公开(公告)号：US20120006979A1

公开(公告)日：2012-01-12

申请号：US13193038

申请日：2011-07-28

申请人： Motoki KAKUI ,  Kazuo NAKAMAE ,  Shinobu TAMAOKI

发明人： Motoki KAKUI ,  Kazuo NAKAMAE ,  Shinobu TAMAOKI

IPC分类号： H01J40/14

CPC分类号： B23K26/03 ,  B23K26/082 ,  B23K2101/32 ,  B23K2101/36

摘要： The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.

摘要翻译： 激光加工装置本发明涉及一种激光加工装置等，其结构是同时实现在激光束难以到达的地方进行有效的激光加工，激光加工在激光加工的地方 很容易到达。 该激光加工装置包括：激光光源，在扫描激光束的同时向物体施加激光的照射光学系统;检测从照射光学系统施加的激光束的光检测器;以及控制部， 在激光光源处的激光束的连续振荡和脉冲振荡。 特别地，在从光检测器检测到从照射光学系统施加的激光束的情况下，控制部分使激光束相对于激光光源连续振荡; 而在光检测器未检测到从照射光学系统施加的激光束的情况下，激光束相对于激光光源的脉冲振荡。

公开(公告)号：US08080773B2

公开(公告)日：2011-12-20

申请号：US12392331

申请日：2009-02-25

申请人： Shinobu Tamaoki ,  Motoki Kakui ,  Kazuo Nakamae

发明人： Shinobu Tamaoki ,  Motoki Kakui ,  Kazuo Nakamae

IPC分类号： G01J1/32

CPC分类号： G01J1/20 ,  B23K26/705

摘要： The present invention relates to a method of measuring backward light, which is constructed for checking, prior to laser processing, backward light that propagates backward through an isolator included in a laser processing apparatus. The present invention also relates to a laser processing method and the like. A laser processing apparatus has an optical head provided with a laser light source part, light guide, and isolator. The optical head has an emitting optical system, irradiation optical system, and light collecting optical system. The method of measuring backward light uses a photodetector to detect, from reference light introduced from a measurement light source into the optical head, the power of an optical component that has passed through the isolator, while changing the position of the measurement light source. The laser processing method performs laser processing by using the laser processing apparatus that has the optical head in which the arrangement of optical components is adjusted beforehand on the basis of the result of detection or result of measurement.

摘要翻译： 本发明涉及一种测量向后光的方法，其被构造用于在激光加工之前检查通过包括在激光加工设备中的隔离器向后传播的向后光。 本发明还涉及一种激光加工方法等。 激光加工设备具有设置有激光光源部分，光导和隔离器的光学头。 光头具有发射光学系统，照射光学系统和聚光光学系统。 逆向光的测量方法使用光检测器，在测量光源的位置改变的同时，从测量光源引入光头的参考光检测已经通过隔离器的光学部件的功率。 激光加工方法通过使用具有基于检测结果或测量结果预先调整光学部件的布置的光头的激光加工装置进行激光加工。

公开(公告)号：US08039778B2

公开(公告)日：2011-10-18

申请号：US12256974

申请日：2008-10-23

申请人： Motoki Kakui ,  Kazuo Nakamae ,  Shinobu Tamaoki

发明人： Motoki Kakui ,  Kazuo Nakamae ,  Shinobu Tamaoki

IPC分类号： G01J1/32

CPC分类号： B23K26/03 ,  B23K26/082 ,  B23K2101/32 ,  B23K2101/36

摘要： The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.

摘要翻译： 激光加工装置本发明涉及一种激光加工装置等，其结构是同时实现在激光束难以到达的地方进行有效的激光加工，激光加工在激光加工的地方 很容易到达。 该激光加工装置包括：激光光源，在扫描激光束的同时向物体施加激光的照射光学系统;检测从照射光学系统施加的激光束的光检测器;以及控制部， 在激光光源处的激光束的连续振荡和脉冲振荡。 特别地，在从光检测器检测到从照射光学系统施加的激光束的情况下，控制部分使激光束相对于激光光源连续振荡; 而在光检测器未检测到从照射光学系统施加的激光束的情况下，激光束相对于激光光源的脉冲振荡。

公开(公告)号：US20110148002A1

公开(公告)日：2011-06-23

申请号：US13059592

申请日：2009-10-23

申请人： Motoki Kakui ,  Kazuo Nakamae ,  Shinobu Tamaoki

发明人： Motoki Kakui ,  Kazuo Nakamae ,  Shinobu Tamaoki

IPC分类号： B29C35/08

CPC分类号： H05K3/0035 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H01S3/067

摘要： The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (1), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (100), a YbDF (110), a bandpass filter (120), a YbDF (130), a bandpass filter (140), a YbDF (150), a YbDF (160), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus (1) and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.

