公开(公告)号：US06920687B2

公开(公告)日：2005-07-26

申请号：US10007821

申请日：2001-12-05

申请人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

发明人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

IPC分类号： H05K13/08 ,  H05K3/30

CPC分类号： H05K13/08 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

摘要翻译： 一种用于拾取电子部件的部件安装方法，将电子部件定位在电路基板上并将电子部件安装到电路基板上，适用于在部件安装操作的暂停期间执行空转操作，从而消除部件安装的任何劣化 由于温度变化导致的精度。

公开(公告)号：US07020322B2

公开(公告)日：2006-03-28

申请号：US10003831

申请日：2001-12-06

申请人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi ,  Kazuo Kido

发明人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi ,  Kazuo Kido

IPC分类号： G06K9/00 ,  H01L23/544

CPC分类号： H05K1/0269 ,  H01L2223/54473 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/09918 ,  H05K2203/163

摘要： A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.

摘要翻译： 通过在单个或多个单独的基板的识别处理过程中同时识别不良标记和单独的基板标记，整体上对电路形成的基板的识别操作被减少， 电路形成的基板。 用于识别电路形成的基板的倾斜和位错的结果用于控制识别单个基板的基板识别相机的位置，从而降低识别错误的发生率。 当在基板识别照相机的视野内捕获识别标记的分量或单独的基板标记时，指定这些识别的标记中的相应一个的位置，并且再次识别这样的标记，并且因此发生该发生 的识别错误可以被抑制。

公开(公告)号：US20050257368A1

公开(公告)日：2005-11-24

申请号：US11172583

申请日：2005-06-30

申请人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

发明人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

IPC分类号： H05K13/08 ,  B23Q15/00

CPC分类号： H05K13/08 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

摘要翻译： 用于拾取电子部件的部件安装方法和部件安装装置，将电子部件定位在电路基板上并将电子部件安装到电路基板上适于在部件安装操作的暂停期间执行空转操作，从而消除 由于温度变化，元件安装精度的任何降低。

公开(公告)号：US07290327B2

公开(公告)日：2007-11-06

申请号：US11172583

申请日：2005-06-30

申请人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

发明人： Tomoyuki Nakano ,  Koji Odera ,  Takeshi Kuribayashi

IPC分类号： B23P19/00

CPC分类号： H05K13/08 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

摘要翻译： 用于拾取电子部件的部件安装方法和部件安装装置，将电子部件定位在电路基板上并将电子部件安装到电路基板上适于在部件安装操作的暂停期间执行空转操作，从而消除 由于温度变化，元件安装精度的任何降低。

公开(公告)号：US06374484B1

公开(公告)日：2002-04-23

申请号：US09486661

申请日：2000-02-28

申请人： Noriaki Yoshida ,  Makoto Sueki ,  Koji Odera ,  Yoshihiro Yoshida ,  Osamu Okuda ,  Naoyuki Kitamura ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Makoto Sueki ,  Koji Odera ,  Yoshihiro Yoshida ,  Osamu Okuda ,  Naoyuki Kitamura ,  Akira Kabeshita

IPC分类号： H01R4300

CPC分类号： H05K13/0452 ,  H05K13/08 ,  Y10T29/49131 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： According to the present invention, a control device and a circuit board moving device controlled in operation by the control device for holding a circuit board are provided, whereby the circuit board moving device is moved to bring a component mount position on the circuit board closest to a recognition device after the circuit board moving device is moved to bring the component mount position closest to a component feed position. In the state, a circuit board mark formed on the circuit board is detected, thereby recognizing a position of the circuit board. A transfer distance for the component by a component hold device from the recognition device to the component mount position is thus shortened, enabling high-speed mounting with higher accuracy.

摘要翻译： 根据本发明，提供一种由控制装置控制的控制装置和电路板移动装置，用于保持电路板，由此移动电路板移动装置以使电路板上的部件安装位置最接近 移动电路板移动装置之后的识别装置使部件安装位置最接近部件进给位置。 在该状态下，检测形成在电路板上的电路板标记，从而识别电路板的位置。 因此，通过部件保持装置从识别装置到部件安装位置的部件的传送距离因此缩短，能够以更高的精度实现高速安装。