公开(公告)号：US06810213B2

公开(公告)日：2004-10-26

申请号：US09788218

申请日：2001-02-19

Applicant: Koichiro Tonehira ,  Hiroshi Yamamoto ,  Kenji Yoshimoto ,  Michihide Sasada ,  Tetsuya Aoki

Inventor： Koichiro Tonehira ,  Hiroshi Yamamoto ,  Kenji Yoshimoto ,  Michihide Sasada ,  Tetsuya Aoki

IPC: G02B643

CPC classification number: G02B6/4206 ,  G02B6/4208 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/0683 ,  H01L2924/00014

Abstract: To provide economical high-speed optical communications through an optical module a silicon substrate with a ball lens and semiconductor luminescence element mounted thereon, and a laser driver IC are provided. A silicon subassembly includes a silicon substrate with a pyramidal cavity etched into the substrate near its edge. A ball lens is precision-mounted in the pyramidal cavity by bonding it at multiple points. This provides a high-strength connection and a small, inexpensive silicon substrate. Also provided on the silicon substrate is a semiconductor luminescence element and a slit on the opposite side of the ball lens. The slit enables collimated light emitted from the ball lens to be optically coupled without being blocked or reflected by the substrate. The semiconductor luminescence element and its laser driver IC are placed in close proximity to each other, and ribbon wires are kept short (approximately 300 &mgr;m) to reduce signal line impedance mismatch for high-speed transmission.

Abstract translation: 为了通过光学模块提供经济的高速光通信，提供了安装有球透镜和半导体发光元件的硅衬底和激光驱动器IC。 硅子组件包括硅衬底，其具有在其边缘附近蚀刻到衬底中的锥体腔。 球形镜头通过在多个点处粘合而精确安装在锥体腔中。 这提供了高强度的连接和小的廉价的硅衬底。 在硅衬底上还设置半导体发光元件和在球透镜的相对侧上的狭缝。 狭缝使得从球形透镜发射的准直光被光学耦合，而不被基板阻挡或反射。 半导体发光元件及其激光驱动器IC彼此靠近放置，并且带状线保持短路（约300mum），以减少用于高速传输的信号线阻抗失配。

公开(公告)号：US07044652B2

公开(公告)日：2006-05-16

申请号：US10052626

申请日：2002-01-17

Applicant: Naoki Matsushima ,  Kazumi Kawamoto ,  Koichiro Tonehira

Inventor： Naoki Matsushima ,  Kazumi Kawamoto ,  Koichiro Tonehira

IPC: G02B6/36

CPC classification number: G02B6/4225 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4237

Abstract: A semiconductor laser and an optical fiber are optically coupled via a first lens and a second lens, the second lens is previously fixed to a module package and these parts are mounted to the module package, when focal lengths of the first lens and the second lens are respectively designated by f1 and f2, an optical distance between a principal plane of the first lens on its side of the second lens and a principal plane of the second lens on its side of the first lens, is made substantially equal to f1+f2. Thereby, there is provided an optical transmission module having low price capable of achieving a high coupling efficiency with high yield.

Abstract translation: 半导体激光器和光纤通过第一透镜和第二透镜光学耦合，第二透镜预先固定到模块封装，并且当第一透镜和第二透镜的焦距被固定时，这些部件被安装到模块封装 分别由f 1和f 2表示，使第一透镜的第二透镜的主面与第一透镜的一侧的主面之间的光学距离基本上等于f 1 + f 2。 因此，提供了一种具有低价格的光传输模块，能够以高产率实现高耦合效率。

公开(公告)号：US5675685A

公开(公告)日：1997-10-07

申请号：US665949

申请日：1996-06-19

Applicant: Kazuyuki Fukuda ,  Makoto Shimaoka ,  Satoshi Kaneko ,  Kazuhiro Ito ,  Shinzo Nishiyama ,  Shigefumi Kito ,  Atsushi Takai ,  Atsushi Miura ,  Koichiro Tonehira

Inventor： Kazuyuki Fukuda ,  Makoto Shimaoka ,  Satoshi Kaneko ,  Kazuhiro Ito ,  Shinzo Nishiyama ,  Shigefumi Kito ,  Atsushi Takai ,  Atsushi Miura ,  Koichiro Tonehira

IPC: G02B6/32 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  G02B6/00 ,  G02B6/36

CPC classification number: H01S5/02284 ,  G02B6/4249 ,  H01S5/4025 ,  H01L2224/48091 ,  H01S5/024 ,  H01S5/02469

Abstract: An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device. The terminal portion is formed by extending the terminal portion from at least one of surfaces forming the package case, excluding a surface on which the optical semiconductor array device and the electronic device are mounted and a surface opposite to that surface, and the plurality of pins are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array is taken out, whereby the electronic device is mounted on the external circuit board through the plurality of pins and is electrically connected to the external circuit board.

Abstract translation: 一种光半导体阵列模块，包括由多个半导体激光二极管，发光二极管元件或多个半导体光电二极管元件构成的光半导体阵列器件，用于驱动和控制光半导体阵列器件的电子器件， 用于将光学半导体阵列器件及其电子器件容纳在其中的光学阵列器件，与光学半导体阵列器件光学耦合的光纤阵列，用于将光纤阵列保持并固定在立方体封装壳体的一个表面上的支撑部件 以及具有用于将外部电路板电连接到电子设备的多个引脚的端子部分。 端子部分通过从形成封装壳体的表面中的至少一个表面，除了安装有光学半导体阵列器件和电子器件的表面和与该表面相对的表面之外延伸端子部分而形成，并且多个引脚 安装在与从其中取出光纤阵列的表面成直角交叉的端子部分的表面中，由此电子设备通过多个引脚安装在外部电路板上，并且电连接到外部 电路板。