摘要翻译： 本发明涉及在选择性地去除印刷电路板的绝缘层时采用非线性光学晶体的波长转换技术的激光加工方法等，而在整个去除处理中仅使用一个波长。 优选用于激光加工方法的激光加工装置（1）具有MOPA结构，包括种子光源（100），YbDF（110），带通滤光器（120），YbDF（130）， 带通滤波器（140），YbDF（150），YbDF（160）等。 根据本发明的激光加工方法是通过用从激光加工设备（1）输出的脉冲激光照射层压在导体层上的由树脂构成的绝缘层的激光加工方法，并使用具有 由导体层吸收的光的波长小于10％，并且将每个脉冲的注量设定为绝缘层的断裂损伤阈值或更高。

公开(公告)号：US20090277885A1

公开(公告)日：2009-11-12

申请号：US12464505

申请日：2009-05-12

申请人： Kazuo NAKAMAE ,  Motoki KAKUI ,  Shinobu TAMAOKI

发明人： Kazuo NAKAMAE ,  Motoki KAKUI ,  Shinobu TAMAOKI

IPC分类号： B23K26/04

CPC分类号： B23K26/06 ,  B23K26/082 ,  B23K2101/32 ,  B23K2101/34

摘要： The present invention relates to a laser processing apparatus having a structure for effectively processing of objects by condensing a laser beam, and a laser processing method. A laser processing apparatus comprises a common mount surface on which plural objects are disposed in an array, a light source, a lens the reflection direction of which is changeable, and a condensing direction modifier. A laser beam from the light source arrives at the lens through a galvano-mirror. Herein, the galvano-mirror is arranged such that the reflection position thereof agrees with the front focal position of the lens. As the galvano-mirror reflects a laser beam toward the lens while the reflection direction is changed, the arriving position of the laser beam is scanned on the entrance surface of the lens. The condensing direction modifier modifies, according to the irradiation position of the laser beam arrived from the lens, an exit direction of the laser beam.

摘要翻译： 本发明涉及一种激光加工装置，其具有通过冷凝激光束有效地处理物体的结构，以及激光加工方法。 一种激光加工装置，包括：多个物体配置在其上的公共安装面，光源，反射方向可变的透镜，以及聚光方向调整器。 来自光源的激光束通过电流镜到达镜头。 这里，电流镜被配置为使得其反射位置与透镜的前焦点位置一致。 当反射方向改变时，电流镜将激光束反射到透镜，激光束的到达位置在透镜的入射面上被扫描。 聚光方向调节器根据从透镜到达的激光束的照射位置修改激光束的出射方向。

公开(公告)号：US20090223943A1

公开(公告)日：2009-09-10

申请号：US12397490

申请日：2009-03-04

申请人： Shinobu TAMAOKI ,  Motoki KAKUI ,  Kazuo NAKAMAE

发明人： Shinobu TAMAOKI ,  Motoki KAKUI ,  Kazuo NAKAMAE

IPC分类号： B23K26/36

CPC分类号： B23K26/0869 ,  B23K37/0426 ,  B23K2101/32 ,  B23K2101/38 ,  Y10T29/49192

摘要： The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

摘要翻译： 本发明涉及一种激光加工方法等，其具有能够实现激光不容易达到的位置的优选处理的结构，并且有效地抑制了激光加工期间由激光容易达到的位置造成的损坏。 辐射光学器件扫描由激光光源激光照射的位置，同时将激光从与舞台垂直的方向布置在舞台上的多个物体及其周边上。 在舞台上反射构件分别设置成与多个物体相邻。 反射构件将从辐射光学器件辐射的激光反射到物体的侧表面。 由于由反射构件反射的激光被辐射到物体的侧面上，所以激光也到达激光不容易达到的物体的侧面，而不必增加激光的强度。

公开(公告)号：US20080210886A1

公开(公告)日：2008-09-04

申请号：US11878973

申请日：2007-07-30

申请人： Kazuo Nakamae ,  Motoki Kakui ,  Shinobu Tamaoki

发明人： Kazuo Nakamae ,  Motoki Kakui ,  Shinobu Tamaoki

IPC分类号： G21K5/10

CPC分类号： B23K26/03 ,  B23K26/032 ,  B23K26/046 ,  B23K26/048 ,  B23K26/0665 ,  B23K26/0861 ,  B23K26/53

摘要： The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.

摘要翻译： 本发明涉及一种激光加工方法等，其具有能够在精确地调整物体的安装状态的情况下以各种方式处理待处理物体的结构。 该方法以与处理用激光的会聚点为特定的位置关系设定的多个调整用激光照射物体，并且在监视被调节激光的照射区域的同时调整对象的安装状态 物体的表面。 调整激光的各照射方向与加工用激光的不同。 通过在对象的位置调整中反映调整激光的照射条件和照射区域的监视信息，可以根据各种处理来调整物体的安装状态。

公开(公告)号：US20080072924A1

公开(公告)日：2008-03-27

申请号：US11882168

申请日：2007-07-31

申请人： Kazuo Nakamae ,  Motoki Kakui ,  Shinobu Tamaoki

发明人： Kazuo Nakamae ,  Motoki Kakui ,  Shinobu Tamaoki

IPC分类号： B08B6/00

CPC分类号： B08B7/0042

摘要： The present invention relates to a fouling removing method which removes a fouling, comprised of a chemical compound containing carbon, on an object surface by laser light irradiation. The fouling removing method irradiates the fouling on the object surface with laser light while blowing a supporting gas on this area. This structure allows the supporting gas and a fouling material to react with each other when burning the fouling by laser irradiation, so as to generate a carbon-containing gas, and the supporting gas to blow away carbonized residues generated on the object surface. This drastically reduces the carbonized residues on the exposed surface of the object having removed the fouling.

