摘要:
A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.
摘要:
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要:
An electronic device is disclosed. The electronic device includes a first sub assembly having a first housing component. The first housing component has an opening. The electronic device also includes a second sub assembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is accessible through the opening. The at least one internal component is also movable relative to the second sub assembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.
摘要:
An electronic device is disclosed. The electronic device includes a first subassembly having a first housing component. The first housing component has an opening. The electronic device also includes a second subassembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is also movable relative to the second subassembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.
摘要:
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要:
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
摘要:
An electrical plug and receptacle relying on magnetic force to maintain contact are disclosed. The plug and receptacle can be used as part of a power adapter for connecting an electronic device, such as a laptop computer, to a power supply. The plug includes electrical contacts, which are preferably biased toward corresponding contacts on the receptacle. The plug and receptacle each have a magnetic element. The magnetic element on one or both of the plug and receptacle can be a magnet, which is preferably a permanent rare earth magnet although electromagnets may also be used. The magnetic element on the plug or receptacle that does not include a magnet is composed of ferromagnetic material. When the plug and receptacle are brought into proximity, the magnetic attraction between the magnet and its complement, whether another magnet or a ferromagnetic material, maintains the contacts in an electrically conductive relationship.
摘要:
A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim.
摘要:
A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim.