Treatment agent for inorganic siliconaceous filler
    1.
    发明授权
    Treatment agent for inorganic siliconaceous filler 失效
    无机硅质填料的处理剂

    公开(公告)号:US5075459A

    公开(公告)日:1991-12-24

    申请号:US617970

    申请日:1990-11-26

    摘要: A treatment agent for inorganic siliconaceous fillers has as its main ingredient an organosilicon compound of general fomrula (I): ##STR1## in which X represents a functional group selected from among H.sub.2 NCH.sub.2 CH.sub.2 --, H.sub.2 NCH.sub.2 CH.sub.2 CH.sub.2 --, ##STR2## Y.sup.1 is CH.sub.2 .dbd.CHCH.sub.2 -- or --CH.sub.2 CH.sub.2 CH.sub.2 SiR.sub.n.sup.1 Z.sub.3-n.sup.1, R.sup.1 is a substituted or nonsubstituted monovalent hydrocarbon group, Z.sup.1 is an alkoxy group having 1-6 carbon atoms and n is an integer from 0-2, or of general formula (II): ##STR3## in which Y.sup.2 is ##STR4## --CH.sub.2 CH.sub.2 CH.sub.2 SiR.sub.m.sup.2 Z.sub.3-m.sup.2 or a substitutent or nonsubstituted monovalent hydrocarbon group, Z.sup.2 is an alkoxy group having 1-6 carbon atoms and m is an integer from 0-2.

    摘要翻译: 无机硅质填料的处理剂作为其主要成分是通式(I)的有机硅化合物:其中X表示选自H 2 NHCH 2 CH 2 - ,H 2 NHCH 2 CH 2 CH 2 - ,Y IMA为CH 2的官能团 = CHCH2-或-CH2CH2CH2SiRn1Z3-n1,R1是取代或未取代的单价烃基,Z1是具有1-6个碳原子的烷氧基,n是0-2的整数,或通式(II)的整数:(II)其中Y2是 -CH2CH2CH2SiRm2Z3-m2或取代或非取代的一价烃基,Z2是具有1-6个碳原子的烷氧基,m是0-2的整数。

    Organosilicon compound
    2.
    发明授权
    Organosilicon compound 失效
    有机硅化合物

    公开(公告)号:US4927951A

    公开(公告)日:1990-05-22

    申请号:US424394

    申请日:1989-10-20

    IPC分类号: C07F7/18 C07F7/08

    CPC分类号: C07F7/0854

    摘要: An organosilicon compound which contains a highly reactive (meth)acrylamide and a siloxane group with a molecule has the following formula: ##STR1## where R.sup.1 is a methyl group or hydrogen atom, R.sup.2 is a substituted or unsubstituted monovalent hydrocarbon group, Q is a divalent hydrocarbon group having 1-8 carbon atoms, A is a hydrogen atom, substituted or unsubstituted hydrocarbon carbon group or --QSiR.sup.n.sup.2 [OSi(CH.sub.3).sub.3 ].sub.3-n, and n is an integer from 0-2.

    摘要翻译: 含有高活性(甲基)丙烯酰胺和具有分子的硅氧烷基的有机硅化合物具有下式:其中R 1为甲基或氢原子,R 2为取代或未取代的一价烃基,Q为 具有1-8个碳原子的二价烃基,A是氢原子,取代或未取代的烃基或-QSiRn2 [OSi(CH3)3] 3-n,n是0-2的整数。

    Process for forming electronic circuit
    3.
    发明授权
    Process for forming electronic circuit 失效
    电子电路形成工艺

    公开(公告)号:US5759638A

    公开(公告)日:1998-06-02

    申请号:US793784

    申请日:1997-03-04

    摘要: The present invention relates to a process for forming an electronic circuit, which comprises coating a polyorganosilane on at least one surface of a substrate for forming an electronic circuit, followed by drying to form a solid state polysilane thin film, masking a portion for forming a circuit of said thin film and oxidizing a remaining portion to form an insulating portion, and then doping an oxidizing substance to the portion subjected to masking to form a conductive portion, and in order to oxidize a partial portion of the thin film, said thin film is irradiated with UV light in the presence of oxygen, preferably, in the oxidizing step, by carrying out partial oxidation while controlling an oxidation degree, the remaining portion is converted into three or more kinds of portions having different volume resistivities.

    摘要翻译: PCT No.PCT / JP95 / 00752 Sec。 371日期1997年3月4日 102(e)1997年3月4日PCT PCT 1995年4月18日PCT公布。 公开号WO96 / 08127 日期:1996年3月14日本发明涉及一种形成电子电路的方法,其包括在用于形成电子电路的基板的至少一个表面上涂布聚有机硅烷,然后干燥以形成固态聚硅烷薄膜,掩蔽 用于形成所述薄膜的电路并氧化剩余部分以形成绝缘部分的部分,然后将氧化物质掺杂到经过掩模的部分以形成导电部分,并且为了氧化薄的部分部分 薄膜,在氧的存在下,优选在氧化步骤中,用UV光照射所述薄膜,通过在控制氧化度的同时进行部分氧化,将剩余部分转化成三种或更多种具有不同体积电阻率的部分 。