摘要翻译： 本发明涉及一种污垢去除方法，其通过激光照射在物体表面上除去由含有碳的化合物组成的污垢。 污垢清除方法在该区域吹送支撑气体的同时用激光照射物体表面上的污垢。 这种结构允许支持气体和结垢材料在通过激光照射燃烧结垢时彼此反应，以产生含碳气体，并且支撑气体吹走在物体表面上产生的碳化残余物。 这大大减少了去除污垢的物体的暴露表面上的碳化残余物。

公开(公告)号：US09415466B2

公开(公告)日：2016-08-16

申请号：US13882928

申请日：2011-09-16

申请人： Kazuo Nakamae ,  Hiroyuki Murase ,  Katsuko Yamamoto ,  Mamoru Ono ,  Katsuyuki Tanaka ,  Toshimitsu Sakata ,  Teruhiro Enami ,  Yutaka Kobayashi

发明人： Kazuo Nakamae ,  Hiroyuki Murase ,  Katsuko Yamamoto ,  Mamoru Ono ,  Katsuyuki Tanaka ,  Toshimitsu Sakata ,  Teruhiro Enami ,  Yutaka Kobayashi

IPC分类号： B23K26/06 ,  B23K26/38 ,  B23K26/40 ,  B23D65/02 ,  B23K26/08

CPC分类号： B23K26/0648 ,  B23C2226/125 ,  B23C2226/315 ,  B23C2260/56 ,  B23D65/02 ,  B23K26/06 ,  B23K26/0613 ,  B23K26/064 ,  B23K26/0823 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  Y10T407/27

摘要： Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.

摘要翻译： 提供了一种用于制造切削工具的技术，其能够提供具有表面均匀光滑并且具有稳定性能的切割表面的切削工具。 提供一种切削工具制造方法，其中通过使用通过组合两个线性偏振激光束形成的激光束来切割切削工具材料，使得两个线性偏振激光束的偏振方向在右侧 彼此的角度; 使用圆偏振激光束作为激光束的切削工具制造方法; 使用随机偏振激光束作为激光束的切削工具制造方法; 通过制造方法制造的切削工具; 一种切削工具制造装置，包括用于产生由两个线偏振激光束形成的组合激光束的装置，两个线偏振激光束的偏振方向彼此成直角;以及光学系统，其引导组合的激光束 对刀具材料; 一种切削工具制造装置，包括用于产生圆偏振激光束的装置; 以及包括用于产生随机偏振激光束的装置的切削工具制造装置。

公开(公告)号：US20110100428A1

公开(公告)日：2011-05-05

申请号：US12992551

申请日：2009-05-13

申请人： Eisuke Sasaoka ,  Tetsuya Nakanishi ,  Kazuo Nakamae

发明人： Eisuke Sasaoka ,  Tetsuya Nakanishi ,  Kazuo Nakamae

IPC分类号： H01L31/052 ,  H01L31/0232 ,  H01J3/14 ,  F21V5/00

CPC分类号： G02B6/4298 ,  G02B6/0281

摘要： A photoelectric conversion unit in which efficiency of optical coupling and stability of mechanical coupling improve is obtained.The photoelectric conversion unit includes a light density conversion element 11 which changes at an output end face the density of light that has impinged on an incident end face and outputs the light, and a photoelectric conversion element 13. The photoelectric conversion element 13 is arranged closely to a high light-density side of the light density conversion element 11, and integrated with this light density conversion element 11. The photoelectric conversion element 13 can be a solar cell or a light emission medium. In the light density conversion element 11, it is preferable that a refractive index profile in the radial direction in a section becomes a square distribution. Further, the light density conversion element 11 uses silica glass in a base member, and by changing the addition amount of impurity added in this glass, a refractive index profile is formed.

摘要翻译： 获得光耦合效率和机械耦合稳定性提高的光电转换单元。 光电转换单元包括在输出端变化的光密度转换元件11，其面对已经入射到入射端面上的光的密度并输出光;以及光电转换元件13.光电转换元件13紧密配置 到光密度转换元件11的高光密度侧，并与该光密度转换元件11集成。光电转换元件13可以是太阳能电池或发光介质。 在光密度转换元件11中，部分中的径向折射率分布优选为平方分布。 此外，光密度转换元件11使用基底中的石英玻璃，并且通过改变添加在该玻璃中的杂质的添加量，形成折射率分布。