Abstract:
The present invention pertains to a device and a method for measuring a via hole of a silicon wafer, wherein it is possible to precisely measure the depth of the via hole without damaging the wafer. Broadband infrared light is radiated to a silicon wafer which has a superior light transmission property, so that the depth of the via hole may be measured from the light which is reflected from each boundary surface of the wafer and the interference signal of reference light. The via hole measuring device according to the present invention includes: a light source unit for generating broadband infrared light; and an interferometer for radiating the light generated from the light source unit to a silicon wafer, so as to measure the depth of a via hole formed on the wafer according to the spectrum period of the interference signal of the light, which is reflected from the silicon wafer.
Abstract:
Disclosed herein is a laptop-size high-order harmonic generation apparatus using near field enhancement. The laptop-size high-order harmonic generation apparatus using near field enhancement includes a femtosecond laser generator, light transfer means for transferring light output from the femtosecond laser generator, micro patterns formed of metallic thin films and configured to have nano-sized apertures for generating near field enhancement when the light output from the light transfer means passes through the micro patterns, a gas supply unit for supplying inert gas to the light when the light transferred through the light transfer means passes through the micro patterns, and a vacuum chamber for accommodating the micro patterns and the gas supply unit under a vacuum atmosphere.
Abstract:
Disclosed herein is a laptop-size high-order harmonic generation apparatus using near field enhancement. The laptop-size high-order harmonic generation apparatus using near field enhancement includes a femtosecond laser generator, light transfer means for transferring light output from the femtosecond laser generator, micro patterns formed of metallic thin films and configured to have nano-sized apertures for generating near field enhancement when the light output from the light transfer means passes through the micro patterns, a gas supply unit for supplying inert gas to the light when the light transferred through the light transfer means passes through the micro patterns, and a vacuum chamber for accommodating the micro patterns and the gas supply unit under a vacuum atmosphere.
Abstract:
The present invention pertains to a device and a method for measuring a via hole of a silicon wafer, wherein it is possible to precisely measure the depth of the via hole without damaging the wafer. Broadband infrared light is radiated to a silicon wafer which has a superior light transmission property, so that the depth of the via hole may be measured from the light which is reflected from each boundary surface of the wafer and the interference signal of reference light. The via hole measuring device according to the present invention includes: a light source unit for generating broadband infrared light; and an interferometer for radiating the light generated from the light source unit to a silicon wafer, so as to measure the depth of a via hole formed on the wafer according to the spectrum period of the interference signal of the light, which is reflected from the silicon wafer.