Metal core package substrate and method for manufacturing the same
    1.
    发明申请
    Metal core package substrate and method for manufacturing the same 审中-公开
    金属芯封装基板及其制造方法

    公开(公告)号:US20090288293A1

    公开(公告)日:2009-11-26

    申请号:US12232995

    申请日:2008-09-26

    IPC分类号: H01R43/16

    摘要: A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.

    摘要翻译: 金属芯封装基板及其制造方法。 金属芯封装基板的制造方法可以包括:在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处,使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层,允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

    SYSTEM AND METHOD FOR PROVIDING BIDDING SERVICE
    3.
    发明申请
    SYSTEM AND METHOD FOR PROVIDING BIDDING SERVICE 审中-公开
    提供投标服务的系统和方法

    公开(公告)号:US20150242945A1

    公开(公告)日:2015-08-27

    申请号:US14632784

    申请日:2015-02-26

    IPC分类号: G06Q30/08 G06Q30/06

    CPC分类号: G06Q30/08 G06Q30/0611

    摘要: The present invention disclosed herein relates to a system and method for providing a bidding service. A bidding service providing system according to an embodiment of the present invention may include a bidding condition determination unit configured to determine a maximum number of bidders and a bidding price on a basis of an equivalent value of a bid subject, a successful bidder selection unit configured to select a predetermined number of successful bidders from among bidders, and a repayment processing unit configured to set a credit-debt relation between the successful bidders and failed bidders and perform a process for repayment of debt to the failed bidders by the successful bidders.

    摘要翻译: 本文公开的本发明涉及一种用于提供投标服务的系统和方法。 根据本发明的实施例的投标服务提供系统可以包括投标条件确定单元,其被配置为基于投标对象的等效值来确定投标者的最大数量和投标价格,成功投标者选择单元配置 从投标人中选择预定数量的成功投标者,以及偿还处理单元,其被配置为设置成功的投标者和失败的投标者之间的信用债务关系,并且由成功的投标者执行偿还对失败的投标者的债务的处理。