490656

申请日：2009-06-24

Applicant: Koji Tsuduki ,  Takanori Suzuki

Inventor： Koji Tsuduki ,  Takanori Suzuki

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L23/3121 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

Abstract: A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

Abstract translation: 半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处 阻焊图案。

公开(公告)号：US08241951B2

公开(公告)日：2012-08-14

申请号：US12640156

申请日：2009-12-17

Applicant: Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

Inventor： Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC: H01L21/00

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

Abstract translation: 一种方法包括制备盖构件; 准备包括基板的图像拾取元件，所述基板包括在主表面上包括多个光电检测器的像素区域，所述第一凹凸部分包括被配置为将光聚集在所述多个光电检测器上的多个第一凸起部分，所述第一凸部 分别具有透镜形状的部分和围绕第一凹凸部的第二凹凸部，第二凹凸部包括多个第二凸部; 并且使用固定构件将盖构件固定到图像拾取元件的区域，该区域在第一凹凸部和第二凹凸部之间。

公开(公告)号：US08823872B2

公开(公告)日：2014-09-02

申请号：US13212935

申请日：2011-08-18

Applicant: Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

Inventor： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC: H04N5/225

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Abstract translation: 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US08698938B2

公开(公告)日：2014-04-15

申请号：US13360166

申请日：2012-01-27

Applicant: Koji Tsuduki ,  Takanori Suzuki ,  Hisatane Komori ,  Satoru Hamasaki

Inventor： Koji Tsuduki ,  Takanori Suzuki ,  Hisatane Komori ,  Satoru Hamasaki

IPC: H04N5/225 ,  H04N5/335 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/94

Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.

Abstract translation: 一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。 突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。 粘合剂材料将突出部分的顶面和盖部件结合。 粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。 在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

公开(公告)号：US08279336B2

公开(公告)日：2012-10-02

申请号：US12795458

申请日：2010-06-07

Applicant: Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

Inventor： Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(θA−2θC)≦L1+L1′ at any point on the upright surface, and H tan(θA−2θB)+(H1)tan θB≦L1 and θB>θC at any point on the non-vertical surface, where θA is the inclination of incident light, θB is the inclination at a point on the non-vertical surface, θC is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1′ is the distance from the upper edge to the lower edge of the upright surface in the planar direction.

Abstract translation: 固定到拾取元件的盖构件具有非垂直表面和直立表面，并且在直立表面上的任何点处满足H2 tan（＆amp; A-2＆amp; C;＆lt; L1 + L1'）和H tan（＆ ; A-2＆thetas; B）+（H1）tan＆thetas; B＆nlE; L1和＆thetas; B>＆thetas; C在非垂直表面上的任何点，其中＆amp; A; A是入射光的倾角， 在非垂直表面上的点处的倾斜角度; C是直立表面上的点处的倾角，H1是非垂直表面的高度，H2是直立表面的高度，H是高度 框架部分的距离L1是从像素区域的边缘到直立表面的上边缘的距离，L1'是在平面方向上从直立表面的上边缘到下边缘的距离。