公开(公告)号：US08432176B2

公开(公告)日：2013-04-30

申请号：US12702347

申请日：2010-02-09

申请人： Katsuhiro Gunji ,  Toru Iwasaki ,  Takaaki Sasaki

发明人： Katsuhiro Gunji ,  Toru Iwasaki ,  Takaaki Sasaki

IPC分类号： G01R31/00

CPC分类号： G01R31/2865 ,  G01R31/2875

摘要： A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.

摘要翻译： 用于测试半导体集成电路的测试装置包括测试头，用于可拆卸地保持探测半导体器件的探针卡的探针卡保持器，用于加热探针卡的加热器和将加热器保持在与 当探头卡被探头卡夹固定时，探针卡。 测试装置有效地加热探针卡，从而减少测试时间和成本。

公开(公告)号：US20100201391A1

公开(公告)日：2010-08-12

申请号：US12702347

申请日：2010-02-09

申请人： Katsuhiro Gunji ,  Toru Iwasaki ,  Takaaki Sasaki

发明人： Katsuhiro Gunji ,  Toru Iwasaki ,  Takaaki Sasaki

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： G01R31/2865 ,  G01R31/2875

摘要： A test apparatus for testing semiconductor integrated circuits includes a test head, a probe card holder for detachably holding a probe card that probes a semiconductor device, a heater for heating the probe card, and a heater holder that holds the heater in direct contact with the probe card when the probe card is held by the probe card holder. The test apparatus heats the probe card efficiently and thereby reduces test time and cost.

摘要翻译： 用于测试半导体集成电路的测试装置包括测试头，用于可拆卸地保持探测半导体器件的探针卡的探针卡保持器，用于加热探针卡的加热器和将加热器保持在与 当探头卡被探头卡夹固定时，探针卡。 测试装置有效地加热探针卡，从而减少测试时间和成本。

公开(公告)号：US08446160B2

公开(公告)日：2013-05-21

申请号：US12697632

申请日：2010-02-01

申请人： Katsuhiro Gunji ,  Toru Iwasaki ,  Tatsurou Nagai ,  Yumi Kodama

发明人： Katsuhiro Gunji ,  Toru Iwasaki ,  Tatsurou Nagai ,  Yumi Kodama

IPC分类号： G01R31/00

CPC分类号： G01R3/00 ,  G01R1/07342 ,  G01R31/2891

摘要： An improved probe card maintenance method is capable of accurately, rapidly, and easily performing the maintenance of a probe card. The probe card is a jig adapted to test the electrical properties of semiconductor integrated circuits. The electrical properties of the semiconductor integrated circuits are tested at a predetermined test temperature. The probe card has a plurality of probes thereon. The probe card maintenance method includes heating the probe card and the probes on the probe card to the same temperature as the test temperature. The method also includes adjusting positions and postures of the defective probes while maintaining the temperature of the probe card and the probes at the test temperature.

摘要翻译： 改进的探针卡维护方法能够准确，快速并且容易地执行探针卡的维护。 探针卡是适用于测试半导体集成电路的电性能的夹具。 在预定的测试温度下测试半导体集成电路的电气特性。 探针卡在其上具有多个探针。 探针卡维护方法包括将探针卡和探头卡上的探头加热到与测试温度相同的温度。 该方法还包括调节缺陷探针的位置和姿势，同时将探针卡和探针的温度保持在测试温度。

公开(公告)号：US20100196136A1

公开(公告)日：2010-08-05

申请号：US12697632

申请日：2010-02-01

申请人： Katsuhiro Gunji ,  Toru Iwasaki ,  Tatsurou Nagai ,  Yumi Kodama

发明人： Katsuhiro Gunji ,  Toru Iwasaki ,  Tatsurou Nagai ,  Yumi Kodama

IPC分类号： H01L21/677 ,  B08B7/00 ,  H01L21/68

CPC分类号： G01R3/00 ,  G01R1/07342 ,  G01R31/2891

摘要： An improved probe card maintenance method is capable of accurately, rapidly, and easily performing the maintenance of a probe card. The probe card is a jig adapted to test the electrical properties of semiconductor integrated circuits. The electrical properties of the semiconductor integrated circuits are tested at a predetermined test temperature. The probe card has a plurality of probes thereon. The probe card maintenance method includes heating the probe card and the probes on the probe card to the same temperature as the test temperature. The method also includes adjusting positions and postures of the defective probes while maintaining the temperature of the probe card and the probes at the test temperature.

摘要翻译： 改进的探针卡维护方法能够准确，快速并且容易地执行探针卡的维护。 探针卡是适用于测试半导体集成电路的电性能的夹具。 在预定的测试温度下测试半导体集成电路的电气特性。 探针卡在其上具有多个探针。 探针卡维护方法包括将探针卡和探头卡上的探头加热到与测试温度相同的温度。 该方法还包括调节缺陷探针的位置和姿势，同时将探针卡和探针的温度保持在测试温度。